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    HPND0001 Search Results

    HPND0001 Datasheets (3)

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    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    HPND-0001
    Agilent Technologies Chip PIN diodes for hybrid assemblies Original PDF 27.84KB 2
    HPND-0001
    Avago Technologies Chip PIN diodes for hybrid assemblies Original PDF 59.22KB 2
    HPND0001
    Unknown Historical semiconductor price guide (US$ - 1998). From our catalog scanning project. Historical PDF 44.47KB 1

    HPND0001 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: • 4 M M 7 5 Ô 4 G D O T b ñ ? OTO ■ H P A HEWLETT-PACKARD/ CMPNTS blE D m HEW LETT PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 Features • Thermocompression/ Thermosonically Bondable


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    hpnd-0001hpnd-0002hpnd-0003hpnd000x PDF

    Contextual Info: Wljm SMALL SIGNAL RF PIN DIODE CHIPS FOR HYBRID INTEGRATED CIRCUITS HEW LETT PACKARD wLEM HPND-0001 HPND-0002 HPND-0003 T E C H N IC A L DATA M ARCH 1988 Features THERMOCOMPRESSION/THERMOSONICALLY BON DAB LE IDEAL FOR HYBRID INTEGRATED CIRCUITS GOLD METALLIZATION


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    hpnd-0001hpnd-0002hpnd-0003 PDF

    Contextual Info: W ß%H EW L E T T 1“KM PA CK A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ ThermosonicaUy Bondable These PIN/NIP diode chips are specifically designed for hybrid


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    hpnd-0001hpnd-0002hpnd-000x PDF

    HPND0003

    Abstract: HPND-0003
    Contextual Info: W fipi H E W LE T T mL'HM P A C K A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 F eatures • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization


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    hpnd-0001hpnd-0002hpnd-0003hpnd000x+1hpnd0003 PDF

    HRMA-0470B

    Abstract: Semicon volume 1 HPMA-2085 HP 33002A AVANTEK ATF26884 SJ 2036 HPMA-0470TXV HPMA-0485 HPMA-0370 DIODE GOC 61
    Contextual Info: Whal HEWLETT \HrJk PACKARD Communications Components Designer’s Catalog, GaAs and Silicon Products A Brief Sketch Hewlett-Packard is one of the world’s leading designers and manufacturers of RF and microwave semiconductors, optoelectronic, and fiber optic


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    e-28230s-164ch-8902hrma-0470b+9semicon volume 1hpma-2085hp 33002aavantek atf26884sj 2036hpma-0470txvhpma-0485hpma-0370diode goc 61 PDF

    Contextual Info: PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, which make each more suitable for a particular application. For switching, attenuating, and other general purpose applications particularly in the VHF/UHF range,


    Original
    ot-23hpnd-4005hpnd-4028hpnd-4038 PDF

    IAM-81008

    Abstract: 5082-2830 HSMP-3895 5082-3043 ina-02170 INA-01170 30533 5082-0012 5082-2970 HSMP 2800
    Contextual Info: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101


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    1n57111n57121n57191n5767+16msa-1023msa-1100msa-1104msa-1105msa-1110vto-9068iam-810085082-2830hsmp-38955082-3043ina-02170ina-01170305335082-00125082-2970hsmp 2800 PDF

    HSMP3811

    Abstract: sot-23 MARKING CODE G1 HSMP3821 HSMP-3801 HSMP3831 HSMP3881 HSMP-3811 hsmp-3831 hsmp3801 HSMP-3881
    Contextual Info: Surface Mount PIN Diodes Available Configurations SOT-23 DIE APPLICATION GUSS SINGLE SINGLE SERIES COMMON ANODE b R B / o HPNWXJ01 HPND-0002 HPND-0003 5082-0012 tr 'a S' X - ll XX ht-ir là ' COMMON CATHODE LOW LOW INDUCTANCE INDUCTANCE B a Il XX '- á -Ir 1


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    ot-23hpnwxj01hsmp-3802hsmp-3812+14hsmp-3800hsmp-3801hsmp-3810hsmp-3811hsmp-3820hsmp-3821hsmp3811sot-23 marking code g1hsmp3821hsmp3831hsmp3881hsmp-3831hsmp3801hsmp-3881 PDF

    5082-3077

    Abstract: 1N5767 2101 5082-3081 glass 1N5719 HPND-0001 HPND-0002 5082-3039 5082-3188
    Contextual Info: RF Non-Surface Mount PIN Diodes Glass Axial Lead, Beam Lead, Chip, Stripline Part Number CT Max. pF 5082-3001 5082-3039 1N5719 5082-3077 5082-3188 5082-3080 1N5767 5082-3379 5082-3081 HPND-0001 HPND-0002 0.25 0.25 0.3 0.3 1 0.4 0.4 0.4 0.4 0.2 0.2 RS Max.


    Original
    1n57191n5767hpnd-0001hpnd-0002+65082-307721015082-3081glass5082-30395082-3188 PDF

    5082-2830

    Abstract: IAM-81008 HSMP-3895 hsms-2850 5082-0012 8205 datasheet hsms-285b HSMS-285C HSMS-2862 MSA-0870
    Contextual Info: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101


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    1n57111n57121n57191n5767+16msa-1023msa-1100msa-1104msa-1105msa-1110vto-90685082-2830iam-81008hsmp-3895hsms-28505082-00128205 datasheethsms-285bhsms-285chsms-2862msa-0870 PDF

    cp4071

    Abstract: data sheet IC 7408 2N4891 IC 7408 MDA970A2 MDA2500 1854-0071 MDA2502 2N4342 IC TTL 7400
    Contextual Info: Transistor - Diode Cross Reference - H.P. Part Numbers to JEDEC Numbers Part Num. 1820-0225 1820-0240 1820-0352 1820-1804 1821-0001 1821-0002 1821-0006 1850-0062 1850-0064 1850-0075 1850-0076 1850-0093 1850-0099 1850-0126 1850-0137 1850-0150 1850-0151 1850-0154


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    68b09sn74als04bnsn74als08nsn74als00an+16ca3046ua733lm311plm318ca309478h05cp4071data sheet ic 74082n4891ic 7408mda970a2mda25001854-0071mda25022n4342ic ttl 7400 PDF

    Contextual Info: What H E W L E T T * mLliM PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features D escription • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization


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    hpnd-0001hpnd-0002hpnd-000x PDF

    hydrofluoric acid

    Abstract: HPND0001 HPND-0001 HPND-0002 thermocompression
    Contextual Info: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression


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    hpnd-0001hpnd-0002hpnd-000xhydrofluoric acid+2hpnd0001thermocompression PDF

    5082-3043

    Abstract: diode 5082-3080 HPND-4038 5082-0012 diode 5082-3042 HPND-4018 1N5719 1N5767 HPND-0001 HPND-0002
    Contextual Info: PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, which make each more suitable for a particular application. For switching, attenuating, and other general purpose applications particularly in the VHF/UHF range,


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    ot-235082-3043diode 5082-3080hpnd-4038+75082-0012diode 5082-3042hpnd-40181n57191n5767hpnd-0001hpnd-0002 PDF

    HSCH-5337

    Abstract: HSMS-2850 5082-3188 HSMP-3804 ifd 0512 5082-2970 5082-2800 SERIES DATASHEET 5082-2830 AT-41470 HSCH-9301
    Contextual Info: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101


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    1n57111n57121n57191n5767+16msa-1023msa-1100msa-1104msa-1105msa-1110vto-9068hsch-5337hsms-28505082-3188hsmp-3804ifd 05125082-29705082-2800 series datasheet5082-2830at-41470hsch-9301 PDF

    c5088 transistor

    Abstract: transistor C3207 TLO84CN sec c5088 IN5355B D2817A C3207 transistor toshiba f630 TLO81CP MC74HC533N
    Contextual Info: Transistor - Diode Cross Reference - H.P. Part Numbers to JEDEC Numbers Part Num. 1820-0225 1820-0240 1820-0352 1820-1804 1821-0001 1821-0002 1821-0006 1850-0062 1850-0064 1850-0075 1850-0076 1850-0093 1850-0099 1850-0126 1850-0137 1850-0150 1850-0151 1850-0154


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    1853impattc5088 transistortransistor c3207tlo84cn+7sec c5088in5355bd2817ac3207 transistortoshiba f630tlo81cpmc74hc533n PDF

    hp 3080 diode

    Contextual Info: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression


    Original
    hpnd-0001hpnd-0002hpnd-000x5965-9143e+1hp 3080 diode PDF

    hsmp-3800

    Abstract: HPND-0003
    Contextual Info: Whp% mL'EM HEWLETT PACKARD Surface Mount PIN Diodes R eliability D ata The following cumulative test results have been obtained from testing performed at HewlettPackard Communications Com­ ponents Division in accordance with the latest revision of MIL- HPND-OOOX Series


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    hsmp-3800hsmp-3810hsmp-3820hsmp-3830+5std-750mil-std-750mil-std-202dod-hdbk-1686ahpnd-0003 PDF

    1N5767

    Contextual Info: Wha% HEW LETT mitíM P A C K A R D PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, w hich make each more suitable for a particular application. For switching, attenuating, and other general purpose applications


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    ot-23400p11n5767 PDF

    AT-41486

    Abstract: 8060 IAM MSA-1105 VTO-8000 HSMP-3895 HSCH-5337 ATF-46171 HSMS-2804 HSCH-5313 HSMS-2862
    Contextual Info: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101


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    1n57111n57121n57191n5767+15msa-1023msa-1100msa-1104msa-1105msa-1110vto-9068at-414868060 iamvto-8000hsmp-3895hsch-5337atf-46171hsms-2804hsch-5313hsms-2862 PDF