FR4 SUBSTRATE SHEET Search Results

Contextual Info: Pulse v'—' Electronics www.pulseelectronlc3.com CX2109NL RF Transformer 1:1, 4.5 - 3000MHz Impedance = 50 Ohms Surface Mount, FR4 Substrate ELECTRICAL SPECIFICATIONS PARAMETER NOTES: UNLESS OTHERWISE SPECIFIED: FREQUENCY Hz INSERTION LOSS: AT + 2 5 ‘ C

underfill

Abstract: DS2415X D085-002 FR4 substrate
Contextual Info: NOTES: 1. DIMENSIDN5: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COQRDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS

E28F008SA

Abstract: EDI7F341MC
Contextual Info: EDI7F341MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

1mx8

Abstract: E28F008SA EDI7F341MC
Contextual Info: EDI7F341MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F341MC and EDI7F2341MC are organized as one and two banks of 1Mx32 respectively. The modules are based on Intel's E28F008SA - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

1.5528

Abstract: EDI7F33512C AM29F040 2192
Contextual Info: EDI7F33512C 512Kx32 Flash DESCRIPTION FIG. 1 The EDI7F33512, EDI7F233512 and EDI7F433512 are organized as 512Kx32 and 2x512Kx32 and 4x512Kx32 respectively. The modules are based on AMD's AM29F040 - 512Kx8 Flash Device in TSOP packages which are mounted on an FR4 substrate.

AM29LV004T

Abstract: EDI7F33512V
Contextual Info: EDI7F33512V 512Kx32 FLASH DESCRIPTION FIG. 1 The EDI7F33512, EDI7F233512 and EDI7F433512 are organized as 512Kx32 and 2x512Kx32 and 4x512Kx32 respectively. The modules are based on AMD's AM29LV004T - 512Kx8 Flash Device in TSOP packages which are mounted on an FR4 substrate.

MARK J3

Abstract: AM29F016 EDI7F332MC amd AM29F016
Contextual Info: EDI7F332MC 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F332MC and EDI7F2332MC are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29F016 - 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

1mx8

Abstract: AM29LV008T EDI7F2331MV EDI7F331MV
Contextual Info: EDI7F331MV 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MV and EDI7F2331MV are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

EDI7F342MC

Abstract: E28F016S5
Contextual Info: EDI7F342MC 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MC and EDI7F2342MC are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's E28F016S5 -2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate BLOCK DIAGRAMS

DS56X

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] LASER MARK LANDING PAD NOT DEFINED BY SO LD ER Z. 3. MASK; FOR PAD CONNECTIONS AND COORDINATES. SE E TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS

EDI7F331MV

Abstract: AM29LV008T EDI7F2331MV
Contextual Info: EDI7F331MV 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MV and EDI7F2331MV are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

28F016S3

Abstract: EDI7F342MV
Contextual Info: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

underfill

Abstract: DS2417X FR4 substrate ds2417
Contextual Info: NOTES: 1. 2. DIMENSIONS: LASER MARK MM [IN C H ] 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR CONNECTIONS AND COORDINATES, SEE TABLE 1 4. PAD UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILUMETERS

1.5528

Abstract: 1mx8 MARK J3 AM29F080 EDI7F331MC
Contextual Info: EDI7F331MC 1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F331MC and EDI7F2331MC are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs AM29F080 - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS

28F016S3

Abstract: EDI7F342MV
Contextual Info: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.

1mx8

Abstract: AM29F080 EDI7F4331MC
Contextual Info: EDI7F4331MC 4x1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F4331MC is organized as four banks of 1Mx32. The module is based on AMDs AM29F080 - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAM EDI7F4331MC-BNC:4x1Mx32 80 PIN SIMM

3402 transistor

Abstract: EDI7F4342MV
Contextual Info: EDI7F4342MV 4x2Mx32 FLASH MODULE FEATURES DESCRIPTION • 4x2Mx32 The EDI7F4342MV is organized as four banks of 2Mx32. The module is based on Intel's E28F016S3 - 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. • Based on Intel's E28F016S3 Flash Device

FR4 SUBSTRATE SHEET

Abstract: 0343
Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

DS1822X

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

1mx8

Abstract: AM29LV008T EDI7F4331MV
Contextual Info: EDI7F4331MV 4x1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F4331MV is organized as four banks of 1Mx32. The module is based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAM EDI7F4331MV-BNC: 4x1Mx32 80 PIN SIMM

AM29LV008T

Abstract: EDI7F4331MV
Contextual Info: EDI7F4331MV 4x1Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F4331MV is organized as four banks of 1Mx32. The module is based on AMDs AM29LV008T - 1Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAM EDI7F4331MV-BNC: 4x1Mx32 80 PIN SIMM

0660H

Contextual Info: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES. SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION 5. SPECIAL NOTE: OFFSET PAD DESIGN DO NOT SHRINK OR GROW LAND PAD

IS242

Abstract: DS2423X
Contextual Info: NOTES: 1. DIMENSIDNSi 2. 3. MM CINCHES] LASER MARK LAND PAH NOT DEFINED BY SOLDER MASK; FDR PAD CONNECTIONS, SEE TABLE 1 4. UNDERFILL DR GLEIB TDP REQUIRED FDR FR4 DR EQ U IVA LEN T SUBSTRATE TABLE 1. APPLICATION LAND PAD C0NNECT0N5 AND CENTE R COORDINATES

R04003

Abstract: PB10-2
Contextual Info: M/A-COM LSM1VCO Package PIN 1 FUNCTION RF O utput Vcc supply voltage Vtune (tuning voltage) 2 3 4 No connection o r g round Lid = ground Notes: 1. Substrate Material FR4 2. Contact areas plated nickel u n d er gold flash 3. All unspecified tolerances ±0.25