EL64A Search Results

EL64A

Contextual Info: 64 Lead Ceramic Quad Flatpack NS Package Number EL64A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

CERAMIC QUAD FLATPACK CQFP

Abstract: CQFP64 Cqfp128 CQFP CQFP256 CQFP-128 EL28B 64 ceramic quad flatpack EL116A EL132B
Contextual Info: Ceramic Quad Flatpack CQFP 28 Lead Ceramic Quad Flatpack NS Package Number EL28B 2000 National Semiconductor Corporation MS101107 www.national.com Ceramic Quad Flatpack (CQFP) August 1999 Ceramic Quad Flatpack (CQFP) 64 Lead Ceramic Quad Flatpack NS Package Number EL64A

transistor BC 458

Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and

Contextual Info: DIGITAL MONOLITHIC INTEGRATED CIRCUITS MOS M OS IC, L S I E l e c t r i c a l C h a r a c t e r is t ic s Type F u n c tio n No. M ax im u m ( T a = 2 5 °C ) P r o g r a m m a b le Sym bol Ite m C o n d itio n m in . ty p . m ax. U n it V dd= ~ 0.3— K V

Photodiode-Array 64-element

Abstract: MN6040Z k1817 MN6040 panasonic ag MEL64A
Contextual Info: DIGITAL MONOLITHIC INTEGRATED CIRCUITS M O S Electrical C haracteristics (T a = 2 5 ”C) Type No. Maximum Ratings (T a= 2 5 °C ) Function \’ dd=—0.3—+7V 8 -Bit M N 604 0Z Counter min. max. typ. 5 mA 25 mff 100 3300 kH z Vue—1.3 Vnn V V In n Su p p ly Current

iso 1043-1

Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container

iso 1043-1

Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container

transistor BC 458

Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
Contextual Info: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and