MLF3216 Search Results

Contextual Info: Page 1 of 1 Product Name Series Type Part Number Multilayer Inductor for Signal Line MLF Series 3216 Type MLF3216A2R7KT000 Product Lifecycle Stage PROD Part Number of Replacement MLF2012A2R7KT Specification Summary/Applications/Feature Mounting Method Flag

MLF3216

Abstract: Inductor tdk mlf3216 nl2520 ferrite bead tdk NLC3225 MLF3225 chip EMI filter
Contextual Info: TDK SAMPLE KITS A DIVISION Filters, Beads, Inductors Order No. ACL2520L Series- Ferrite Chip Inductor ACL3225S Series- Ferrite Chip Inductor ACF4532 Series- Ferrite Chip EMI Filter ACF3218 Series- Ferrite Chip Inductor ACA Series- EMI Suppressor Array ACC HF70,50,30 Series- EMI Suppressor

tdk ceramic filters 10.7

Abstract: CST063 NLU160805 MLR1 tdk Isolators INVERTER TRANSFORMERS MHD1010DDC MCZ2525 NTCCM1608 SMPT0706
Contextual Info: Packaging Styles And Quantities Product Multilayer Ceramic Chip Capacitors Product’s Type or Series thickness Part No. (mm) Quantities (pieces) Reel dimensions (mm) Taping (/reel) _ |k HUIK $A (j>B <t>C W C1005 10000, 50000 — 178±2 60±2 13±0.5 382 max.

tdk mlf3216 cross reference

Abstract: MLF3216 MMZ2012Y fbmh3216hm TOKO Catalogue HB-1H1608-series tdk cross reference WCM2012 WCM3225 HB-1M3216
Contextual Info: ● All the data listed in this catalogue are for reference only,TAI-TECH reserves the right to alter or revise the specifications without prior notification. Products Guide/Cross Reference List • EMI Suppression Filter TAI-TECH P/N MURATA P/N TDK P/N TAIYOYUDEN P/N

MLF3216

Abstract: MLF3216 1R0 MLF3216-5R6 MLF3216-4R7 MLF1005-3N3 MLF3216-1R0
Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield Perfect for high density installation • Unified automatic chip mounting shape with no directionality • Excellent solderability and high resistance for either flow

MLF3216

Abstract: MLF3216E100KT tdk mlf3216 MLF2012C150KT MLF1608C-270K MLF3216A1R0KT MLF3216A1R5KT MLF3216E-100K MLF2012C560KT MLF3216E-6R8K
Contextual Info: 1/3 M U LT I L AY E R C H I P I N D U C T O R S MLF SERIES - 0603, 0805 AND 1206 SIZES • MONOLITHIC STRUCTURE GIVES HIGH RELIABILITY • NO CROSS COUPLING BETWEEN INDUCTORS DUE TO MAGNETIC SHIELD • IDEAL FOR HIGH DENSITY INSTALLATION • FLOW AND REFLOW SOLDERING

spw 080

Abstract: LEM3225 CL-2M2012-900JT TKS 0603 FBM3216HS800-T ACB2012M-150-T LAL04TB 494LYF FBM2125HS420-T m5258
Contextual Info: CT Technologies - Cross Reference Competitor Part CTC Part 0402R CT0402CSF 0402CS-P CT0402CSF 0402CS L CT0402CSF 0402CS CT0402CSF 0402 CT0402CSF 555-0402 CT0402CSF PE-0402CD CT0402CSF 0402AS CT0402CSF ELJNK CT0402CSF GLZG CT0402CSF KQ0402 CT0402CSF KQT0402L

MLF3216

Abstract: MLF2012 MLF1608 MLF3216-3R9 MLF3216-R68T
Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield Perfect for high density installation • Unified automatic chip mounting shape with no directionality • Excellent solderability and high resistance for either flow

MLF1206

Abstract: MLF1608DR56K MLF3216A1R0K MLF1608D-R18K MLF2012E120K MLF1608D-R68K MLF3216DR27K MLF3216A3R9K MLF3216 MLF1608A1
Contextual Info: INDUCTORS Multilayer Chip MLF SERIES - Shielded Inductor TDK’s MLF Multilayer Chip Inductor combines high performance with the most compact design available today. MLF Inductor’s multilayer technology utilizes ferrite paste and electric conductor paste layered in a monolithic structure. Sintering o f ferrite and electric conductors

MLF3216

Abstract: LF1608
Contextual Info: Features No crosstalk between inductors due to magnetic shield. Perfect for high density installation. Unified automatic chip mounting shape with no directionality. Excellent solderability and high resistance for either flow or reflow soldering. Monolithic structure for high reliability.

MEA8020

Abstract: ACB1608 EPC17 BOBBIN ZCYS51R5-M3PA TCXO 9.9 MHZ CST063 QVC10 NLU160805 tdk Isolators ACL2520
Contextual Info: SM Components at a Glance Product name Type or Series Part No. Multilayer Ceramic Chip Capacitors C1005 [EIA CC0402] W T 1 0.5 0.55 max. Class I 0.5 to 330pF Class II 220 to 100000pF 1.6 0.8 0.9 max. Class I 0.5 to 1000pF Class II 220pF to 1jiF 2 1.25 1.45 max.

Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield Perfect for high density installation • Unified automatic chip mounting shape with no directionality • Excellent solderability and high resistance for either flow

inductor 100 micro henry

Abstract: MLF1005 inductors 22 micro henry coil MLF1608A MLF3216E inductors 10 micro henry MLF3216A-4R7 inductors 33 micro henry mic1206a inductors 70 micro henry
Contextual Info: FEATURES SMEC offers a product that utilizes a unique technology to provide a Surface Mount Chip Inductor, that is unlike any coil type inductor. Magnetic materials technology and multilayer technology is used to produce chip inductors that do not use any windings. This multilayer process

MLF3216

Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield. Perfect for high density installation. • Unified automatic chip mounting shape with no directionality. • Excellent solderability and high resistance for either flow

tdk mlf3216

Contextual Info: Multilayer Chip Inductors Magnetic Shielded MLF Series FEATURES • Monolithic structure for high reliability. • Excellent solderability and high heat resistance for either flow or reflow soldering. MLF1608 TYPE SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERNS

MLF3216

Abstract: MLCC R040 NTC thermistor 5k ohm FBM0805 MLF1005 330m 400v MLF1206 c1206x7r160 thr mgp 10k CR0402-16w
Contextual Info: Our Mission Venkel’s mission is to be a leading supplier of surface mount components by utilizing a team of highly motivated people dedicated to exceeding customer expectations through superior quality, price, service and innovation with integrity. 5900 Shepherd Mountain Cove • Austin, TX 78730

PS-3PF-S4T1-PKL1

Abstract: CT3528 HTD12 PS-10PF-D4T1-PKL1 NEC c157 lcd power board schematic APS 254 CBD49 htd11 CRML08W TEMSV
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

MLF3216

Abstract: MLF3216-4R7 MLF1608-220
Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield. Perfect for high density installation. • Unified automatic chip mounting shape with no directionality. • Excellent solderability and high resistance for either flow

MLF3216

Abstract: tdk mlf3216 MLF3216E
Contextual Info: Multilayer Chip Inductors MLF Series TDK Multilayer Chip Inductors use magnetic materials and multilayer technology in producing revolutionary inductors which do not use any wire windings. Ferrite paste and electric conductor paste are alternately layered and sintered into a completely monolithic structure to form an inductor

Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield Perfect for high density installation • Unified automatic chip mounting shape with no directionality • Excellent solderability and high resistance for either flow

MLF3216A4R7K

Abstract: MLF1608DR15K MLF1206-R68K
Contextual Info: INDUCTORS Multilayer Chip MLF SERIES - Shielded Inductor TDK’s MLF Multilayer Chip Inductor combines high performance witb tbe most compact design available today. MLF Inductor’s multilayer technology utilizes ferrite paste and electric conductor paste layered in a monolithic structure. Sintering offerrite and electric conductors

MLF3216C150K

Abstract: MLF1608K-100K MLF3216E-6R8K MLF1608D-R18K MLF3216A-3R9 MLF2012E120K MLF1608D-R68K MLF3216A1R0K MLF3216DR15K MLF3216DR27K
Contextual Info: Page: 1 Thursday, May 22, 1997 4b3b.html MLF SERIES Shielded Inductor TDK's MLF Multilayer Chip Inductor combines high performance with the most compact design available today. MLF Inductor's multilayer technology utilizes ferrite paste and electric conductor paste layered in a monolithic structure.

Contextual Info: Multilayer Chip Inductors Features • No crosstalk between inductors due to magnetic shield. Perfect for high density installation. • Unified automatic chip mounting shape with no directionality. • Excellent solderability and high resistance for either flow