MLF3216
Abstract: MLF3216 1R0 MLF3216-5R6 MLF3216-4R7 MLF1005-3N3 MLF3216-1R0
Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield Perfect for high density installation • Unified automatic chip mounting shape with no directionality • Excellent solderability and high resistance for either flow
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spw 080
Abstract: LEM3225 CL-2M2012-900JT TKS 0603 FBM3216HS800-T ACB2012M-150-T LAL04TB 494LYF FBM2125HS420-T m5258
Contextual Info: CT Technologies - Cross Reference Competitor Part CTC Part 0402R CT0402CSF 0402CS-P CT0402CSF 0402CS L CT0402CSF 0402CS CT0402CSF 0402 CT0402CSF 555-0402 CT0402CSF PE-0402CD CT0402CSF 0402AS CT0402CSF ELJNK CT0402CSF GLZG CT0402CSF KQ0402 CT0402CSF KQT0402L
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MLF3216
Abstract: MLF2012 MLF1608 MLF3216-3R9 MLF3216-R68T
Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield Perfect for high density installation • Unified automatic chip mounting shape with no directionality • Excellent solderability and high resistance for either flow
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MLF1206
Abstract: MLF1608DR56K MLF3216A1R0K MLF1608D-R18K MLF2012E120K MLF1608D-R68K MLF3216DR27K MLF3216A3R9K MLF3216 MLF1608A1
Contextual Info: INDUCTORS Multilayer Chip MLF SERIES - Shielded Inductor TDK’s MLF Multilayer Chip Inductor combines high performance with the most compact design available today. MLF Inductor’s multilayer technology utilizes ferrite paste and electric conductor paste layered in a monolithic structure. Sintering o f ferrite and electric conductors
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MLF3216
Abstract: LF1608
Contextual Info: Features No crosstalk between inductors due to magnetic shield. Perfect for high density installation. Unified automatic chip mounting shape with no directionality. Excellent solderability and high resistance for either flow or reflow soldering. Monolithic structure for high reliability.
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Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield Perfect for high density installation • Unified automatic chip mounting shape with no directionality • Excellent solderability and high resistance for either flow
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MLF3216
Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield. Perfect for high density installation. • Unified automatic chip mounting shape with no directionality. • Excellent solderability and high resistance for either flow
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MLF3216
Abstract: MLCC R040 NTC thermistor 5k ohm FBM0805 MLF1005 330m 400v MLF1206 c1206x7r160 thr mgp 10k CR0402-16w
Contextual Info: Our Mission Venkel’s mission is to be a leading supplier of surface mount components by utilizing a team of highly motivated people dedicated to exceeding customer expectations through superior quality, price, service and innovation with integrity. 5900 Shepherd Mountain Cove • Austin, TX 78730
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c1206c0g500-333jnec1206c0g500-473jnec1206c0g500-563jnec1206c0g500-683jne+12c1206c0g500-823jnec1206c0g250-104jnemlf3216mlcc r040ntc thermistor 5k ohmfbm0805mlf1005330m 400vmlf1206c1206x7r160thr mgp 10kcr0402-16w
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MLF3216
Abstract: MLF3216-4R7 MLF1608-220
Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield. Perfect for high density installation. • Unified automatic chip mounting shape with no directionality. • Excellent solderability and high resistance for either flow
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CR0402-16W
Abstract: CR1210-4W
Contextual Info: Surface Mount Engineering Kits Chip Resistors Series CR0402-16W CR0402-16W CR0603-16W CR0603-16W CR0805-10W CR0805-10W CR1206-8W CR1206-8W CR1210-4W CR2010-2W Size 0402 0402 0603 0603 0805 0805 1206 1206 1210 2010 Power Rating 0.063W 0.063W 0.063W 0.063W 0.100W
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Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield Perfect for high density installation • Unified automatic chip mounting shape with no directionality • Excellent solderability and high resistance for either flow
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MLF3216A4R7K
Abstract: MLF1608DR15K MLF1206-R68K
Contextual Info: INDUCTORS Multilayer Chip MLF SERIES - Shielded Inductor TDK’s MLF Multilayer Chip Inductor combines high performance witb tbe most compact design available today. MLF Inductor’s multilayer technology utilizes ferrite paste and electric conductor paste layered in a monolithic structure. Sintering offerrite and electric conductors
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MLF3216C150K
Abstract: MLF1608K-100K MLF3216E-6R8K MLF1608D-R18K MLF3216A-3R9 MLF2012E120K MLF1608D-R68K MLF3216A1R0K MLF3216DR15K MLF3216DR27K
Contextual Info: Page: 1 Thursday, May 22, 1997 4b3b.html MLF SERIES Shielded Inductor TDK's MLF Multilayer Chip Inductor combines high performance with the most compact design available today. MLF Inductor's multilayer technology utilizes ferrite paste and electric conductor paste layered in a monolithic structure.
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Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield. Perfect for high density installation. • Unified automatic chip mounting shape with no directionality. • Excellent solderability and high resistance for either flow
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