FESI Search Results

B82504-W-A6

Abstract: B82505-W-A4 B82505WA4 B82505-W-A6 B82506-W-A6 B82506-W-A5 LL350 B82504-W-A4 B82504-W-A1 B82502
Contextual Info: Drosseln für Netzanwendungen Chokes for Power Lines Stabkerndrosseln, vergossen I core chokes with encapsulation s: Plastic case, potted UL 94 V-0 if Core material: laminated iron-silicon Kunststoffgehäuse, vergossen (UL 94 V-0) Kernmaterial: FeSi-Blech

Contextual Info: 3.5E D [fl3bb011 □ □ □ n i b fl I SOLID STATE DEVICES INC T-13-07 SH A394A thru SH A 3 9 4 C 30 AMP ULTRA FAST CENTERTAP RECTIFIER 100-200 VOLTS CASE STYLE V JEDEC TO-3 WITH .060 PINS fesiöll 14830 Valley View Avenue La Mirada, California 90638 213 921-9660

Contextual Info: DWG. NO. DO NOT SCALE DRAWING S D -5 4 6 1 3 -0 0 3 fet34NO. DRWN: CH'Ks APPR: CO m o o feB3NO. DRWN: CH'Ks APPR: it i fet32NO. DRWN: IS M CH'Ks APPR: > 4 W R EV ISED fesi no.JD 2 0 0 I - 1632 DRWN: S.HOSHIKAWA '01/05/31 ch 'K s A.NODA APPR: HoIKESUGI go vim

TN20

Contextual Info: NI C THERMISTORS SMD TYPE • TN20, TN23, TC20 Series • • • • Fesistance tolerance. ±5%, ±10% R=25°C E value tolerance.±3%, ±5% (B25 / 50) Termination. Solder plated nickel barrier

B82503-U-A14

Contextual Info: Stabkerndrosseln I Core Chokes Stabkerndrosseln, vergossen B82502 I core chokes, potted B82502 • Kunststoffgehäuse, vergossen ■ Kernmaterial: FeSi-Blech ■ Stifte im Rastermaß 3,7 _ 1,2 500 V~/600 V– ±20 % 40/125/56 Hersteller, Bestellnr., L R, U R, I R

Contextual Info: DWG. NO. DO NOT SC ALE DRAWING S D -5 4 6 8 0 -0 0 2 fe04NO. DRWN: CH'Ks APPR: fe03NO. DRWN: 0 .5 CH'Ks APPR: \546ffel-l00* 9 fe02NO. DRWN: CH'Ks APPR: v 9 i ir z i z R E V IS E D fesiNO. J D 2 0 0 1 - 0 7 4 0 DRWN: YU.HASEGAWA '01/06/17 CH'K: A .N O D A APPR: H . I K E S U G I

Contextual Info: H ITACH I 2SA1190, 2SA1191 S LI CON PNP EP|-A>iAt LOW FREQtJENt-r LOWNQiSg AMPUHgH Gointyi«fA6r*ary w vrfh 3SC8BSS ara $80385$ Jm r B > * tk / i ¿i.» «; Î C-il«rw r S. feSiM v'tw iitM i vi rtmt i ÍJÍO EC TO-92Í • ASSOLUTE MAXIMUM ftA ÏW G S {t*-:s 'X 1

Contextual Info: Surface Mount LED Notes: 1. All dimensions are In mllllmeters Inches . 2. Tolerance is *0.25(0.01”) unless otherwise noted. 3. Lead spacing I S measured where the lead emerge packaqe 4. Specifications are subjected to change without notice I t )I- fEsic%yi~x;l

FES1D

Contextual Info: FAGOR FESIA.FES1G 1 Amp. Surface Mounting Ultrafast Recovery Dimensions in mm. CASE: SMA/DO-214AC Voltage 50 to 400 V Current 1.0 A 1Glass passivated junction 1High current capability 1The plastic material carries U/L 94 V-0 >Low profile package • Easy pick and place

htw 323

Abstract: plji palce programming algorithm
Contextual Info: COM’L: H-5/7/10/15/25, Q-10/15/25 IND: H-15/25. Q-20/25 MIL: H-15/20/25 PALCE20V8 Family EE CMOS 24-Pin Universal Programmable Array Logic Advanced Micro Devices DISTINCTIVE CHARACTERISTICS • Pin, function and fuse-map compatible with all GAL 20V8/AS ■ Electrically erasable CMOS technology pro­

1679C

Abstract: M/6080 pats
Contextual Info: Ordering numbcr:EN1879C DTM8-N ISAßroi Silicon Planar Type 8A Bidirectional Thyristor Package Dimensions #si^ Features • Insulation type. •Peak OFF-state voltage : 200 to 600V, • RMS ON-state current : KA. • TO-22U package. unii:mm 1144 “ iThe gate trigger mode is shown below.

Contextual Info: S D "5 537 2"005 * — j£ E NOTES: I. m 1.155 m (B) 0.4 0.2 MATERIAL A o x n - : (0.475) (0.47) 2 I 0.2 I A ( £ U L 9 4 V - 0 (JR) « a / 2 ) APPLY FOR (CIRCUIT/2)=EVEN. WAFER:LIQUID CRYSTAL POLYMERtGLASS FILLED) UL94V-0 (C0L0R:BLACK) t r v : « s i ( t = o . i 5)

Contextual Info: I \ Z I £ | ZE-rXMZ50 DI0-N3 b <») N0)S5]nu3d NBiuua inornia assn 39 ion qtiohs gnv NVdvnxBion 01 AtjviBiUdOUd si it hi nouvnuojni snivino? wiavao sihi 9 E S -0 S •ON ’ DMO A3U A /S S V ddAO D H O lI d 3f § S £ 9 "0 ONiovxovd m s ‘ON "0N3 o 05 09

Contextual Info: <3 0.5 0.5* /t5 /5 PITCH) o 00 l| A -S ^ JL TERMINAL ECT.Z-Z 0.5 (5) m w u y y o h (5 0 9 r e ) 0.5 P.C.BOARD PATTERN DIMENSION. (REF.) (MOUNTING AREA) h n 0.55 i l □ □ S A SHAPE OF 3 0 C IR C U I T S OR L E S S ) i f 3 NOTE (YfflAM MATERIAL A x7— m z z M M ,UL94V-0 (M)

ipass connector

Abstract: ipass Gigabit Ethernet Controller PCIe molex CT Connector passive plating guide 76105
Contextual Info: 0.80mm .031” Pitch iPass+ 84-Circuit 120 Gbps Products FEATURES AND SPECIFICATIONS Molex’s 84-circuit, iPass+ integrated connector and cage supports 8, 10 and 12 channels of InfiniBand* and 10 Gigabit Ethernet data for up to 120 Gbps of pluggable data in one assembly

SD card CARD PCB FOOTPRINT

Abstract: SD card footprint PCB molex CT Connector mmc cARD PCB FOOTPRINT sony dvd writer 94v-0 lcd sony dvd player SD Card and MMC Reader SD MMC card information ul 94v-0 lcd display
Contextual Info: 4.20mm .165” Height 3-in-1 Memory Combo Connector FEATURES AND SPECIFICATIONS Molex offers compact solution for memory combo card connector 47265 MS/MS-Pro/SD/MMC Bottom Mount, Non Push-Push, SMT Many different format of memory cards have surfaced in recent years. This

WKO 440

Abstract: GH3039 WRGKK1-131-GVV500 pgfe JBM L-20 SMU FM IC 1u5m 4cms GH3030
Contextual Info: 0’8 0'9 O't? 0'£ S'Z ro ro ro ro wm e*o ro ro - - mn O'I 8*0 9*0 ro 0> O'c n O'I 8'0 ¿'0 9*0 Ç'O ro 8'0 0'9 O'Ç Ç> O'fr o'e 01 n O'I 009 noe oor ooe 009 WM% O'I 8'0 9'0 ro ro U Ç'O çro on o o oor 0001 006 008 ooç ooe sol [bJ4^S25/[°I|1t îî •

Contextual Info: W78E354 & IVinbond £iecironics Corp. MONITOR MICROCONTROLLER GENERAL DESCRIPTION The W78E354 is a stand-alone high-performance microcontroller ASIC specially designed tor use in monitor control applications. Using the Winbond O.fyi DPDM process, the W78E354 integrates an

sil1364

Abstract: DVI-D to vga cable Silicon Image Sil1364 Silicon Image 1364 DISPLAY CHIP NAME FOR MOTHERBOARD ADD2 DVI-D intel MOTHERBOARD pcb DVI-D Single Link to vga SIL1364 ADD2-N DVI-D to vga
Contextual Info: FEATURES AND SPECIFICATIONS MicroCross ADD2 DVI Card 79530 ADD2 cards now used in Intel 945G as well as 915G-based PC desktops equipped with a PCIExpress* slot; ADD2 cards are low-cost solutions that enable a DIGITAL VISUAL INTERFACE DVI connection Molex’s Advanced Digital Display 2 (ADD2) adapter

UL 94v-0 board

Contextual Info: • Wire-to-wire free hanging only ■ Wire-to-board ■ Patented Terminal Position Assurance (TPA) feature ■ Voltage: 600V ■ Current: 18.0A* ■ UL 1950 Finger Proof Safe available 7.50mm (.295") Pitch Sabre *Depending on circuit size, wire gauge and PCB design

LR19980

Abstract: 1050mm
Contextual Info: Plateau HS Mezz High Speed Mezzanine for 10.0 Gbps Bandwidth 75003, 75005 High Speed Mezzanine Connectors Feature Innovative Plated Plastic Housing for Outstanding Performance Molex utilizes its proprietary Plateau Technology™ to create a high-speed, superior performance surfacemounted mezzanine connector system. This technology

1507 0810

Abstract: 39100-1502 E48521 39100-1203 39100-0904 39100-1204 38002-1730
Contextual Info: FEATURES AND SPECIFICATIONS Eurostyle Two-Screw Terminal Strips are available in a wide variety of pitch spacings The Eurostyle Two-Screw Terminal Strips from Molex allow customers to pick from a variety of pitch sizes in either a standard or low-profile version, to ensure the

mxj connector

Abstract: mxj connector FPC mxj fpc FPC CONNECTOR molex CT Connector fpc molex 0.80mm FPC cable mxj 5 connector
Contextual Info: 0.30mm .012" Pitch FPC Connector 1.05mm (.041") Height 500797 INTRODUCTION The 500797 FPC series from Molex offers very high cable retention forces as a result of a uniqe alternating spring contact design. Alternating even and odd terminals provide opposing forces to create a high FPC retention

pfe 225

Abstract: "silicon steel" sendust 230 96 LHDM010330AUDV0E LHDM005141AUDV0E LHDM010300AUGV0E
Contextual Info: RoHS指令 適合品 •主な用途 ● スイッチング電源出力平滑用チョーク ● DC-DC コンバータ用チョーク ● ノイズ対策用ノーマルモードチョーク ● 力率改善回路用チョーク ■特長 ● 周波数特性温度特性に優れています。