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130-3162-11D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, Nickel Sulfamate. |
PDF
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54121-103031600LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch. |
PDF
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130-3162-11H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, APP. |
PDF
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10145030-316KLF
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Amphenol Communications Solutions
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Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 16 Position,side to side double row,Top latch
(For product qualification latest status, please submit Product Enquiry) |
PDF
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10131930-316ULF
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Amphenol Communications Solutions
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Minitek®, Board to Board, Receptacle, Through Mount, Single row, 16 Positions, 2mm (0.079inch), horizontal. |
PDF
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