LFBGA183 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA183 package SOT825-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline LFBGA183: plastic low profile fine-pitch ball grid array package; 183 balls; body 10 x 10 x 1.05 mm D B SOT844-1 A ball A1 index area E A A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C P N M L e K J H e2 G 1/2 e F E D C B A ball A1

Contextual Info: Package outline LFBGA183: plastic low profile fine-pitch ball grid array package; 183 balls; body 10 x 10 x 0.9 mm D B SOT844-2 A ball A1 index area E A2 A A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C P N M L e K J H e2 G 1/2 e F E D C B A ball A1

Contextual Info: Package outline LFBGA183: plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm SOT825-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e b y y1 C ∅v M C A B ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1

MO-205

Abstract: sot825
Contextual Info: PDF: 2003 Jul 15 Philips Semiconductors Package outline LFBGA183: plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm SOT825-1 A B D ball A1 index area E A A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M y y1 C C A B C P N

8.45

Abstract: sot844
Contextual Info: PDF: 2004 Jan 15 Philips Semiconductors Package outline LFBGA183: plastic low profile fine-pitch ball grid array package; 183 balls; body 10 x 10 x 1.05 mm D B SOT844-1 A ball A1 index area E A A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M y1 C C A B C y P N

om6357

Abstract: bgy502 nexperia OM6357-7 UAA3537 14585 datasheet ARM7 interface with gsm module 14585 BGY288 UBA2008
Contextual Info: Nexperia System Solution 5110 / 5120 Multimedia-enabled cellular system solution for GSM/GPRS mobile handsets These market-proven, ARM7-based GSM/GPRS platforms bring multimedia options with industry-leading power consumption to the basic, entry-level phone market.