HP16091A Search Results

HP16091A

Abstract: HP16092 LMCI1005-R10 HP16092A LMCI1005-39N VP-2811 HP16193A LMCI0201-3N9
Contextual Info: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T

Contextual Info: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T

VP-2811A

Contextual Info: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T

N 250

Abstract: 2811A LMCI2012-FR47
Contextual Info: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.2 nano Henry’s. • Suitable for high frequency applications. • Monolithic structure. • Excellent solderability for either flow or reflow soldering. Dimensions Polarity marking

HP8753A

Abstract: HP-8753A capacitor 681 signal path designer
Contextual Info: Cal-Chip Electronics, Incorporated CHQ SERIES Surface Mount Chip Capacitors: Ultra High Frequency High Frequency Measurement and Performance of High ‘Q’ Multilayer Ceramic Capacitors INTRODUCTION Capacitors used in High Frequency applications are generally

Contextual Info: Miniature RF Chip Inductors Features • High Q values. • High SRF. • Wide inductance range, 1nH to 3.3 µH • Excellent solderability and resistance to soldering heat suitable for flow or reflow soldering. • High reliability and high speed surface mount assembly.

Contextual Info: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.2 nano Henry’s. • Suitable for high frequency applications. • Monolithic structure. • Excellent solderability for either flow or reflow soldering. Dimensions Unit: mm inch

GRM230Y5V475Z16

Abstract: GR42-6 hr r 681k- 1kv GR40 MURATA HR R 221k 2kv GR42-2 grh110 GHM1540 GHM2143 B 473 M AC250 PT GHM3145
Contextual Info: This is the PDF file of catalog No.C02E-5. No.C02E5.pdf 99.8.13 Chip Monolithic Ceramic Capacitor CHIP MONOLITHIC CERAMIC CAPACITOR Murata Manufacturing Co., Ltd. Cat.No.C02E-5 This is the PDF file of catalog No.C02E-5. No.C02E5.pdf 99.8.13 Chip Monolithic Ceramic Capacitor

HP16091A

Abstract: Metalized
Contextual Info: Miniature RF Chip Inductors Features • High Q values • High SRF • Wide inductance range, 1nH to 47µH •E  xcellent solderability and resistance to soldering heat suitable for flow or reflow soldering • High reliability and high speed surface mount assembly

Contextual Info: Miniature RF Chip Inductors Features • High Q values • High SRF • Wide inductance range, 1nH to 47µH •E  xcellent solderability and resistance to soldering heat suitable for flow or reflow soldering • High reliability and high speed surface mount assembly

Contextual Info: Miniature RF Chip Inductors Features • High Q values • High SRF • Wide inductance range, 1nH to 47µH •E  xcellent solderability and resistance to soldering heat suitable for flow or reflow soldering • High reliability and high speed surface mount assembly

MLF3216

Abstract: MLCC R040 NTC thermistor 5k ohm FBM0805 MLF1005 330m 400v MLF1206 c1206x7r160 thr mgp 10k CR0402-16w
Contextual Info: Our Mission Venkel’s mission is to be a leading supplier of surface mount components by utilizing a team of highly motivated people dedicated to exceeding customer expectations through superior quality, price, service and innovation with integrity. 5900 Shepherd Mountain Cove • Austin, TX 78730

HP16091A

Abstract: HP4191A HP16192A A95E VP-2811A
Contextual Info: TYPE M uttU ayer C h ip In d u c to rs 50 LL2012-F m LL1608-FH LL1005-FH S e rie s m m m TAPING SPECIFICATIONS/' x —fcf> 1 Chip's placing Chip Inductors are packed into 8mm width, 4 or 2mm pitch plastic or paper tape and enclosed with cover tape. (2) Carriage hole position

HP16091A

Abstract: HP4291A HP16092A Tape and Reel Packaging Specifications panasonic VP-2811A vp2811a
Contextual Info: Packaging & Testing Taping Specifications 1 Chip Placement Chips are packed in 8mm, 4mm, or 2mm pitch plastic tape and enclosed by a cover tape. (2) Carriage hole positions Carriage hole position is on the right side of the tape when the sealing tape is on top.

Contextual Info: Features ^ Low inductance — down to 1.2 nano Henry’s. « Suitable for high frequency applications. Monolithic structure. » Excellent solderability for either flow or reflow soldering. Dimensions Unit: mm inch TYPE L W T a LMCI 1608 (0603) 1.6 ± 0.15

R10-J

Contextual Info: Miniature RF Chip Inductors Features • High Q values. • High SRF. • Wide inductance range, 1nH to 3.3 µH • Excellent solderability and resistance to soldering heat suitable for flow or reflow soldering. • High reliability and high speed surface mount assembly.

Contextual Info: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.2 nano Henry’s. • Suitable for high frequency applications. • Monolithic structure. • Excellent solderability for either flow or reflow soldering. Dimensions Unit: mm inch

HP4291A HP16092A

Contextual Info: Miniature RF Chip Inductors Features • High Q values. • High SRF. • Wide inductance range, 1nH to 3.3 µH • Excellent solderability and resistance to soldering heat suitable for flow or reflow soldering. • High reliability and high speed surface mount assembly.

VP-2811A

Contextual Info: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T

LMCI1005-39N

Abstract: LMCI1005-8N2
Contextual Info: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T

b 803 a

Abstract: GHM3045 GHM3145 GRM40CH GRM40 GRH110 GRM40B103K GRM40-T0 GRM42-6 5150JIS
Contextual Info: このカタログはNo.C02-6をムラタのwebサイトよりPDF形式でダウンロードしたものです。 C02J6.pdf 00.1.26 チップ積層セラミックコンデンサ CHIP MONOLITHIC CERAMIC CAPACITOR Cat.No.C02-6 このカタログはNo.C02-6をムラタのwebサイトよりPDF形式でダウンロードしたものです。

GR42-6

Abstract: 2j 103k GR43-2 GHM3145 GHM3045 rr 102k 2kv rr 681k- 1kv capacitor GRM42-6 rr 471k 1kv GRM40B103K
Contextual Info: This is the PDF file of catalog No.C02E-4. No.C02E4.pdf 98.8.21 Chip Monolithic Ceramic Capacitor CHIP MONOLITHIC CERAMIC CAPACITOR Murata Manufacturing Co., Ltd. Cat.No.C02E-4 This is the PDF file of catalog No.C02E-4. No.C02E4.pdf 98.8.21 Chip Monolithic Ceramic Capacitor

HP8753A

Abstract: HP-8753A 16091A HP-85046A HP16091A 0R68 CAP 10nF 200V 0603 signal path designer
Contextual Info: Cal-Chip Electronics, Incorporated CHQ SERIES Surface Mount Chip Capacitors: Ultra High Frequency High Frequency Measurement and Performance of High ‘Q’ Multilayer Ceramic Capacitors Introduction Capacitors used in High Frequency applications are generally

4N7k 250

Contextual Info: Low Value Multilayer Chip Inductors Features • Low inductance — down to 1.0 nH • Suitable for high frequency applications • Monolithic structure • Excellent solderability for either flow or reflow soldering Unit: mm inch Dimensions SERIES W L T