EDI8F3232C Search Results

Contextual Info: ^EDI EDI8F3232C 32Kx32 SRAM Module ELECTRONIC DESIGNS, INC 32Kx32 Static RAM CMOS, High Speed Module Features The EDI8F3232C is a high speed megabit Static FiAM 32Kx32 bit CMOS Static module organized as 32Kx32. This module is constructed Random Access Memory

Contextual Info: EDI8F3232C 32Kx32 SRAM Module 32Kx32 Static RAM CMOS, High Speed Module Features The EDI8F3232C is a high speed megabit Static RAM module organized as 32Kx32. This module is constructed from four 32Kx8 Static RAMs in SOJ packages on an epoxy laminate FR4 board.

Contextual Info: EDI8F3232C W D I 32KX32 SRAM Module ELECTRONIC. DESIGNS, INC 32KX32Static RAM CHIOS, Hitfi Speed Module Features TTie EDI8F3232C is a high speed megabit Static RAM 32Kx32 bit CMOS Static module organized as 32Kx32. This module is constructed Random Access Memory

Contextual Info: m oi EDI8F3232C 32KX32 SRAM Module B£CTROMC OESGN& MC. 32Kx32 Static RAM CMOS, High SpeedModule Features The EDI8F3232C is a high speed megabit Static RAM module organized as 32Kx32. This module is constructed from four 32Kx8 Static RAMs in SOJ packages on an epoxy

Contextual Info: WDl Module Packaging ELECTRONIC DESIGNS INC. Advanced Packaging Advances in packaging techniques perm it a wide variety of solutions to board space problems. M odules are com prised o f individual sem iconduc­ tor devices with other support devices, such as decod­

Contextual Info: ^EDI Module Packaging ELECTRONIC DESIGNS INC. Advanced Packaging c o n fig u ra tio n s . T h e y a ls o fe a tu re th e a d d itio n a l a d v a n ­ A d v a n c e s in p a c k a g in g te c h n iq u e s p e rm it a w id e v a rie ty o f s o lu tio n s to b o a rd sp a c e p ro b le m s.