DDR3 SOCKET Search Results

PS8121E

Abstract: f2116te20v c4589 AN12946 PS8121 C4574 SLG8SP568V cx20561-15z schematic diagram lcd monitor lenovo lenovo
Contextual Info: Intel Penryn DC, QC, Extream Processor 3,5 June 18 ' 08 AGTL+ FSB UNBUFFERED DDR3 SODIMM Normal/Reverse Socket N-note Block Diagram ITP Conn. UNBUFFERED DDR3 SODIMM Normal/Reverse Socket Channel B 1067/800MHz Keyboard Light LVDS Intel Cantiga-PM DDR3 1067/800MHz

PS8121E

Abstract: USB2507-ADT cx20561-15z TS3DV421RUAR-GP AN12946A AN12946 R7121 f2116te20v lenovo schematic diagram lcd monitor lenovo
Contextual Info: Intel Penryn DC, QC, Extream Processor 3,5 June 18 ' 08 AGTL+ FSB UNBUFFERED DDR3 SODIMM Normal/Reverse Socket N-note Block Diagram ITP Conn. Channel B UNBUFFERED DDR3 SODIMM Normal/Reverse Socket 1067/800MHz Keyboard Light LVDS Intel Cantiga-PM DDR3 1067/800MHz

K4B2G0846

Contextual Info: Data Sheet Rev.1.3 17.09.2012 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64D2BD1SA-xxRT • 2GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: Data Sheet Rev.1.2 23.03.2012 1024MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN01G64D2BG1SA-xxRT • 1GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: Data Sheet Rev.1.2 23.03.2012 4096MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN04G64E1BD2SA-xxRT • 4GByte in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: Data Sheet Rev.1.2 23.03.2012 4096MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN04G64E1BD2SA-xxRT • 4GByte in FBGA Technology •    RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: Data Sheet Rev.1.3 17.09.2012 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64D2BD1SA-xxRT • 2GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

Contextual Info: 240PIN DDR3 1333 Unbuffered DIMM JM1333KLN-8GK 8GB Kit With 256Mx8 CL9 Description Placement The JM1333KLN-8GK, a dual channel kit, consists of 2 pcs 4GB DDR3 SDRAM module. The 4GB module is a 512M x 64bits DDR3-1333 Unbuffered DIMM. The 4GB module consists of 16pcs 256Mx8 bits DDR3 SDRAMs in

Contextual Info: Data Sheet Rev.1.2 14.08.2012 4096MB DDR3 – SDRAM ECC SO-DIMM Features: 204 Pin ECC SO-UDIMM SGN04G72G1BD2SA-xx W RT • 4GByte in FBGA Technology •     RoHS compliant Options:  Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11

DDR3 DIMM 240 pinout

Abstract: DDR3 slot 240 pinout DDR3 DIMM pinout DDR3 DIMM 240 pin names verilog code of prbs pattern generator DDR3 timing diagram DDR3 timing parameters ddr3 Designs guide DDR3 socket prbs pattern generator
Contextual Info: LatticeECP3 DDR3 Demo User’s Guide September 2010 UG38_01.0 Lattice Semiconductor LatticeECP3 DDR3 Demo User’s Guide Introduction This document provides technical information and instructions on using the LatticeECP3 DDR3 demo design. This demo demonstrates the functionality of the Lattice DDR3 IP core at a speed of 400 MHz and 800 Mbps using

Contextual Info: Memory Product Specification DDR3- 1066 Unbuffered DIMM Description The Module is DDR3-1066 CL7 Unbuffered Memory module. The Module density from 1GB to 4GB, it consists 128M/256Mx8 bit DDR3-1066 Synchronous DRAMs in FBGA packages, Memory Module intented for mounting into 240-pin edge connector sockets. The electrical and

SSTL-15

Abstract: 204 pin so-DIMM DDR3 connector SSTL15 256Mx8 sstl_15 204Pin SODIMM ddr3 204 DDR3-1066 MODULE MEMORY DDR3 DDR3 Connector Specification
Contextual Info: Memory Product Specification DDR3-1066 SO-DIMM Description The Module is DDR3-1066 CL7 Small Outline Memory module. The Module density from 1GB to 4GB, it consists it consists 128M/256Mx8 bit DDR3-1066MHz Synchronous DRAMs in FBGA packages, Memory Module intented for mounting into 204-pin edge connector sockets.

Contextual Info: Memory Product Specification DDR3- 1333 Unbuffered DIMM Description The Module is DDR3-1333 CL9 Unbuffered Memory module. The Module density from 1GB to 4GB, it consists 128M/256Mx8 bit DDR3-1333 Synchronous DRAMs in FBGA packages, Memory Module intented for mounting into 240-pin edge connector sockets. The electrical and

oz8681l

Abstract: OZ8681 RT8207AGQW 8681l P0603BDG 92hd80 RTL8111D MEK100-05-DPS RS880M RS880
Contextual Info: 1 2 3 4 PCB STACK UP A LAYER LAYER LAYER LAYER LAYER LAYER 1 2 3 4 5 6 5 6 7 8 01 LX89 SYSTEM DIAGRAM : TOP :GND : IN1 : IN2 : VCC : BOT DDR3-SODIMM1 DDR3 channel A DDR3-SODIMM2 CPU THERMAL SENSOR AMD Champlain PAGE 6,7 35mm X 35mm S1G4 Processor DDR3 channel B

Contextual Info: Data Sheet Rev.1.1 12.11.2010 4096MB DDR3 – SDRAM Ultra Low Profile ECC DIMM 240 Pin unbuffered ECC DIMM Features: SGU04G72H1BD2MT-CCRT 4096MB PC3-10600 in FBGA Technology RoHS compliant Options: • Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1066 MT/s CL7

Contextual Info: 240PIN DDR3 1066 UDIMM 1024MB With 128Mx8 CL7 TS128MLK64V1U Description Placement The TS128MLK64V1U is a 128M x 64bits DDR3-1066 unbuffered DIMM. The TS128MLK64V1U consists of 8pcs 128Mx8bits DDR3 SDRAMs in FBGA packages and a 2048 bits serial EEPROM on a 240-pin printed

Contextual Info: 240PIN DDR3 1333 Registered DIMM 2GB With 128Mx8 CL9 TS256MKR72V3UL Description Placement The TS256MKR72V3UL is a 256M x 72bits DDR3-1333 VLP Registered DIMM. The TS256MKR72V3UL consists of 18pcs 128Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and

Contextual Info: 240PIN DDR3 1333 UDIMM 1024MB With 128Mx8 CL9 TS128MLK64V3U Description Placement The TS128MLK64V3U is a 128M x 64bits DDR3-1333 unbuffered DIMM. The TS128MLK64V3U consists of 8pcs 128Mx8bits DDR3 SDRAMs in FBGA packages and a 2048 bits serial EEPROM on a 240-pin printed

Contextual Info: Data Sheet Rev.1.1 12.11.2010 4096MB DDR3 – SDRAM Ultra Low Profile ECC DIMM 240 Pin unbuffered ECC DIMM Features: SGU04G72H1BD2MT-CCRT 4096MB PC3-10600 in FBGA Technology RoHS compliant Options: • Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1066 MT/s CL7

samsung ddr3

Abstract: DDR3 socket datasheet DDR3 jedec ddr2 laptop pin DDR3 DIMM 240 pin names "DDR3 SDRAM" DDR3 1gb dimm DDR3 DIMM DDR3 dimm socket DDR3 socket
Contextual Info: Samsung DDR3 SDRAM Next-Generation Memory Will Reach 1.6Gb/second Samsung DDR3 Unbuffered DIMMs will be available in densities from 256MB to 2GB and DDR3; component densities are 512Mb to 1Gb. Massive Bandwidth and Low Power Consumption Tomorrow’s main memory standard, Samsung

Contextual Info: 240PIN DDR3 1066 Registered DIMM TS1GKR72V1N 8GB With 256Mx8 CL7 Description Placement The TS1GKR72V1N is a 1G x 72bits DDR3-1066 Registered DIMM. The TS1GKR72V1N consists of 36pcs 256Mx8bits DDR3 SDRAM in FBGA package, 1 pcs register in 176 ball TFBGA package and a 2048 bits

Contextual Info: 240PIN DDR3 1333 ECC UDIMM TS256MLK72V3N 2048MB With 256Mx8 CL9 Description Placement The TS256MLK72V3N is a 256M x 72bits DDR3-1333 ECC Unbuffered-DIMM. The TS256MLK72V3N consists of 9pcs 256Mx8bits DDR3 SDRAMs in FBGA packages and a 2048 bits serial EEPROM on a 240-pin printed

Contextual Info: 204PIN DDR3 1066 SO-DIMM 1024MB With 128Mx8 CL7 TS128MSK64V1U Description Placement The TS128MSK64V1U is a 128M x 64bits DDR3-1066 SO-DIMM. The TS128MSK64V1U consists of 8pcs 128Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.

Contextual Info: 240PIN DDR3 1333 Registered DIMM TS512MKR72V3N 4GB With 256Mx8 CL9 Description Placement The TS512MKR72V3N is a 512M x 72bits DDR3-1333 Registered DIMM. The TS512MKR72V3N consists of 18pcs 256Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and a 2048 bits