CY6117A Search Results

Contextual Info: ^ ä CY6116A CY6117A 5 s : f'Y PPF’RÇ 'W - SEMICONDUCTOR 2048 x 8 Static RAV RAM Features Functional Description • Automatic power-down when deselected T h e C Y b t 16A andC Y 6117A arehigh-perform anceC M O S static R A M sorganizedas 2048 w ords by 8 bits. Easy m em ory expan­

17A45

Abstract: 6117a
Contextual Info: = ~ _ CY6116A CY6117A m s W0 SEMICONDUCTOR 2048 x 8 Static R/W RAM Features F unctional D escription • A utom atic pow er-dow n w hen d eselected The1C Y 6 1 l6 A a n d C Y 6 1 l7 A a re h ig h -p e rfo rm a n c c C M O S s ta tic R A M s o rg a n iz e d as

6117a

Abstract: MA 6116A dc 6117a CY6116A-55DMB
Contextual Info: CY6116A CY6117A CYPRESS SEMICONDUCTOR Functional Description Features Automatic power-down when deselected CMOS for optimum speed/power Highspeed — 20 ns Low active power — 550 mW 1 Low standby power — 110 mW TTL-compatible inputs and outputs Capable of withstanding greater

6116A

Abstract: CY6116A-55DMB 6117a MA 6116A CY6116A CY6117A 6116A-55
Contextual Info: 6116A: 11/8/89 Revision: Monday, November 8, 1993 CY6116A CY6117A Features Pin Configurations DIP/SOJ Top View A6 2 23 A8 A5 3 22 A9 A4 4 21 WE A3 5 25 WE OE A2 6 24 OE 19 A10 NC 7 23 A10 18 CE NC 8 22 NC 21 NC 8 17 I/O7 9 16 I/O6 10 I/O2 11 14 I/O4 GND 12

6116A25

Abstract: CY6116A CY6117A CY6116A-55DMB
Contextual Info: 6116A: 11/8/89 Revision: Monday, November 8, 1993 CY6116A CY6117A Features Pin Configurations DIP/SOJ Top View A6 2 23 A8 A5 3 22 A9 A4 4 21 WE A3 5 25 WE OE A2 6 24 OE 19 A10 NC 7 23 A10 18 CE NC 8 22 NC 21 NC 8 17 I/O7 9 16 I/O6 10 I/O2 11 14 I/O4 GND 12

CY6116

Abstract: HM6116 MK48Z02 DS1220Y-200 DALLAS 24PIN CY7C128-45 CY7C128-55 CY7C128A-15 CY7C128A-20 CY7C128A-25
Contextual Info: - 16 K 'f X m % it £t ¿&&ÍEH OC TAAC aax ns) TCAC (us) nMOS S t a t i c RAM (2 0 4 8 x 8 ) f iî TOE max (ns) TOH min (ns) TOD max (ns) TWP «in (ns) TDS •in (ns) M « TDH min (ns) TWD min (ns) TWR max (ns) V D D or V C C (V) 24PIN IDD aax (ibA) A I DD STANDBY

QP7C128A

Abstract: QP6116A 8403609XA IDT6116LA90EB ns8002 8403601ja 84036143A IDT6116LA45L32B QP6116A-35DMB qml-38535
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA Change to vendor similar part number for vendor CAGE number 61772 for devices 08KX, 09KX, 10KX, 11KX, 12KX, 13KX, 14KX, 15KX, and 16KX. Remove vendor CAGE number 61772 from devices 08YX, 09YX, 10YX, 11YX, 12YX, 13YX, 15YX, and 16YX. Change to vendor

DS1220Y-200 DALLAS

Abstract: CY6116 HM6116 HM6116-2 CY6116-45 CY6116A-20 CY6116A-25 CY7C128A-55 HM6116AP-10 hm6116 battery
Contextual Info: - 16 K X m % í± £ CC TAAC max ns) TCAC max (ns) CMOS S t a t i c RAM (2 0 4 8 X 8 ) € A TOE max (ns) TOH min (ns) TOD TWP min (ns) (ns) TDS Bin (ns) TDH min (ns) T*D min (ns) TWR nax (ns) V D D or V C C IV) 2 4 P I N 6 1 1 6 ¡6 X I DD- I DD STANDBY

cy3341

Abstract: 64K X 4 CACHE SRAM CY7C190 pasic380 cy7c189 palce22v10 programming guide palce16v8 programming algorithm STATIC RAM 6264 vhdl code for 8-bit parity checker 64x18 synchronous sram
Contextual Info: Product Selector Guide Static RAMs Organization/Density Density X1 X4 X4 SIO 7C147 2147 7C123 7C148 7C149 7C150 7C189 7C190 2148 2149 7C122 9122 93422 7C167A 7C168A 7C169A 7C170A 7C171A 7C172A 7C128A 7C187 7C164 7C166 7C161 7C162 7C185 6264 7C182 7C197 7C194

CY27S03A

Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Contextual Info: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability

L6116FMB90

Abstract: ns8002 qml-38535 CY6116A-55DMB 8403607ZA HM1-65162 84036103A IDT6116LA120EB IDT6116LA90EB 15KX
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA Change to vendor similar part number for vendor CAGE number 61772 for devices 08KX, 09KX, 10KX, 11KX, 12KX, 13KX, 14KX, 15KX, and 16KX. Remove vendor CAGE number 61772 from devices 08YX, 09YX, 10YX, 11YX, 12YX, 13YX, 15YX, and 16YX. Change to

CY7C9101

Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
Contextual Info: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the