ADV0505
Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Contextual Info: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The
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adv0505and1412c-0707-e1912f-1111-119+131f3-1313-d191f1-1717-a1912u-1919-g1912y-2323-91912y-3333-41912y-3535-419fbga-484daewon traydaewonfbga672peak tray bgafbga256daewon bga 7x7
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daewon
Abstract: DAEWON drawing
Contextual Info: u Chapter 7 Trays Organic Pin Grid Array: 453-Pin OGF Notes: See next page for detailed views 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 60°C. 3 This drawing is for trays manufactured by DaeWon Semiconductor Packaging C
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daewon
Abstract: Trays DAEWON drawing 453-Pin
Contextual Info: u Chapter 7 Trays Ceramic Pin Grid Array: 321-Pin, 453-Pin CGF Notes: See next page for detailed views 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 65°C. 3 This drawing is for trays manufactured by DaeWon Semiconductor Packaging Co.
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321-pin453-pindaewontrays+1daewon drawing
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DAEWON tray drawing
Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
Contextual Info: Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect
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daewon tray drawing124-48ld-119daewon jedec traydaewon+61ec-08ld-919kostat traydaewon trayfbga tray kostatkostat tsop trayks8503
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Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher
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and5-741-9148kostat trayks-8308camtex+7kostatdaewon tray 48daewon tray drawingjedec kostatceramic pin grid array cpga amddaewond-12g-56ld-a13
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DAEWON tray 48
Abstract: daewon tray daewon 3476a 12B-0609-F19 12B-0608-F19 VBK048 TRAY MPPO DAEWON FBGA FBGA 6x8
Contextual Info: Chapter 5 Trays Fine-Pitch Ball Grid Array: FAA 064 322.6 315.0 * 2.54 R. 4 PLACES VACUUM PICKUP CELLS 10 PLACES (6 CENTER CELLS, 4 SIDE CELLS) 5.62* X 7.62 SEE DETAIL "D" Z Y SEE DETAIL "E" X X 112.0 135.9* ±0.25 92.1 * 16.00 B 12.7 * 11.95 CHAMFER
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3417-1a27458b3467b26040h+10daewon tray 48daewon traydaewon3476a12b-0609-f1912b-0608-f19vbk048tray mppodaewon fbgafbga 6x8
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daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
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an-071-5hand-0444daewon traydaewon t0809050+8daewon tray 1f1-1717-axxstrapack s-669daewon tray 48daewon jedec traydaewon fbgaks-880851f1-1717-axxtray bga
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daewon
Abstract: TRAY MPPO DAEWON tray 48 33 x 33 DAEWON tray FBD63 tray 8X14 FBC 30 A DAEWON 64 8X14 12b-0809-f19
Contextual Info: Chapter 5 Trays Fine-Pitch Ball Grid Array: FBC 048, VBD 064 322.6 REF. 2.54 R. 4 PLACES 6.35* 315.0* VACUUM PICKUP CELLS 18 PLACES 16 CENTER CELLS, 2 SIDE CELLS SEE DETAIL "D" X Y CLOSED CELLS 8 PLACES 7.62 Z SEE DETAIL "E" X X 119.9 ±0.25 135.9* 92.1
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26048i3412-2a26396ffbd63+1112f-0814-d193412-2bdaewontray mppodaewon tray 4833 x 33 daewon traytray 8x14fbc 30 adaewon 648x1412b-0809-f19
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DAEWON tray drawing
Abstract: TRAY MPPO daewon tray daewon mppo 12c daewon thee 12C-1111-E19 CABGA MPPO 12C-1111-E261
Contextual Info: R E V IS IO N S REV 01 02 DESCRIPTION MPPO 150‘C TRAY ADDED NEW PACKAGE, AC/ACG 100 & NOTES DATE 0 2 /2 1 /0 5 0 6 /0 1 /0 6 APPRO VED K K Thee KK Thee 6.35 S E E D ETA IL 'D ' !-»! 0.20 »3=DIAfzWI -10.20 M IAI X (M 7.62 m 311.15 - • +0.25 -0.13
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11x11msc17011p7-134-msc-1702+10daewon tray drawingtray mppodaewon traydaewon mppo 12cdaewonthee12c-1111-e19cabgamppo12c-1111-e261
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daewon
Abstract: 3472A DAEWON tray 10 x 9 12B-8116-119 12B-0811-119 DAEWON FBGA 8X11 daewon* fbga DAEWON FBGA TRAY MPPO daewon* fbga 8*11
Contextual Info: Chapter 5 Trays Fine-Pitch Ball Grid Array: FLA 069, VBG 080, FEE 088, TLE 088, TSA 088, VBG 088, VBL 088 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 14 PLACES SEE DETAIL "D" X Y (12 CENTER CELLS, 2 SIDE CELLS) 6.35 * 7.62 BUMPS 11 PLACES Z SEE DETAIL "E"
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3472b26946hf27839b-opt2daewon+93472adaewon tray 10 x 912b-8116-11912b-0811-119daewon fbga 8x11daewon* fbgadaewon fbgatray mppodaewon* fbga 8*11
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12B-0608-F19
Abstract: DAEWON tray 48 daewon daewon tray FBGA 6x8 TRAY fbga 6X8 DAEWON FBGA MPPO fBGA package tray 3466A
Contextual Info: Chapter 5 Trays Very Very Thin Small Outline No Lead Package: WNF 008 322.6 2.54 R. 4 PLACES * 315.0 VACCUM PICKUP CELLS 14 PLACES Y (12 CENTER CELLS, 2 SIDE CELLS) CLOSED CELLS 2 PLACES 6.35 SEE DETAIL "D" X BUMPS 12 PLACES * 7.62 Z SEE DETAIL "E" X
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daewon tray
Abstract: daewon TRAY MPPO 56LD MPPO DAEWON 100 3468B
Contextual Info: Chapter 5 Trays Shrink Small Outline Package: SSO 056 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 8 PLACES 6.35 * X Y 7.62 Z (4 CENTER CELLS, 4 SIDE CELLS) SEE DETAIL "E" X X 105.90 ±0.25 135.9* 92.1 * 21.18 B 12.7 * 25.70 15.00 16.15 CHAMFER
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3468b26254ddaewon traydaewon+4tray mppo56ldmppodaewon 100
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daewon
Abstract: DAEWON tray 48 daewon tray 260 9 130 451 044 DAEWON FBGA 9 140 010 044 daewon tray TRAY MPPO
Contextual Info: Chapter 5 Trays Fine-Pitch Ball Grid Array: NLB 044, VDA 044, VDD 044, NLB 056, NSB 056 3416 \ f27328a \ 12-13-07 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 17 Oct 2008 5-63
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3469b
Abstract: daewon tray daewon FBe63 DAEWON FBGA MPSU 60 transistor DETAIL FBGA tray TRAY DAEWON MPSU
Contextual Info: Chapter 5 Trays Fine-Pitch Ball Grid Array: UDA 048, VDG 048 3535 \ 28809b \ 1.5.5 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 15 Aug 2007 5-35 Chapter 5 Trays Fine-Pitch Ball Grid Array: UDA 048, VDG 048
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EN4900GC
Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
Contextual Info: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.
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pcn1-110704efm32g890f128j-std-020djesd22-a113+15jesd22-a104c/125jesd22-a103jesd22-a102jesd22-a110en4900gcnc7720cel9220hf10eme-g760leme-g760hl832nxayizbondhitachi en4900gccel9220ds-7409hg
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daewon
Abstract: DAEWON FBGA LAA064 FBGA 137 DAEWON LAA
Contextual Info: Chapter 5 Trays Fine-Pitch Ball Grid Array: LAA 064, LSA 064, LSE 064, LAA 080, LSB 080, MMB 112, FTM 115, FTM 137, FVE 137, FWC 137, FWD 137 3694 \ f27326 \ 5.21.8 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook
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daewon
Abstract: VDJ044 TRAY MPPO Trays 14 x 20 DAEWON FBGA
Contextual Info: Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ 044 3648 \ f28384b \ 8.1.7 Notes: See next page for detailed views 1 All dimensions are in millimeters. Packages and Packing Methodologies Handbook 6 Dec 2007 5-39 Chapter 5 Trays Fine-Pitch Ball Grid Array: NLD 044, VDE 044, VDJ044
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daewon
Abstract: DAEWON tray 48 3471A daewon tray DAEWON FBGA
Contextual Info: Chapter 5 Trays Fine-Pitch Ball Grid Array: NLA 048, NSA 048, VDC 048, NLA 060, MTA 133, NLC 133 322.6 2.54 R. 4 PLACES * 315.0 VACUUM PICKUP CELLS 10 PLACES BUMPS 8 PLACES Y (2 CENTER CELLS, 8 SIDE CELLS) 6.35 * SEE DETAIL "D" X 7.62 Z SEE DETAIL "E"
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DAEWON tray drawing
Abstract: TRAY 15X15 daewon tray daewon CABGA daewon msc1701 TRAY MPPO Package tray 15X15 DAEWON drawing MSA-3032
Contextual Info: REVISIONS REV 02 OBS D E S C R IP T IO N ADDED NEW PACKAGE - D A TE B C /B C G 196 & B F /B F G 2 8 9 OBSOLETE THE DRAWING CONVERTED TO P 7 - 2 4 6 - 0 0 0 A PPRO V ED 1 1 /0 1 / 0 7 0 5 /1 5 /0 9 KK Thee KK Thee 6 .3 5 S E E D E T A IL 'D ' !-»! o.go (H) I a T x W I
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p7-246-00015x15-30vsmsc17011+12p7-139-msc-1707daewon tray drawingtray 15x15daewon traydaewon cabgadaewonmsc1701tray mppopackage tray 15x15daewon drawingmsa-3032
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daewon
Abstract: CO-029 daewon tray 21154-AB 125-3131-913N DAEWON JEDEC TRAY Shipping Trays 21154-BB
Contextual Info: Product Change Notification PCN #: 809 Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.
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CABGA 8X8
Abstract: DAEWON tray drawing 12C-0808-E19 BFG 183 MSA-3032 daewon CABGA daewon tray E261 msc1701 daewon
Contextual Info: REVISIONS REV 00 01 DESCRIPTION IN IT IA L R ELEASE A DDED NEW PAC KA G E - — 6,35 DATE 0 1 /1 4 /0 5 APPROVED QUAN LUU 0 4 /2 2 /0 9 KK Thee B F /B F G 81 h0-l Q.gQ H I aTxWI — 7,62 -|Q.gQ(H)|A|Z(l 311.15- +0.25 -0.13 -1 3 2 .0 8 • +0.25 -0.13
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83-lovsp7-176-000msc-1777msc17011+10cabga 8x8daewon tray drawing12c-0808-e19bfg 183msa-3032daewon cabgadaewon traye261msc1701daewon
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FC-BGA
Abstract: T0812012 daewon tray
Contextual Info: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.
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KS-886H
Abstract: Kostat tray
Contextual Info: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive
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DAEWON tray drawing
Abstract: TRAY DAEWON MPSU DAEWON tray 48 daewon CABGA MPSU 140 DAEWON tray 10 x 9
Contextual Info: 6 3 1 REVISION HISTORY NDTE i 1. TRAYS MUST MEET A L L REQUIREMENTS OF AMKDR/ANAM # 01-0431-228 3 PROCUREMENT SPEC FDR SHIPPING TRAY. 2. B A K EA B LE TRAYS ARE INTENDED TD BE CONTINUOUSLY BAKED FDR 48 HDURS AT THE BAK E TEMPERATURE AS SPECIFIED . 3. TDTAL U SA BLE C E L L CDUNT IS 220.
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