|
10114828-11104LF
|
|
Amphenol Communications Solutions
|
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 4 Positions |
PDF
|
|
|
54112-811502400LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
86094328115758E1LF
|
|
Amphenol Communications Solutions
|
DIN Straight Receptacle Wire Wrap Solder Style C 32 ways, Class II, Tail Length: 13.1mm |
PDF
|
|
|
10114828-11112LF
|
|
Amphenol Communications Solutions
|
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 12 Positions |
PDF
|
|
|
54112-811401800LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
