CERAMIC PIN GRID ARRAY PACKAGE PLATING Search Results

DSP56000

Abstract: DSP56001 Robinson Nugent PGA socket 32X24 Ceramic Capacitors 104 m30 Nippon capacitors
Contextual Info: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. MOTOROLA SEMICONDUCTOR TECHNICAL DATA 24-Bit General Purpose Digital Signal Processor Order this document by DSP56001/D DSP56001 Pin Grid Array PGA Available in an 88 pin ceramic through-hole package.

DSP56000

Abstract: DSP56001 0B4000 4CS088-01TG 256X24 DSP56001 host port Nippon capacitors
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 24-Bit General Purpose Digital Signal Processor Order this document by DSP56001/D DSP56001 Pin Grid Array PGA Available in an 88 pin ceramic through-hole package. Ceramic Quad Flat Pack (CQFP) The DSP56001 is a member of Motorola’s family of

TXC 18 E60

Abstract: TXC 100 M60 27 MHZ rc transmitter DSP56001 users manual DSP56000 DSP56001 h1 m6c A8F z Nippon capacitors
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 24-Bit General Purpose Digital Signal Processor Order this document by DSP56001/D DSP56001 Pin Grid Array PGA Available in an 88 pin ceramic through-hole package. Ceramic Quad Flat Pack (CQFP) The DSP56001 is a member of Motorola’s family of

TXC 18 E60

Abstract: DSP56001 users manual 27 MHZ rc receiver 27 MHZ rc transmitter D604 TXC 100 M60 1 pF ceramic capacitor C001 PC D400 E -3G TA 7504 samtec TW serial connectors datasheets
Contextual Info: Order this document by DSP56001/D Freescale Semiconductor DSP56001 Freescale Semiconductor, Inc. 24-Bit General Purpose Digital Signal Processor Pin Grid Array PGA Available in an 88 pin ceramic through-hole package. Ceramic Quad Flat Pack (CQFP) The DSP56001 is a member of Motorola’s family of

DSP56001 users manual

Abstract: f32 motorola DSP56000 DSP56001 SCF 112 S1535 B1401 Nippon capacitors
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 24-Bit General Purpose Digital Signal Processor Order this document by DSP56001/D DSP56001 Pin Grid Array PGA Available in an 88 pin ceramic through-hole package. Ceramic Quad Flat Pack (CQFP) The DSP56001 is a member of MotorolaÕs family of

231369

Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
Contextual Info: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array

QFN108

Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
Contextual Info: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3

CPGA

Abstract: cpga dimensions
Contextual Info: %s AM I A M I SE M IC O N D U C TO R CPGA Packaging Capabilities Description Through Hole The Ceramic Pin Grid Array CPGA is a through-hoie mount package for high density packaging with very high pin counts. The lead design also makes it compatible with socket insertion mounting. The CPGAs are also designed

atmel 0328

Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
Contextual Info: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

footprint jedec MS-026 TQFP AEB

Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5

footprint jedec MS-026 TQFP

Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
Contextual Info: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat

0555B

Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
Contextual Info: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7

CPGA large cavity

Abstract: ceramic pin grid array package plating FLATPACK hermetic centrifuge
Contextual Info: CERAMIC/HERMETIC data sheet CERAMIC/HERMETIC Common Package Families Ceramic / Hermetic Package Assembly: Ceramic / Hermetic packages are commonly used for applications requiring high performance and high reliability. They can generally withstand higher temperatures than traditional plastic packages, and the

diode databook package outline

Abstract: sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC
Contextual Info: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type – –

GI 312 diode

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame ceramic pin grid array package wire bond VIC064 CPGA 168 lead frame CERAMIC PIN GRID ARRAY 144 pins VIC068A CERAMIC PIN GRID ARRAY wire lead frame description of transistor bc 148 CY7C964
Contextual Info: Qualification Report November, 1994 - QTP# 93101 Version 1.1 CMOS2AN PROCESS MARKETING PART NUMBER VIC64 DEVICE DESCRIPTION VMEbus Interface Controller with D64 VIC068A VMEbus Interface Controller VAC068A VMEbus Address Controller CY7C964 Bus Interface Logic Circuit

KD 2107

Abstract: A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
Contextual Info: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type A B C

ceramic pin grid array package plating

Contextual Info: Standard Products RadHard Eclipse FPGA Family 6250 and 6325 Advanced Data Sheet May, 2005 www.aeroflex.com/RadHardFPGA FEATURES ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM

Contextual Info: 1.7 Package Description The following sections provide the package parameters and the mechanical dimensions for the PCM. 1.7.1 Package Parameters The package parameters are as provided in the following list. The package consists of a 288-lead pin grid array PGA on the bottom of a 1.75 x 2.5 inch glass-epoxy (FR4) substrate with a PowerPC microprocessor

Intel 1702 eprom

Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
Contextual Info: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC

64 pin CERAMIC QUAD FLATPACK

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet August, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

CERAMIC QUAD FLATPACK CQFP 96

Contextual Info: Standard Products RadHard Eclipse FPGA Advanced Data Sheet September, 2004 www.aeroflex.com/RadHardFPGA ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM controllers, USART and PCI

Contextual Info: LSI LOCK L64210/L64211 Variable-Length Video Shift Registers The L64210 and L64211 are two high-speed Variable-Length Video Shift Registers. These devices can be used individually or as video line delays for the L64200 series filter proces­ sors. Description

CDR33 Reliability data

Contextual Info: Standard Products RadHard Eclipse FPGA Family 6250 and 6325 Advanced Data Sheet December, 2004 www.aeroflex.com/RadHardFPGA FEATURES ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM

MJL-STD-1835

Contextual Info: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types.01 Package Description 32B 32 Lead, 0.600” Wide, Ceramic Side Braze Dual Inline Side