SOT825 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA183 package SOT825-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline LFBGA183: plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm SOT825-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e b y y1 C ∅v M C A B ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1

MO-205

Abstract: sot825
Contextual Info: PDF: 2003 Jul 15 Philips Semiconductors Package outline LFBGA183: plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm SOT825-1 A B D ball A1 index area E A A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M y y1 C C A B C P N