EMP16-E2
Contextual Info: PACKAGE DIMENSIONS EMP16-E2 0 ~ 8° 10.3±0.2 9 1 8 10.3±0.4 7.5±0.1 0.6 16 0.10 1.27 0.2±0.1 2.5±0.15 0.28±0.05 0.42±0.1 UNIT : mm
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EMP16-E2
Contextual Info: パッケージ外形図 EMP16-E2 0 ~8° 10.3±0.2 9 1 8 10.3±0.4 7.5±0.1 0.6 16 0.10 1.27 0.2±0.1 2.5±0.15 0.28±0.05 0.42±0.1 単位 : mm
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VQFN28
Abstract: DIP18 DIP20 DIP32 SDIP28 jedec MS-013 QFP100-P-1420
Contextual Info: パッケージコード一覧 ４．パッケージコード一覧（NJRCコード vs. EIAJコード対応） 当データブックではパッケージコードとして新日本無線パッケージコードを記載しておりますが、EIAJパッケージコードとの対応は下記一
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dip14dip14-d1dip16dip16-d2/d3+11dip18dip20dip22dip22-d2dip24dip24-d2vqfn28dip32sdip28jedec ms-013qfp100-p-1420
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EMP20-E2
Abstract: QFP80 QFP64 package QFP80-C3 SSOP20
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when
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DIP18
Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
Contextual Info: 包装仕様一覧 １．概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。
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JIS C 0806
Abstract: ET710 L336 FFP16-C1 EMP14 ET-7101 SDMP30 JRC TE1 TE2 TE3
Contextual Info: TAPING DIMENSIONS Taping Dimensions There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with JIS standard
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crc8 st7
Abstract: ST7267 TQFP48 TQFP64 overvoltage protection ttl FAG 29 diode
Contextual Info: ST7267 USB 2.0 HIGH SPEED MASS STORAGE MICROCONTROLLER PRELIMINARY DATA • ■ ■ ■ ■ ■ USB 2.0 Interface compliant with Mass Storage Device Class – Integrated USB 2.0 PHY – Supports USB High Speed and Full Speed – 1 control endpoint with two 64-byte buffers
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st726764-byte512-byte16-bit+5crc8 st7tqfp48tqfp64overvoltage protection ttlfag 29 diode
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DMP14
Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when
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bcc24bcc32bcc36dmp14+8dmp16emp14emp16-e2emp20-e2emp24-e3sdmp30dmp8 pcb patternqfp100-c2
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DIP18
Abstract: DIP20 DIP40
Contextual Info: スティックケース寸法図 ３．スティックケース寸法図 DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC パッケージ品はスティックケースでの出荷が可 能です。以下にスティックケースの寸法を示します。
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DMP14
Abstract: DMP16 EMP14 SDMP30 SSOP10
Contextual Info: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、はんだブリッジの発生の有無などを
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JRC 6001
Abstract: JRC 8002 -71/JRC 8002 EIAJ-RRM-08B EIAJ-RRM-08-B EIAJ-RRM08B kw2j EMP14 SDMP30 EMP20-E2
Contextual Info: テーピング寸法図 ４．テーピング寸法図 テーピング品については粘着テーピングとエンボスキャリアテーピングがあります。 粘着テーピングの規格は、EIAJ「電子部品のテーピング寸法（ET-7101:粘着式）」に準じ、エンボスキャリアテーピングの規
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"Motor Controller"
Abstract: motor controller njm3517 stepper motor controller NJM12902 "operational Amplifier" "Stepper Motor" half step drive motor driver step stepper motor driver ICs
Contextual Info: Stepper Motor Controller/Driver Stepper Motor Controller/Driver NJM3517 DATA SHEET • GENERAL DESCRIPTION Controller/Driver NJM3517 is a stepper motor controller/driver, which required minimum of external components and drive currents up to 500mA. The NJM3517 is suited for applications requiring leastpossible RFI. Operating in a bilevel drive mode can increase
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NJM3517
Abstract: NJM3517D2 1N4001 NJM3517E2 NJM3770A 3517D2 OB83
Contextual Info: NJM3517 STEPPER MOTOR CONTROLLER / DRIVER • GENERAL DESCRIPTION ■ PACKAGE OUTLINE NJM3517 is a stepper motor controller/driver, which requires minimum of external components and drive currents up to 500mA. The NJM3517 is suited for applications requiring least-possible RFI.
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P2671
Abstract: NP2671 "Stepping Motor" stepping motor
Contextual Info: NPM NP2671 STEPPER MOTOR CONTROLLER I DRIVER • GENERAL DESCRIPTION ■ PACKAGE OUTLINE N P 2671 is a two-phase unipolar stepping motor driver with a motor output of a maximum of 60 V and a maximum cunent of 500 mA. The Puise&Oir Pulse Input system of the motor controller
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3517D2
Abstract: NJM3517D2 D3D6 1N4001 BYV27 NJM3517 NJM3517E2 NJM3770A STEP MOTOR IC LB PB111
Contextual Info: NJM3517 ステッピングモータコントローラ ステッピングモータコントローラ//ドライバ • 概 要 NJM3517はステッピング・モータコントロール/ドライバ で、わずかな外付け部品で、最大500mAまでのステッピング
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DIP18
Abstract: DIP20 DIP40 702 mini transistor
Contextual Info: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as fillows. 1. Plastic Tube Container for dual-in-line plastic mold
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ET-7101
Abstract: jrc 4001 EMP14 EMP16-E2 EMP20-E2 SDMP30
Contextual Info: TAPING DIMENSIONS Taping Dimensions There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with JIS standard
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QFP-144L
Abstract: VSP8 Package EMP8
Contextual Info: PACKAGE DIMENSIONS DIP8 8.8±0.3 5 1 4 6.4±0.2 8 7.62 0.51M IN 1.0±0.2 0.46±0.1 2.54 2.8M IN 0.74MAX 4.7M AX 1.5±0.2 +0.15 0.25 -0.05 ~ 15º UNIT: mm 19.0±0.3 DIP14 8 1 7 6.4±0.2 14 7.62 1.5±0.2 2.54 0.46±0.1 2.8M IN 0.51M IN 4.7M AX 2.03MAX +0.15
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EMP24-E3
Abstract: EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when
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DMP24 JRC
Abstract: kw2j JRC 8002 EMP14 SDMP30
Contextual Info: テーピング寸法図 ３．テーピング寸法図 テーピング品については粘着テーピングとエンボスキャリアテーピングがあります。 粘着テーピングの規格は、EIAJ「電子部品のテーピング寸法（ET-7101:粘着式）
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SSOP10
Abstract: DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
Contextual Info: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic
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NJM2675D
Abstract: NJM2675 2675D NJM2675E2
Contextual Info: NJM2675 H BRIDGE DRIVER • GENERAL DESCRIPTION ■ PACKAGE OUTLINE The NJM2675 is a general-purpose 60V single H-bridge drive IC. It consists of a H-bridge, a thermal shut down circuit and its alarm output. The alarm output can detect application problems and the system reliability will be significantly
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emp8 Package dimension
Abstract: TO252 thermal character SOT23-5 VH PAT-1 QFP80-C2 SC82AB SC88A SSOP10 SSOP14 SSOP16
Contextual Info: THERMAL RESISTANCE This manual explains about measurement procedures and definitions of thermal resistance. •INTRODUCTION Generally, the life of a device would decrease to half, and the failure rate would double whenever Junction Temperature, Tj, goes up by
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DIP18
Abstract: DIP20 TO-220F-4
Contextual Info: PLASTIC TUBE DIMENSIONS Plastic Tube Container Dimensions DIP, SDIP, SIP, ZIP, DMP, SDMP, TO, SOP, EMP, SOT, PLCC packages are packed in the plastic tube container. The dimensions are mentioned as follows. 1. Plastic Tube Container for dual-in-line plastic mold
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