COPPER BOND WIRE AMKOR Search Results
COPPER BOND WIRE AMKOR Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| SF-NDCCGJ28GB-005M |
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Amphenol SF-NDCCGJ28GB-005M 5m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (16.4 ft) - 26 AWG | |||
| SF-NDCCGJ28GB-003M |
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Amphenol SF-NDCCGJ28GB-003M 3m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (9.8 ft) - 26 AWG (Low-Loss Version) | |||
| SF-NDCCGJ28GB-002M |
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Amphenol SF-NDCCGJ28GB-002M 2m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (6.6 ft) - 26 AWG (Low-Loss Version) | |||
| SF-NDAAFJ100G-002M |
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Amphenol SF-NDAAFJ100G-002M 2m (6.6') 100GbE QSFP28 Cable - Amphenol 100-Gigabit Ethernet Passive Copper QSFP Cable (SFF-8665 802.3bj) - QSFP28 to QSFP28 (26-AWG Low-Loss) | |||
| CS-DSDMDB09MF-002.5 |
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Amphenol CS-DSDMDB09MF-002.5 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft |
COPPER BOND WIRE AMKOR Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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copper wire datasheet
Abstract: copper wire 1mm Amkor Technology ATP3 ATP1 au wire copper bond wire copper bond wire amkor
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DS7409HGB
Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
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DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G | |
aec-q100
Abstract: AEC-Q100-011 G700K TSMC 1P4M MAX1782ETM tsmc cmos 0.11 um tsmc cmos model AC07X-1Z AB8200T MAX1782
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MAX7042ATJ+ 308MHz/315MHz/ 418MHz/433 92MHz 32-Lead AEC-Q100 QYK0BQ001D) MAX7042ATJ AEC-Q100 LF12Z AEC-Q100-011 G700K TSMC 1P4M MAX1782ETM tsmc cmos 0.11 um tsmc cmos model AC07X-1Z AB8200T MAX1782 | |
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Contextual Info: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost. |
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40mil 55/60nm 45/40nm 28/22nm | |
Sumitomo G700K
Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
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DS1077, JESD78, Sumitomo G700K sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL | |
ABLEBONDContextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
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DS1086L, JESD78, ABLEBOND | |
G700K
Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
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DS1077L, JESD78, G700K Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026 | |
Nitto MP8000
Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
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DS1086, JESD78, Nitto MP8000 Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026 | |
Sumitomo G700K
Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
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DS1094L, JESD78, Sumitomo G700K SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K | |
mark a7 sot23
Abstract: J-STD-20A atec 6710S CDA194 mp8000
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DS1816, JESD78, mark a7 sot23 J-STD-20A atec 6710S CDA194 mp8000 | |
CDA194
Abstract: mark a7 sot23
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DS1810, JESD78, CDA194 mark a7 sot23 | |
LMISR4Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1811, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
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DS1811, JESD78, LMISR4 | |
CDA194
Abstract: mark a7 sot23 mold compound
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DS1817, JESD78, CDA194 mark a7 sot23 mold compound | |
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Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1818, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
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DS1818, JESD78, | |
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Ablebond 84-1 LMISR4Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1812, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
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DS1812, JESD78, Ablebond 84-1 LMISR4 | |
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Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1813, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
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DS1813, JESD78, | |
sumitomo G700
Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
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LMISR4
Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
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DS1685, LMISR4 J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841 | |
JESD78
Abstract: Sumitomo 6730B Compound c7025 RH-1750
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DS2770, reliabilit50C JESD78 Sumitomo 6730B Compound c7025 RH-1750 | |
cu pillar
Abstract: pillar amkor amkor flip flip chip 106A led flip-chip 1000X f2f chip Amkor Technology
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C/125 1000X 1000hrs cu pillar pillar amkor amkor flip flip chip 106A led flip-chip 1000X f2f chip Amkor Technology | |
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Contextual Info: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a |
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DS550R | |
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Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS80C310, D2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com |
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DS80C310, JESD78, | |
cu pillar
Abstract: Amkor Technology amkor flip PoP PACKAGE TESTING
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1000hrs cu pillar Amkor Technology amkor flip PoP PACKAGE TESTING | |
PA168
Abstract: A3PE3000L-1PQ208I A3P400-1FG144
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1201B PCN1201 PCN1201A, useNG68 AGLN010V2-QNG48I AGLN020V2-QNG68 AGLN030V2-ZQNG68I AGLN010V5-QNG48 AGLN020V2-QNG68I AGL030V5-QNG48 PA168 A3PE3000L-1PQ208I A3P400-1FG144 | |