PAL 007 E
Abstract: PAL 007 c PAL 007 B PAL 007 A PAL 007 BGA356 LS-BGA356A-11 BGA-356
Contextual Info: BGA356A Tooling hole X2 Y See BGA pattern code to the right for actual pattern layout Ø 0.508mm pad 1.27mm 31.75mm Top View (reference only) X Variable 1 5.33mm [0.210"] 3.75mm [0.147"] 31.75mm 0.36mm±0.03mm 2 Top View of Land Pattern Scale: 2:1 Side View
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bga356a508mmfr4/g10ls-bga356a-11+7pal 007 epal 007 cpal 007 bpal 007 apal 007bga356bga-356
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BGA356
Abstract: BGA-356 SF-BGA356A-B-11
Contextual Info: D Package Code: BGA356A C 31.75mm [1.250"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] X 31.75mm [1.250"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]
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bga356afr4/g10sf-bga356a-b-11bga356+1bga-356
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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bga16a1atternsbga676bga665bga-1156+7156 qfn 12x12lga240bga-783bga441bga1024bga15217286x
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