CQFP 52 LEAD Search Results

smd A018

Abstract: top mark smd A12 CQFP top mark smd A9 smd A018 3 pin A13 smd Mark A12 SMD smd a7 transistor smd transistor a4 smd transistor A8
Contextual Info: WS512K32-XXX 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25, 35, 45, 55nS ■ Packaging • 66 pin, PGA Type, 1.385 inch square, Hermetic Ceramic HIP Package 402 , SMD Number 5962-94611 • 68 lead, 40mm Hermetic Low Capacitance CQFP, 5.1mm

O28 Package

Contextual Info: WS128K32-15XX 128Kx32 SRAM MODULE ADVANCED* FEATURES • Access Times of 15nS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP Package 400 • 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502), Package to be developed

Contextual Info: WED8LM32513C HI-RELIABILITY PRODUCT 512Kx32 SRAM MODULE PRELIMINARY* FEATURES • Access Times of 15*, 17, 20, 25, 35, 45, 55ns ■ Low Power CMOS ■ Packaging ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation • 68 lead, 23.88mm Low Profile CQFP, 3.56mm 0.140"

WF4M32-XXX5

Contextual Info: WF4M32-XXX5 White Electronic Designs PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES „ „ „ „ „ Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package

WF4M32-XXX5

Contextual Info: White Electronic Designs WF4M32-XXX5 PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package 502), 3.5mm (0.140") height.

CERAMIC QUAD FLATPACK CQFP

Abstract: CQFP 240
Contextual Info: CQFP.FRM Page 1 Tuesday, February 9, 1999 4:20 PM CQFP Packaging Capabilities Surface Mount Description The Ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher lead count and smaller lead pitch than most

Contextual Info: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

WS128K32-XG2TXE

Contextual Info: White Electronic Designs WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES Access Times of 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509) Built in Decoupling Caps and Multiple Ground Pins

WF2M32-XXX5

Contextual Info: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square

WS512K32-XXX

Abstract: WS512K32-XG2TX1
Contextual Info: White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 70, 85, 100, 120ns ■ 5V Power Supply ■ Packaging ■ Low Power CMOS • 68 lead, Hermetic CQFP G2T 1, 22.4mm (0.880 inch) square. 4.57mm (0.180 inch) high (Package

smd code F18

Abstract: act-s512k32n 5962-9461110HTC ACT-S512K32N-017P7Q 5962-9461110 CQFP 80 footprint cqfp 280
Contextual Info: ACT–S512K32 High Speed 16 Megabit SRAM Multichip Module Features • 4 Low Power CMOS 512K x 8 SRAMs in one MCM ■ Factory configured as 512K x 32; User configurable as 1M x 16 or 2M x 8 ■ Input and Output TTL & CMOS Compatible Design ■ Fast 17,20,25,35,45,55ns Access Times

WS128K32-XG2TXE

Contextual Info: WS128K32-XG2TXE HI-RELIABILITY PRODUCT 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLERANT FEATURES • 5 Volt Power Supply ■ Access Times of 35, 45, 55ns ■ Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509) ■ Organized as 128Kx32; User Configurable as 256Kx16

WS128K32-XG2TXE

Contextual Info: White Electronic Designs WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES „ Access Times of 35, 45, 55ns „ TTL Compatible Inputs and Outputs „ Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"), (Package 509)

Contextual Info: WS128K32-XG2TXE ADVANCED* 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT FEATURES  Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation  Access Times of 35, 45, 55ns  Packaging • 68 lead, 22.4mm CQFP G2T , 4.57mm (0.180"),

S128K32

Abstract: ACT-S128K32 ACT-S128K32V 5962-9559509HMX 5962-9318710H4X
Contextual Info: ACT-S128K32 High Speed 4 Megabit SRAM Multichip Module Features • 4 Low Power CMOS 128K x 8 SRAMs in one MCM ■ Overall configuration as 128K x 32 ■ Input and Output TTL Compatible ■ 17, 20, 25, 35, 45 & 55ns Access Times, 15ns Available by Special Order

511S

Abstract: WS1M32-XG3X ah55
Contextual Info: WS1M32-XG3X 1Mx32 SRAM MODULE PRELIMINARY* FEATURES • Access Time of 70, 85, 100, 120ns ■ TTL Compatible Inputs and Outputs ■ 84 lead, 28mm CQFP, Package 511 ■ 5 Volt Power Supply ■ Organized as two banks of 512Kx32, User Configurable as 1Mx16 or 2Mx8

WS1M32V-XG3X

Contextual Info: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES n Access Times of 17, 20, 25ns n 3.3 Volt Power Supply n 84 lead, 28mm CQFP, Package 511 n Low Power CMOS n Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8

2 010 073 007

Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
Contextual Info: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a

WS1M32-XG3X

Contextual Info: WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as

WS1M32V-XG3X

Contextual Info: White Electronic Designs WS1M32V-XG3X PRELIMINARY* 1Mx32 SRAM 3.3V MODULE FEATURES Access Times of 17, 20, 25ns 3.3V Power Supply 84 lead, 28mm CQFP, Package 511 Low Power CMOS Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 Built-in Decoupling Caps and Multiple Ground Pins

CQFP 240 Aeroflex

Abstract: 5962-9461110 military mcm 1553 5962-9461108 5962-9461109 5962-9461108hxc O28 Package 5962-9461109HM 5962-9461110HMC a1855
Contextual Info: ACT–S512K32 High Speed 16 Megabit SRAM Multichip Module Features • 4 Low Power CMOS 512K x 8 SRAMs in one MCM ■ Factory configured as 512K x 32; User configurable as 1M x 16 or 2M x 8 ■ Input and Output TTL & CMOS Compatible Design ■ Fast 17,20,25,35,45,55ns Access Times

512k32n

Abstract: SRAM 35ns
Contextual Info: ¥71 ! I • : L | 12 ET -b u . m -ft £ ì ì ■ ■1 à d l >1 1■ ■ 1- \ 4 ■ t r i t u 5Ì Features ■ 4 Low Power CMOS 512K x 8 SRAMs in one MCM ■ Factory configured as 512K x 32; User configurable as 1M x 16 or 2M x 8 ■ Input and Output TTL & CMOS Compatible Design

WS1M32-XG3X

Contextual Info: White Electronic Designs WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES „ Access Times of 17, 20, 25ns „ Low Power CMOS „ Packaging „ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation „ Weight • 84 lead, 28mm CQFP, Package 511 „ Organized as two banks of 512Kx32, User

WS1M32V-XG3X

Contextual Info: WS1M32V-XG3X HI-RELIABILITY PRODUCT 1Mx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as