PAL 007 E
Abstract: PAL 007 c PAL 007 B PAL 007 A PAL 007 BGA356 LS-BGA356A-11 BGA-356
Contextual Info: BGA356A Tooling hole X2 Y See BGA pattern code to the right for actual pattern layout Ø 0.508mm pad 1.27mm 31.75mm Top View (reference only) X Variable 1 5.33mm [0.210"] 3.75mm [0.147"] 31.75mm 0.36mm±0.03mm 2 Top View of Land Pattern Scale: 2:1 Side View
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bga356a508mmfr4/g10ls-bga356a-11+7pal 007 epal 007 cpal 007 bpal 007 apal 007bga356bga-356
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BGA356
Abstract: BGA-356 SF-BGA356A-B-11
Contextual Info: D Package Code: BGA356A C 31.75mm [1.250"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] X 31.75mm [1.250"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]
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bga356afr4/g10sf-bga356a-b-11bga356+1bga-356
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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bga16a1atternsbga676bga665bga-1156+7156 qfn 12x12lga240bga-783bga441bga1024bga15217286x
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FPQ-256
Abstract: TSC695 F User Manual transistor bra 94 TSC695 E310D bra15 FPQ-256-0 Flash SIMM 72 29F040 SPARC V7.0 ERC32
Contextual Info: eVAB-695 Rad-Hard Evaluation Board TSC695 Embedded Processor Hardware User’s Manual Rev.E - 22 March, 2001 1 eVAB-695 Hardware User’s Manual Information Foreword Atmel Nantes S.A. reserves the right to make changes in the products or specifications contained in this document
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evab-695tsc695tsc695eevab-695e+9fpq-256tsc695 f user manualtransistor bra 94e310dbra15fpq-256-0flash simm 72 29f040sparc v7.0erc32
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M5819P
Abstract: 5-pin smd c255 NPN C239 C312 diode c227 diode MOSFET R166 SPE1302-ND S5920Q NPN C246 diode c248
Contextual Info: AMD K6 SDB - TOP LEVEL Revised: Friday, March 12, 1999 K6SDBREVB Revision: REV C Item Quantity Reference Value _ 1 2 1 BT1 27 C1,C2,C4,C8,C12,C20,C21, C23,C26,C36,C37,C38,C42, C47,C56,C59,C60,C61,C62, C63,C64,C68,C79,C95,C97,
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qfp160100mhzssop4832-bit+16qfp208ts040qfp144tp11sh8pe68515plcc32m5819p5-pin smd c255npn c239c312 diodec227 diodemosfet r166spe1302-nds5920qnpn c246diode c248
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panasonic inverter manual vf 100
Abstract: ALI m1541 a1 M5819P ali m1543c ALI m5819 ALI m1541 ali M5819P m1543 BAV99DI Am79C792
Contextual Info: K6Esdb.book Page 1 Thursday, June 24, 1999 11:34 AM %1 /¬ 4VSGIWWSV *EQMP] 'SQTEGX4'- '49 &SEVH 9WIV W 1ERYEP Order #22650A K6Esdb.book Page ii Thursday, June 24, 1999 11:34 AM AMD-K6 E Processor Family CompactPCI CPU Board User’s Manual Ã8
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p3c9 -00 01
Abstract: FPQ-256 pinout socket 754 ERC32 fpq-256-0.508-01 74LV04-U34 bra15 TSC695 xx245 Flash SIMM 72 29F040
Contextual Info: Evaluation Board TSC695 . User Guide Table of Contents Section 1 Introduction . 1-1
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tsc6954139fp3c9 -00 01fpq-256+7pinout socket 754erc32fpq-256-0.508-0174lv04-u34bra15xx245flash simm 72 29f040
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ADV0505
Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Contextual Info: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The
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adv0505and1412c-0707-e1912f-1111-119+131f3-1313-d191f1-1717-a1912u-1919-g1912y-2323-91912y-3333-41912y-3535-419fbga-484daewon traydaewonfbga672peak tray bgafbga256daewon bga 7x7
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