HPND0002 Search Results

Contextual Info: • 4 M M 7 5 Ô 4 G D O T b ñ ? OTO ■ H P A HEWLETT-PACKARD/ CMPNTS blE D m HEW LETT PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 Features • Thermocompression/ Thermosonically Bondable

Contextual Info: Wljm SMALL SIGNAL RF PIN DIODE CHIPS FOR HYBRID INTEGRATED CIRCUITS HEW LETT PACKARD wLEM HPND-0001 HPND-0002 HPND-0003 T E C H N IC A L DATA M ARCH 1988 Features THERMOCOMPRESSION/THERMOSONICALLY BON DAB LE IDEAL FOR HYBRID INTEGRATED CIRCUITS GOLD METALLIZATION

integrated circuits equivalents list

Abstract: digital phase shifters HPND-0002 hydrofluoric acid HPND0002 HSMP3810 5965-9143E eutectic
Contextual Info: HPND-0002 Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Data Sheet Description Features These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression bonding techniques. The top metallization

ku-band pll lnb

Abstract: MGA-68563 mga-62563 MMIC SOT 363 HP 5082-3081 ATF-36077 5Ghz lna transistor datasheet schottky diode 3 lead ATF-511P8 power fet 70 mil micro-X Package
Contextual Info: Semiconductor Wireless Applications and Selection Guides System Block Diagrams and Product Suggestions System Block Diagrams and Suggested Products 3 Wireless Infrastructure 3 • Basestation Radiocard 5 • Basestation Low Noise Amplifier LNA 5 • Basestation Tower Mounted Amplifier (TMA)

Contextual Info: W ß%H EW L E T T 1“KM PA CK A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ ThermosonicaUy Bondable These PIN/NIP diode chips are specifically designed for hybrid

HPND0003

Abstract: HPND-0003
Contextual Info: W fipi H E W LE T T mL'HM P A C K A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 F eatures • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization

HRMA-0470B

Abstract: Semicon volume 1 HPMA-2085 HP 33002A AVANTEK ATF26884 SJ 2036 HPMA-0470TXV HPMA-0485 HPMA-0370 DIODE GOC 61
Contextual Info: Whal HEWLETT \HrJk PACKARD Communications Components Designer’s Catalog, GaAs and Silicon Products A Brief Sketch Hewlett-Packard is one of the world’s leading designers and manufacturers of RF and microwave semiconductors, optoelectronic, and fiber optic

Contextual Info: PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, which make each more suitable for a particular application. For switching, attenuating, and other general purpose applications particularly in the VHF/UHF range,

IAM-81008

Abstract: 5082-2830 HSMP-3895 5082-3043 ina-02170 INA-01170 30533 5082-0012 5082-2970 HSMP 2800
Contextual Info: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101

ISDB-t modulator

Abstract: ku-band pll lnb HP 5082-3081 MMIC SOT 363 power fet 70 mil micro-X Package VCO 9GHZ 10GHZ MGA-30116 mga-62563 mga 51563 MGA-30316
Contextual Info: Semiconductor Wireless Applications and Selection Guides System Block Diagrams and Product Suggestions System Block Diagrams and Suggested Products 3 Wireless Infrastructure 3 • Basestation Radiocard 5 • Basestation Low Noise Amplifier LNA 5 • Basestation Tower Mounted Amplifier (TMA)

HSMP3811

Abstract: sot-23 MARKING CODE G1 HSMP3821 HSMP-3801 HSMP3831 HSMP3881 HSMP-3811 hsmp-3831 hsmp3801 HSMP-3881
Contextual Info: Surface Mount PIN Diodes Available Configurations SOT-23 DIE APPLICATION GUSS SINGLE SINGLE SERIES COMMON ANODE b R B / o HPNWXJ01 HPND-0002 HPND-0003 5082-0012 tr 'a S' X - ll XX ht-ir là ' COMMON CATHODE LOW LOW INDUCTANCE INDUCTANCE B a Il XX '- á -Ir 1

5082-3077

Abstract: 1N5767 2101 5082-3081 glass 1N5719 HPND-0001 HPND-0002 5082-3039 5082-3188
Contextual Info: RF Non-Surface Mount PIN Diodes Glass Axial Lead, Beam Lead, Chip, Stripline Part Number CT Max. pF 5082-3001 5082-3039 1N5719 5082-3077 5082-3188 5082-3080 1N5767 5082-3379 5082-3081 HPND-0001 HPND-0002 0.25 0.25 0.3 0.3 1 0.4 0.4 0.4 0.4 0.2 0.2 RS Max.

5082-2830

Abstract: IAM-81008 HSMP-3895 hsms-2850 5082-0012 8205 datasheet hsms-285b HSMS-285C HSMS-2862 MSA-0870
Contextual Info: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101

LNA ku-band

Abstract: ku-band pll lnb AT-64020 microwave transmitter 10GHz MGA-725M4 micro-X ceramic Package lna fet gaas fet 70 mil micro-X Package HSMS-2850 HSCH-9401 900-1700MHz
Contextual Info: Semiconductor Wireless Applications and Selection Guides System Block Diagrams and Product Suggestions Wireless Infrastructure 2 Basestation Radiocard 2 Basestation Low Noise Amplifier LNA 3 Basestation Tower Mounted Amplifier (TMA) 3 Basestation Multi-carrier Power Amplifier (MCPA)

HSMP-38xx

Abstract: diode hsmp 382 HPND-0002
Contextual Info: Surface Mount PIN Diodes Reliability Data HPND-00XX HSMP-38XA HSMP-38XX HSMP-48XX latest revision of MIL-STD-750. Data was gathered from the product qualification, reliability monitor, and engineering evaluation. Description The following cumulative test results have been obtained from

hydrofluoric acid

Abstract: HPND0001 HPND-0001 HPND-0002 thermocompression
Contextual Info: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression

5082-3043

Abstract: diode 5082-3080 HPND-4038 5082-0012 diode 5082-3042 HPND-4018 1N5719 1N5767 HPND-0001 HPND-0002
Contextual Info: PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, which make each more suitable for a particular application. For switching, attenuating, and other general purpose applications particularly in the VHF/UHF range,

hydrofluoric acid

Abstract: thermocompression HPND0001 HPND-0001 HPND-0002
Contextual Info: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression

HSCH-5337

Abstract: HSMS-2850 5082-3188 HSMP-3804 ifd 0512 5082-2970 5082-2800 SERIES DATASHEET 5082-2830 AT-41470 HSCH-9301
Contextual Info: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101

hp 3080 diode

Contextual Info: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression

hsmp-3800

Abstract: HPND-0003
Contextual Info: Whp% mL'EM HEWLETT PACKARD Surface Mount PIN Diodes R eliability D ata The following cumulative test results have been obtained from testing performed at HewlettPackard Communications Com­ ponents Division in accordance with the latest revision of MIL- HPND-OOOX Series

1N5767

Contextual Info: Wha% HEW LETT mitíM P A C K A R D PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, w hich make each more suitable for a particular application. For switching, attenuating, and other general purpose applications

AT-41486

Abstract: 8060 IAM MSA-1105 VTO-8000 HSMP-3895 HSCH-5337 ATF-46171 HSMS-2804 HSCH-5313 HSMS-2862
Contextual Info: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101