CD 4093 DATASHEET Search Results
CD 4093 DATASHEET Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| TC4093BP | Toshiba Electronic Devices & Storage Corporation | CMOS Logic IC, 2-Input/NAND, DIP14 | Datasheet | ||
| 54121-409361550LF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. | |||
| 10140938-101LF | Amphenol Communications Solutions | VerIO™ Connector, Input Output Connectors, Plug kit suitable w/o RJ45 jack | |||
| 54112-409341700LF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch. | |||
| 10106814-093202LF | Amphenol Communications Solutions | 0.5 mm Pitch Hermaphroditic Mezzanine Connector, 90 positions, Short length, Half of mated height equals 3 mm |
CD 4093 DATASHEET Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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jis 8303
Abstract: E45116 IEC 60320 C7 60227 IEC italy CEI 23-16 IEC 60320-1 c7 ASEV BS EN 60320 CS02 comparison cd 4093
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schurte91jis 8303e45116iec 60320 c7+7 | |
IEC 320 C13 dimension
Abstract: 9013 SMD IEC -320 C7 0721-PS C16A ZP30 wiring and cables catalogue PA 4013 IEC 320 C20 IEC -320 C13 terminal
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iec 320 c13 dimension9013 smdiec -320 c70721-ps+6 | |
NAND FLASH DDP
Abstract: SAMSUNG MCP MCP 256M nand 128M mobile sdram 137FBGA MCP 67 MV- A2 8188 KBE00F005A KBE00F005A-D411 MCP NOR FLASH SDRAM UtRAM Density
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kbe00f005a-d411512mb256mb137-ball+10 | |
kbe00f003m
Abstract: SAMSUNG MCP Flash MCp nand DRAM 107-ball NAND FLASH DDP samsung mcp 107-ball d411 KBE00G003M-D411 NNDD512512256256BBFF UtRAM Density MCP 1Gb 512Mb 130
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kbe00g003m-d411nndd512512256256bbff512mb256mb+10 | |
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Contextual Info: STM32L162VC STM32L162RC Ultra-low-power 32-bit MCU ARM-based Cortex-M3, 256KB Flash, 32KB SRAM, 8KB EEPROM, LCD, USB, ADC, DAC, AES Datasheet - production data Features • Ultra-low-power platform – 1.65 V to 3.6 V power supply – -40°C to 85°C/105°C Temperature range |
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stm32l162vcstm32l162rc32-bit256kb+3 | |
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Contextual Info: STM32L162VC STM32L162RC Ultra-low-power 32-bit MCU ARM-based Cortex-M3, 256KB Flash, 32KB SRAM, 8KB EEPROM, LCD, USB, ADC, DAC, AES Datasheet - production data Features • Ultra-low-power platform – 1.65 V to 3.6 V power supply – -40°C to 85°C/105°C Temperature range |
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stm32l162vcstm32l162rc32-bit256kb+3 | |
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Contextual Info: STM32L15xCC STM32L15xRC STM32L15xUC STM32L15xVC Ultra-low-power 32-bit MCU ARM-based Cortex-M3, 256KB Flash, 32KB SRAM, 8KB EEPROM, LCD, USB, ADC, DAC Datasheet - production data Features • Ultra-low-power platform – 1.65 V to 3.6 V power supply – -40 °C to 85 °C/105 °C temperature range |
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stm32l15xccstm32l15xrcstm32l15xucstm32l15xvc+4 | |
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Contextual Info: STM32F105xx STM32F107xx Connectivity line, ARM -based 32-bit MCU with 64/256 KB Flash, USB OTG, Ethernet, 10 timers, 2 CANs, 2 ADCs, 14 communication interfaces Datasheet - production data Features FBGA ® ® • Core: ARM 32-bit Cortex -M3 CPU – 72 MHz maximum frequency, 1.25 |
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stm32f105xxstm32f107xx32-bit3-to-25+1 | |
STM32L1xx
Abstract: STM32L151 UFBGA132 STM32L15x STM32L152 STM32L15xx LM 3171 ECC 808 tube stm32*l15xx STM32Fxxx
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stm32l151xdstm32l152xd32-bit384kb+14 | |
STM32L162
Abstract: STM32L162VD STM32L162RD STM8 spi programming manual STM32L15x WLCSP64 STM32Fxxx ic hc 4093 STM32L151 FSMC RM
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stm32l162vdstm32l162zdstm32l162qdstm32l162rd+12 | |
ME 4946
Abstract: EK117 STM32L151CC STM32L152cc STM32L152 WLCSP63 STM32L151UC STM32L15x STM32L151RC m861
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stm32l151xcstm32l152xc32-bit256kb+11 | |
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Contextual Info: STM32F383xx ARM Cortex-M4 32b MCU+FPU, up to 256KB Flash+32KB SRAM, timers, 4 ADCs 12/16-bit , 3 DACs, 2 comp., 1.8 V operation Datasheet - production data Features FBGA • Core: ARM 32-bit Cortex -M4 CPU (72 MHz max), single-cycle multiplication and HW |
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stm32f383xx256kb12/16-bit32-bit+1 | |
STM32F21xxx reference manual
Abstract: STM32 F4 touch frame STM32F20xxx reference manual Connecting the FSMC to the LCD Intel STM32F20x Connecting the FSMC to the LCD DCMI timing specification STM32F10xx diode S6 78A stm32f217xx
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stm32f215xxstm32f217xx32-bit150dmips+10 | |
STM32F20xxx reference manualContextual Info: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex -M3 CPU 120 MHz max with Adaptive real-time accelerator (ART |
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stm32f205xxstm32f207xx32-bit150dmips+3 | |
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Contextual Info: STM32F215xx STM32F217xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex -M3 CPU 120 MHz max with Adaptive real-time accelerator (ART |
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stm32f215xxstm32f217xx32-bit150dmips+2 | |
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Contextual Info: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features FBGA FBGA • ■ Core: ARM 32-bit Cortex -M3 CPU 120 MHz |
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stm32f205xxstm32f207xx32-bit150dmips+1 | |
STM32f4xx reference manualContextual Info: STM32F405xx STM32F407xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data FBGA • LQFP64 10 x 10 mm LQFP100 (14 × 14 mm) LQFP144 (20 × 20 mm) |
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stm32f405xxstm32f407xx210dmipsflash/192+7 | |
NAND sample code for stm32f2xx
Abstract: DCMI timing specification STM32F20xxx programming manual stm32f205rx STM32F20xxx reference manual STM32F207ZE programming manual stm32f205 STM32F20x STM32F20xxx STM32F207ZG
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stm32f205xxstm32f207xx32-bit150dmips+11 | |
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Contextual Info: STM32F415xx STM32F417xx ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data FBGA • LQFP64 10 x 10 mm LQFP100 (14 × 14 mm) LQFP144 (20 × 20 mm) |
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stm32f415xxstm32f417xx210dmipsflash/192+6 | |
STM32F372Contextual Info: STM32F373xx ARM Cortex-M4 32b MCU+FPU, up to 256KB Flash+32KB SRAM timers, 4 ADCs 12/16-bit , 3 DACs, 2 comp., 2.0-3.6 V operation Datasheet - production data Features FBGA • Core: ARM 32-bit Cortex -M4 CPU (72 MHz max), single-cycle multiplication and HW |
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stm32f373xx256kb12/16-bit32-bit+2 | |
CMD28 CMD29 CMD30 micro sd
Abstract: rca 728 ACMD13 ACMD42 MicroSD TF to SD Card Adapter ANSi OCR SMS02 cmd6 sd card ACMD51 ACMD41
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512-mbyte00standardcmd28 cmd29 cmd30 micro sdrca 728+8 | |
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Contextual Info: AT91SAM ARM-based Embedded MPU SAM9263 DATASHEET Description The AT91SAM9263 32-bit microcontroller, based on the ARM926EJ-S processor, is architectured on a 9-layer matrix, allowing a maximum internal bandwidth of nine 32bit buses. It also features two independent external memory buses, EBI0 and EBI1, |
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at91samsam9263at91sam926332-bit+2 | |
LQFP100
Abstract: STM32F101 application note JTAG stm32f101
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stm32f101xcstm32f101xdstm32f101xe32-bit+5 | |
STM32F101 application noteContextual Info: STM32F101xC STM32F101xD STM32F101xE High-density access line, ARM-based 32-bit MCU with 256 to 512 KB Flash, 9 timers, 1 ADC and 10 communication interfaces Features • ■ ■ ■ ■ Core: ARM 32-bit Cortex -M3 CPU – 36 MHz maximum frequency, 1.25 DMIPS/MHz Dhrystone 2.1 |
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stm32f101xcstm32f101xdstm32f101xe32-bit+2 | |