CQ196 Search Results

FP160

Contextual Info: 1-278 o o o o o o o o o o o o ov o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o o

Contextual Info: Revision 3 Accelerator Series FPGAs – ACT 3 Family Features • Up to 10,000 Gate Array Equivalent Gates up to 25,000 equivalent PLD Gates • Highly Predictable Performance with 100% Automatic Placeand-Route • As Low as 9.0 ns Clock-to-Output Times (–1 Speed Grade)

ME 1117

Abstract: MO-113 175-PIN CERAMIC QUAD FLATPACK CQFP CQ208 CQ256 CQ84 PQ100 ceramic pin grid array package lead finish cpga dimensions
Contextual Info: Package Mechanical Drawings S e p t e m b e r 1997 1997 Actel Corporation 1-409 Ceramic Pin Grid Array 84-Pin CPGA .050" ± .010" Pin #1 ID .045 .055 0.18" ± .002" .100" BSC 1.100" ± .020" square .080" .110" L K J H G 1.000 BSC F E D C B A 1 2 3 4 5 6

RTSX32SU CQ84

Abstract: RT3PE3000L CQ256 CQFP 256 PIN actel A54SX32A SEU RT3PE600L Cqfp256 RTAX2000 ACTEL CCGA 624 mechanical rtax2000sl aircraft logic gates
Contextual Info: System-Critical FPGAs Product Catalog November 2009 Taking Designs from Earth to Outer Space Whether you’re designing for sea-level or 2,000,000 miles into space, Actel’s high-reliability, low-power FPGAs are your best choice. With a history of providing the most reliable, robust, low-power flash and antifuse-based FPGAs in

QFN108

Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
Contextual Info: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3

Contextual Info: RadTolerant Field Programmable Gate Arrays Features • Programming Technology Prevents Reverse Engineering and Design Theft General Characteristics • • TestedTotal Ionizing Dose TID Survivability Level • Packages: 132-Pin, 172-Pin, 196-Pin, and 256-Pin Ceramic

RT54SX72SCQ208

Abstract: A42MX16 RT54SX32S-CQ208 CQ208 CQ256
Contextual Info: v3.0 Component Selector Guide PCI 5.0 Volt Tolerant — 5 Volt I/O — Yes Yes Yes — — Yes 3.3 Volt I/O 3,000 2.5 Volt I/O Gates 36 JTAG I/O User I/O C, I SRAM Bits Screening –F, Std, –P Wide Decodes Speed Grade CS49 Flip-Flops/Dedicated Max Package

Theta JC of FBGA

Abstract: cpga dimensions cpga weight 84 pin plcc ic base
Contextual Info: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

MO-143

Abstract: 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Package Characteristics and Mechanical Drawings Package Thermal Characteristics Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Pin Count θjc θja θja Still Air 300 ft/min Unit 44 16 43 31 °C/W 68 13 36 25 °C/W 84 12 32 22

PG1005

Abstract: PG1335 PG207 PL84 PQ100 PQ160 PQ208 TQ176 VQ100 PG257
Contextual Info: Revision 2 Accelerator Series FPGAs – ACT 3 Family Features • Up to 10,000 Gate Array Equivalent Gates up to 25,000 equivalent PLD Gates • Highly Predictable Performance with 100% Automatic Placeand-Route • As Low as 9.0 ns Clock-to-Output Times (–1 Speed Grade)

transistor D883

Abstract: CQFP 172 PIN vr 201 act 1014 5962-9550801MYA A1020BL mya 111
Contextual Info: HiRel FPG A s Features 3 2 0 0 DX • Highly Predictable Performance with 100 Percent • 100 MHz System Logic Integration Automatic Placement and Routing • Highest Speed FPGA SFIAM, up to 2.5 Kbits Configurable Dual-Port SFIAM • Device Sizes from 1200 to 20,000 gates

Contextual Info: Æ ic te ! RadTolerant Field Programmable Gate Arrays - m Features • Programming Technology Prevents Reverse Engineering and Design Theft General Characteristics • • TestedTotal Ionizing Dose TID Survivability Level • Packages: 132-Pin, 172-Pin, 196-Pin, and 256-Pin Ceramic

Contextual Info: Æ ic t e ! v 3 .0 - m RadTolerant Field Programmable Gate Arrays Features • 100%Resource Utilization with 100%Pin-Locking General Characteristics • Secure Programming Technology Pre\ents Reverse Engineering and Design Theft

CQ256

Abstract: CQ208 4PMX 4pm smd
Contextual Info: te /e • / Speed Grade JTAG I/O 3.3 Volt 5 Volt PCI 5.0 Volt Tolerant at 3.3V VQ100 Std, - 1 , - 2 , - 3 129 8,000 256 512 - — Yes Yes — — Yes PQ208 Std, - 1 , - 2 , - 3 129 8,000 256 512 — — Yes Yes — — Yes TQ144 Std, - 1 , - 2 , - 3 129 8,000

RT1280A

Abstract: actel a1020b A1425A 2284r RT14100A CQFP 172 PIN A1020B
Contextual Info: v 3. 0 RadTolerant Field Programmable Gate Arrays Features General Characteristics • Tested Total Ionizing Dose TID Survivability Level • No Single Event Latch-up Below a Minimum LET Threshold of 80 MeV-cm2/mg for All RT Devices • Packages: 84-Pin, 132-Pin, 172-Pin, 196-Pin, and 256-Pin

baugh-wooley multiplier verilog

Abstract: 1BG25 LPQ100 9572xv BC356 LPQ240 block diagram baugh-wooley multiplier 4 BIT ALU design with vhdl code using structural XC3000A actel a1240
Contextual Info: LeonardoSpectrum Synthesis and Technology v1999.1 Copyright Copyright 1991-1999 Exemplar Logic, Inc., A Mentor Graphics Company All Rights Reserved Trademarks Exemplar Logic and its Logo are trademarks of Exemplar Logic, Inc. LeonardoSpectrum™, LeonardoInsight™, FlowTabs™, HdlInventor™, SmartScripts™,

Contextual Info: ^ c te l -m Package Characteristics and Mechanical Drawings P a c k a g e T h e rm a l C h a ra c te ris tic s Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Plastic Quad Flatpack (PQFP)

actel 5962

Abstract: ACTEL 1020B MAX4437 6ba1 5602m e/actel 1240a
Contextual Info: Æ ic te - m H i R e i F P G A ! v 2 .0 s Features 3 2 0 0 DX • H ighly P re d ic ta b le P erform ance w ith 100 Percent A utom atic P lacem ent and Routing • 100 M H z System Logic In teg ratio n • • Device Sizes from 1200 to 20,000 gates

cpga dimensions

Abstract: 132-PIN CERAMIC PIN GRID ARRAY CPGA actel a1240 5962-9322101MXC 10KRESISTOR NET IC LM 384 gn
Contextual Info: HiRel Field Programmable Gate Arrays F ea t u re s 3200DX * Highly Predictable Performance with 100 Percent Autom atic Placement and Routing * 100 MHz System Logic Integration * Device Sizes from 1200 to 30,000 gates * Highest Speed FPGA SRAM, up to 4 Kbits Configurable

Pl84

Contextual Info: Component Selector Guide April 1999 1999 Actel Corporation 1 Package Speed Grade SRAM Bits JTAG I/O 3.3 Volt 5 Volt PCI 5.0 Volt Tolerant at 3.3V VQ100 Std, –1, –2, –3 78 8,000 256 512 — — Yes Yes — — Yes PQ208 Std, –1, –2, –3 129 8,000

ms-029

Abstract: FBGA1152
Contextual Info: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

CQ256

Abstract: CQ208 CQ84 A32200DX PG176 RH1020B CQ196 CI624 A42MX36 dimensions A1240XL
Contextual Info: Actel Hermetic Package Mechanical Cavity, weight, Lid size and Heat Sink size configuration Package Devices Cavity CQ84 CQ84 CQ84 CQ84 A1020B RT1020B RH1020B A32100DX Up Up Up Up Weight (grams) 2.2 2.2 2.2 2.2 Lid (mils) 520x520 520x520 520x520 550x550 Head Sink