CERAMIC FLATPACK Search Results

CERAMIC FLATPACK

Abstract: F14C F10B F16B FA32A FA36A
Contextual Info: Ceramic Flatpack 10 Lead Ceramic Flatpack NS Package Number F10B 2000 National Semiconductor Corporation MS101108 www.national.com Ceramic Flatpack August 1999 Ceramic Flatpack 14 Lead Ceramic Flatpack NS Package Number F14C 16 Lead Ceramic Flatpack NS Package Number F16B

CERAMIC QUAD FLATPACK CQFP

Abstract: CQFP64 Cqfp128 CQFP CQFP256 CQFP-128 EL28B 64 ceramic quad flatpack EL116A EL132B
Contextual Info: Ceramic Quad Flatpack CQFP 28 Lead Ceramic Quad Flatpack NS Package Number EL28B 2000 National Semiconductor Corporation MS101107 www.national.com Ceramic Quad Flatpack (CQFP) August 1999 Ceramic Quad Flatpack (CQFP) 64 Lead Ceramic Quad Flatpack NS Package Number EL64A

U208

Abstract: U209 208-LEAD U160 U162 U208L
Contextual Info: Package Diagrams Ceramic Quad Flatpacks 64-Lead Ceramic Quad Flatpack Cavity Up U65 1 Package Diagrams 160-Lead Ceramic Quad Flatpack In Ring U160 2 Package Diagrams 160-Lead Ceramic Quad Flatpack (Cavity Up) U162 51-80106 3 Package Diagrams 208-Lead Ceramic Quad Flatpack (Cavity Up) U208

U208

Abstract: u1602 U160 U162 208lead 208-Lead
Contextual Info: Package Diagrams Ceramic Quad Flatpacks 64-Lead Ceramic Quad Flatpack Cavity Up U65 1 Package Diagrams 160-Lead Ceramic Quad Flatpack In Ring U160 2 Package Diagrams 160-Lead Ceramic Quad Flatpack (Cavity Up) U162 51-80106 3 Package Diagrams 208-Lead Ceramic Quad Flatpack (Cavity Up) U208

U160

Abstract: U162
Contextual Info: Package Diagram Ceramic Quad Flatpacks 64-Lead Ceramic Quad Flatpack Cavity Up U65 1 Package Diagram 160-Lead Ceramic Quad Flatpack In Ring U160 2 Package Diagram 160-Lead Ceramic Quad Flatpack (Cavity Up) U162 3

ordering information

Contextual Info: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack

K18C

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Ceramic Lid Flatpack Packages Flatpack K18.C A e 18 LEAD CERAMIC METAL SEAL CERAMIC LID FLATPACK PACKAGE A PIN NO. 1 ID AREA INCHES -A- D -B- S1 b E1 0.004 M H A-B S Q D S 0.036 M H A-B S D S C

Z84C0010PEC

Abstract: MIL-STD-883C CPS95CO0125 84C00 10X10 Z84C90 64 CERAMIC LEADLESS CHIP CARRIER LCC ceramic QFP Package 100 lead
Contextual Info: PACKAGE INFORMATION CPS95CO0125 CUSTOMER P ROCUREMENT S PECIFICA TION PACKAGE INFORMATION ORDERING CODES IC PACKAGE CODES TEMPERATURE A = VQFP Very Small QFP C = Ceramic Sidebrazed D = Cerdip E = Ceramic Window F = Plastic Quad Flatpack G = Ceramic PGA (Pin Grid Array)

71200-H1

Abstract: y-parameter x-band mmic lna X-band lna MAAM28000-A1 MAAM71200-H1 X-band low noise amplifiers mmic case styles maam 23000-A1
Contextual Info: Application Note M542 Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers Abstract Rev. V4 Package Description Manufacturer 5 lead, ceramic Kyocera 6 lead, ceramic Kyocera Leadless, 6 port, ceramic StratEdge 7 lead, ceramic Kyocera 8 lead, ceramic

54F74

Abstract: F1024 SS02
Contextual Info: Philips Semiconductors Military FAST Products Product specification Dual D-type flip-flop 54F74 DESCRIPTION ORDER CODE PACKAGE DESCRIPTION* 14-Pin Ceramic DIP 54F74/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F74/BDA GDFP-T14 20-Pin Ceramic LLCC 54F74/B2A CQCC2-N20

philips dl 711 delay

Abstract: DL 711 PHILIPS
Contextual Info: Philips Semiconductors Military FAST Products Product specification Dual D-type flip-flop 54F74 DESCRIPTION ORDER CODE PACKAGE DESCRIPTION* 14-Pin Ceramic DIP 54F74/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F74/BDA GDFP-T14 20-Pin Ceramic LLCC 54F74/B2A CQCC2-N20

Contextual Info: Philips Semiconductors Military FAST Products Product specification Dual D-type flip-flop 54F74 DESCRIPTION ORDER CODE PACKAGE DESCRIPTION* 14-Pin Ceramic DIP 54F74/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F74/BDA GDFP-T14 20-Pin Ceramic LLCC 54F74/B2A CQCC2-N20

F1024

Abstract: HDS02 54F74 fl024 SS02
Contextual Info: Philips Semiconductors Military FAST Products Product specification Dual D-type flip-flop 54F74 DESCRIPTION ORDER CODE PACKAGE DESCRIPTION* 14-Pin Ceramic DIP 54F74/BCA GDIP1-T14 14-Pin Ceramic FlatPack 54F74/BDA GDFP-T14 20-Pin Ceramic LLCC 54F74/B2A CQCC2-N20

MONOLITHIC MEMORIES

Abstract: MMI Monolithic Memories, Inc. 341-0558-C
Contextual Info: Military PAL Devices MMI PACKAGE DESIGNATOR J/JS W L PACKAGE TYPE CERAMIC DIP CERAMIC FLATPACK CERAMIC LEADLESS CHIP CARRIER Product Introduction Procedures All new products released by the Military Products Division must successfully pass Mil-Std-883 Class B processing prior to new

cdfp4-f16

Contextual Info: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045

Contextual Info: Ceramic Packages Ceramic Metal Seal Flatpack Packages Flatpack K14.B A e 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045 0.115 1.14 2.92 - b 0.015 0.022 0.38 0.56 - b1

K16.B Package

Contextual Info: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K16.B A e 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.115 - 2.92 - b 0.015 0.022 0.38 0.56 - b1 0.015 0.019

K20.A Package

Abstract: CDFP4-F20 AA2020
Contextual Info: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K20.A MIL-STD-1835 CDFP4-F20 (F-9A, CONFIGURATION B) 20 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045

CDFP3-F28

Contextual Info: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K28.A MIL-STD-1835 CDFP3-F28 (F-11A, CONFIGURATION B) A e 28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045

CDFP4-F24

Contextual Info: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B) 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045

Contextual Info: Ceramic Packages Ceramic Metal Seal Flatpack Packages Flatpack E 1 K42.A TOP BRAZED 42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE N e INCHES A A SYMBOL MIN MAX MIN MAX NOTES A - 0.100 - 2.54 - b 0.017 0.025 0.43 0.64 - S1 b1 0.017 0.023 0.43 0.58 - c 0.007

CDFP3-F14

Abstract: K14.A Package
Contextual Info: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045

K18A

Contextual Info: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K18.A A e 18 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.100 - 2.54 - b 0.015 0.022 0.38 0.56 - b1 0.015 0.019

K28B

Contextual Info: Ceramic Packages Ceramic Metal Seal Flatpack Packages Flatpack K28.B A e 28 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045 0.125 1.14 3.18 - b 0.015 0.022 0.38 0.56 - b1