DATA SHEET OF BALL GRID ARRAY Search Results

amkor CABGA 56

Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
Contextual Info: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,

Signetics

Abstract: 19X19 19X19MM
Contextual Info: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics FBGA Signetics Fine Pitch Ball Grid Array Package FBGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and can be customized for use in an infinite number of applications. This

W2639A

Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
Contextual Info: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.

gk 7031

Contextual Info: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.

E679

Abstract: Amkor CSP mold compound chiparray amkor MO-192 Amkor mold compound Amkor Wafer level mold compound amkor polyimide
Contextual Info: LAMINATE data sheet Stacked CSP Features: Stacked CSP SCSP : The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking

nitto GE-100L

Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
Contextual Info: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA

PC Oscilloscope Probe

Abstract: N5426A Oscilloscope Probe to PC Probe Oscilloscope Connecting Oscilloscope Probe to PC W2631-97000 81204A AGILENT 1134A AGILENT TECHNOLOGIES DDR2 x32
Contextual Info: W2630A Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630A series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes Features The Agilent W2630A series DDR2

Contextual Info: W2630 Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630 Series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes Features The Agilent W2630 Series DDR2

DS7409HGB

Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
Contextual Info: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of

N5426A

Abstract: W3630 TP28-TP30 W3635A W2633B TP40 N5451A Oscilloscope Probe to PC B4621A 5990-3179EN
Contextual Info: W2630 Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630 Series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes Features The Agilent W2630 Series DDR2

Contextual Info: LAMINATE data sheet Features: et CSP Package: Thermal Performance: Amkor's etCSP® package is the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. This package can squeeze into applications requiring a thin form factor. The

Contextual Info: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers

diode b6 k 450

Abstract: RT1300B6 RT2300B6 RT2300B6TR7 TR13 UCC561 LVD SCHEMATIC DIAGRAM CTS RESISTOR NETWORK CTS ARRAY
Contextual Info: LVD SCSI Terminator Technical Data Sheet RoHS Compliant Parts Available Description Features This LVD SCSI termination network is designed for high performance active termination of SCSI networks compliant to SPI-2 Ultra2 , SPI-3 (Ultra3) and beyond. Designed with a ceramic substrate and a ball grid array

N5426A

Abstract: N5451A PC Oscilloscope Probe W3630A W3635A DDR3 pin out quaddie ddr3 B4621A E2677A W3630
Contextual Info: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers and

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 1.27 mm Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04) Note: The actual shape of corners may differ from the dimension.

272-PIN

Abstract: BGA-272P-M01
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC BGA-272P-M01 272-pin plastic T-BGA Lead pitch 1.27 mm Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01) Note: The actual shape of corners may differ from the dimension.

led matrix circuits

Abstract: bga48 48-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index BGA-48P-M06 48-pin plastic BGA Lead pitch 1.0 mm Pin matrix 6x8 Sealing method Plastic mold BGA-48P-M06 48-pin plastic BGA (BGA-48P-M06) Note: The actual shape of coners may differ from the dimension.

Contextual Info: PA300PS-MA 300 mm Semi-Automatic Probe System DATA SHEET The PA300PS-MA is the world’s only analytical probe system for ine-pitch probing of pads down to 30 m x 30 μm, veriication of ball grid arrays and the most universal tool for wafer-level reliability WLR tests with 220 mm or 320 mm Celadon tiles. The semiautomatic probe system employs the powerful ProbeShield technology, enabling accurate low-noise measurements of atto amps

Contextual Info: Precision Ceramic Precision Ceramic Ball Grid Arrays Ball Grid Arrays Precision CHC-Precision SeriesCeramic HC-Precision Ball Grid Arrays tolerances to ±0.05% • RatioSeries atio tolerances to ±0.05% Absolute tolerances to ±0.1% bsolute tolerances to ±0.1%

Contextual Info: Precision Ceramic Resistors Ball Grid Arrays Make Possible Precision Ceramic Precision Ceramic HC-Precision Series Ball Grid Arrays atio tolerances to ±0.05% Ball Grid Arrays bsolute tolerances to ±0.1% CHC-Precision Series oHS compliant terminations available

Contextual Info: BGA Products Aries has tooled and patented two ball grid array contact pins. The BallLock contact was designed for production applications, and has been incorporated into both a standard and a zero insertion force socket. The BallNest™ contact pin was designed to provide a four-fingered “nest” for each ball termination of the device to be socketed.

Contextual Info: Resistors Make Possible Ceramic Ball Grid Termination Arrays Ceramic Ball Grid Ceramic Ball Grid CHC Series Termination Arrays Superior TaNFilm resistors on ceramic substrate Termination Arrays High density networks on a reduced footprint High purity alumina

Contextual Info: Ceramic Ball Grid Termination Arrays CHC Series Ceramic Ball Grid •Ceramic Superior TaNFilm resistors on ceramic substrate Ball Grid ·Termination High density networks on a reduced footprint Arrays ·Termination Excellent high frequency performance Arrays