DS3832C Search Results

Contextual Info: DS3832C-311 3.3V, 32Mb Advanced NV SRAM with Clock www.maxim-ic.com FEATURES § § § § § § § § § § § PACKAGE OUTLINE 3.0V to 3.6V operation Surface-mount nonvolatile NV RAM ball-grid array (BGA) module construction 1024k x 32 NV SRAM memory space and

DS3802

Abstract: DS3832C-311 DS3801
Contextual Info: DS3832C-311 3.3V, 32Mb Advanced NV SRAM with Clock www.maxim-ic.com FEATURES § § § § § § § § § § § PACKAGE OUTLINE 3.0V to 3.6V operation Surface-mount nonvolatile NV RAM ball-grid array (BGA) module construction 1024k x 32 NV SRAM memory space and

Contextual Info: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been

reflow temperature rohs bga

Contextual Info: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been

battery 15v

Abstract: AN505 DS1330 DS1345 DS3816C-512 DS3832C-311 DS38464
Contextual Info: Application Note 3254 Battery Monitoring of NV SRAM Modules www.maxim-ic.com As a prerequisite to this article, it is recommended that Application Note 505 AN505 be reviewed to gain a better understanding of the general behavior of lithium coin-cell batteries.

DALLAS CAP

Abstract: DS3802 DS3832C-311 nv sram
Contextual Info: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been

nv sram

Abstract: Using nvsRAM in RAID Controller Applications DS3802 DS3832C-311 access time embedded sram dallas sram lithium
Contextual Info: Application Note 2077 Using Dallas Semiconductor NV SRAMs in RAID Applications www.maxim-ic.com INTRODUCTION RAID Redundant Array of Independent Disks consists of multiple hard drives in one system that appear like a single drive. The multiple drives provide better performance and fault tolerance than single drive systems.

bga 100 PACKAGE footprint

Abstract: DS1230YP-70 DS1245 DS1250 DS1330 DS1345 DS2030Y-70 DS3832C DS3835C-RR3
Contextual Info: Application Note 3118 Replacing a PowerCap Module with a Reflowable BGA Module www.maxim-ic.com INTRODUCTION In order to facilitate conversion of an existing PCB design utilizing a NV SRAM PowerCap Module to the equivalent NV SRAM Single-Piece Reflowable BGA Module, there are a few simple steps required to first verify