CP23 Search Results

BUT22

Contextual Info: TO SH IB A TMP87PP23 CMOS 8-Bit Microcontroller TMP87PP23F The TMP87PP23 is a One-Time PROM microcontroller with low-power 384K bits electrically programmable read only memory for the TMP87CM23A/CP23 system evaluation. The TMP87PP23 is pin compatible with the

7 seg. display single

Contextual Info: TO SH IB A TMP87CM23A/P23 CM OS 8-Bit M icrocontroller TMP87CM23AF, CP23F The TMP87CM23A/CP23 are the high speed and high performance 8-bit single chip microcomputers. These MCU contain, large ROM , RAM , input/output ports, LCD driver, a 8-bit AD converter, four multi-function

al p87 smd

Abstract: CSTCS8 TLCS-870 TMP87CM23AF TMP87CP23F TMP87PP23F
Contextual Info: TOSHIBA TMP87CM23A/P23 CMOS 8-Bit Microcontroller TMP87CM23AF, CP23F The TMP87CM23A/CP23 are the high speed and high performance 8-bit single chip microcomputers. These MCU contain, large ROM, RAM, input/output ports, LCD driver, a 8-bit AD converter, four multi-function

"Darlington Transistor"

Abstract: darlington transistor power CP230 CZT122 CJD122
Contextual Info: PROCESS CP230 Power Transistors NPN - Silicon Darlington Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 80 X 80 MILS Die Thickness 8 MILS Base Bonding Pad Area 18 X 27 MILS Emitter Bonding Pad Area 34 X 34 MILS Top Side Metalization Al - 30,000Å

2n3055

Abstract: 2N3055 transistor equivalent equivalent transistor 2n3055 power transistor 2n3055 2N3055 equivalent 2N3055 NPN Transistor datasheet 2n3055 NPN Transistor 2N3055 transistor 2n3055 transistor
Contextual Info: PROCESS CP235 Central Power Transistor TM Semiconductor Corp. NPN - Silicon Power Transistor Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 106 x 106 MILS Die Thickness 12 MILS Base Bonding Pad Area 25 x 33 MILS Emitter Bonding Pad Area 30 x 36 MILS

TMP87PP23F

Abstract: BM1185A TC571000D TMP87PP23
Contextual Info: TO SH IB A TMP87PP23 CMOS 8-Bit Microcontroller TMP87PP23F The TMP87PP23 is a One-Time PROM microcontroller with low-power 384K bits electrically programmable read only memory for the TMP87CM23A/CP23 system evaluation. The TMP87PP23 is pin compatible with the

86CM23-1

Abstract: TMP86PS23U IC LM 7812 P8LC TMP86CM23U TMP86CP23U TMP86PM23U
Contextual Info: TO SH IB A Under Development TMP86CM23/CP23 CMOS 8-Bit Microcontroller TMP86CM23U, CP23U The TM P86CM 23/CP23 are the high-speed, high-perform ance and low power consum ption 8 -bit microcomputer, including RO M , RA M , M u ltip ly Accum ulate U n it, LC D driver, multi-function timer/counter,

Contextual Info: Directional Coupler CP230 Product Features Application • Passive Integration on Silicon • Low Insertion Loss • High Isolation • Solder Pad • Low Cost • Pb Free / RoHS Compliant • Repeater • Base Station • RF Sub-Systems Description The CP Series is a monolithic directional coupler for low cost wireless applications.

CP27A

Abstract: TLCS-870
Contextual Info: Restriction on Use of the Interrupt Controller TOSHIBA Microcontrollers TLCS-870 Family TLCS-870/C Series TMP86C822 TMP86CM23/CM23A TMP86CM27 TMP86CH49 TMP86CH22 CP23/CP23A TMP86CP27/CP27A TMP86CM49 TMP86PH22 TMP86PM23 TMP86PS27 TMP86CS49 TMP86PS23 TMP86FS27

Contextual Info: TOSHIBA TMP87CM23/P23 CMOS 8-BIT MICROCONTROLLER TMP87CM23F, CP23F The TMP87CM23/CP23 are the high speed and high performance 8-bit single chip microcomputers. These MCU contain, large ROM, RAM, input/output ports, LCD driver, a 8-bit A/D converter, four multi-function

"Darlington Transistor"

Abstract: CJD122 CP230 CZT122 czt1
Contextual Info: PROCESS CP230 Power Transistor NPN - Silicon Darlington Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 80 X 80 MILS Die Thickness 8 MILS Base Bonding Pad Area 18 X 27 MILS Emitter Bonding Pad Area 34 X 34 MILS Top Side Metalization Al - 30,000Å

CQ 8.000 crystal 8Mhz

Abstract: FEF121
Contextual Info: TOSHIBA TMP87CM23/P23 CMOS 8-BIT MICROCONTROLLER TMP87CM23F, CP23F The TMP87CM23/CP23 are the high speed and high performance 8 -b it single chip microcomputers. These MCU contain, large ROM, RAM, in p u t/ou tp u t ports, LCD driver, a 8-b it A/D converter, fo u r m ulti-function

MX-38T

Abstract: BM1185A TC571000D TMP87PP23 TMP87PP23F CSAC4.00MGCm crystal oscillator, 8MHz, murata
Contextual Info: TO SH IB A TMP87PP23 CMOS 8-Bit Microcontroller TMP87PP23F The TMP87PP23 is a One-Time PROM microcontroller with low-power 384K bits electrically programmable read only memory for the TMP87CM23A/CP23 system evaluation. The TMP87PP23 is pin compatible with the

86CM23-148

Abstract: TMP86CM23U TMP86CP23U TMP86PM23U TMP86PS23U
Contextual Info: TO SH IB A Under Development TMP86CM23/CP23 CMOS 8-Bit Microcontroller TMP86CM23U, CP23U The TM P86CM 23/CP23 are the high-speed, high-perform ance and low power consum ption 8-bit microcomputer, including RO M , RA M , M u ltip ly Accum ulate U n it, LC D driver, multi-function timer/counter,

87CM23

Abstract: crystal oscillator, 8MHz, murata TMP87PP23F BM1185A QFP100-P-1420-0 TC571000D TMP87PP23 CRYSTAL SMD 4MHZ
Contextual Info: TO SHIBA TMP87PP23 CMOS 8-BIT MICROCONTROLLER TMP87PP23F The 87PP23 is a One-Time PROM microcontroller with low-power 384K bits electrically programmable read only memory for the 87CM23/CP23 system evaluation. The 87PP23 is pin compatible with the 87CM23/CP23.

87CM23

Abstract: CST400MGW OC23 QFP100-P-1420-0 TLCS-870 TMP87CM23F TMP87CP23F TMP87PP23F
Contextual Info: TOSHIBA TMP87CM23/P23 CMOS 8-BIT MICROCONTROLLER TMP87CM23F, CP23F The TMP87CM23/CP23 are the high speed and high performance 8-bit single chip microcomputers. These MCU contain, large ROM, RAM, input/output ports, LCD driver, a 8-bit A/D converter, four multi-function

CJD122

Abstract: CP230 CZT122
Contextual Info: PROCESS CP230 Power Transistor NPN - Silicon Darlington Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 80 x 80 MILS Die Thickness 8.0 MILS Base Bonding Pad Area 18 x 27 MILS Emitter Bonding Pad Area 34 x 34 MILS Top Side Metalization Al - 30,000Å

CP237

Abstract: 2n3725a 2N3725 transistor 2N3725 MPQ3725 MPQ3725A chip die npn transistor
Contextual Info: PROCESS CP237 Central Small Signal Transistor TM Semiconductor Corp. NPN - Saturated Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 30 x 30 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 4.4 x 12.5 MILS Emitter Bonding Pad Area

L528

Abstract: L537 BEAD
Contextual Info: 1 2 3 4 5 6 7 8 A A 1 C86 2 1 100P 0603B C87 2 1 100P 0603B C88 2 1 100P 0603B C89 2 1 100P 0603B C90 2 1 100P 0603B C91 2 1 100P 0603B C92 2 1 100P 0603B C93 2 B 0603B 0603B 0603B 0603B 0603B 0603B P13 P12 P19 P18 P17 P16 9 9 9 9 9 9 CP14 CP15 CP23 CP22 CP21

yx 801

Abstract: yx 801 led CPU 314 IFM timer and counter yx 801 led driver TLCS-870 TMP87CM23AF TMP87CP23F TMP87PP23F transistor SMD p92 CPU 314 IFM timer
Contextual Info: TO SH IB A TMP87CM23A/P23 CMOS 8-Bit Microcontroller TMP87CM23AF, CP23F The TMP87CM23A/CP23 are the high speed and high performance 8-bit single chip microcomputers. These MCU contain, large ROM, RAM, input/output ports, LCD driver, a 8-bit AD converter, four multi-function

Contextual Info: VISHAY Vishay Dale ▼ Wirewound/Metal Oxide Resistors, Commercial Power, Axial Lead FEATURES High performance for low cost Meets or exceeds requirements of EIA Standard RS-344 High power to size ratio Ceramic cases are available with circuit board stand-offs

cp153

Contextual Info: CP_ Vishay Dale Wi rewound/Meta I Oxide Resistors, Commercial Power, Axial Lead FEATURES • High performance for low cost • Meets or exceeds requirements of EIA Standard RS-344 • High power to size ratio • Ceramic cases are available with circuit board stand-offs

VME DAISY CHAIN

Abstract: vme case VME3000 QQQ0203 PLD VME MM5565 PLX448
Contextual Info: one VME 3000/3010 T'm c > . ~ o > - c j a v ^ VM EbU S S eptem b er Interrupt G enerator P L X TECHNOLOGY CORP • MbE D 0000200 1 ■ PLX Distinctive Features_ Applications_ T =:5 ^ ' 3 & - / 3

TMP86CS49FG

Abstract: TMP88CH40
Contextual Info: TMP86CS49FG 2008 年 9 月 お客様各位 重要なお知らせ 平素より東芝マイクロコントローラをご使用頂き誠にありがとうございます。 東芝マイクロコントローラご使用上の重要なお知らせをお伝えしています。製品をご使用の際には、必ず確認頂き