BGA AND CSP Search Results
BGA AND CSP Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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DE6B3KJ101KA4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6B3KJ331KB4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6E3KJ102MN4A | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6E3KJ472MA4B | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive | |||
DE6B3KJ331KA4BE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
BGA AND CSP Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Table of Contents Table of Contents BGA Socketing Systems Designed for use with Ball Grid Array BGA , Land Grid Array (LGA), and Chip Scale Package (CSP) devices in development, test and production applications. Over 900 footprints available online in our searchable BGA Socket Finder database at www.bgasockets.com. |
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CAT16-PREVIEW06 | |
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL
Abstract: "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"
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U37YContextual Info: 1 Gigabit Stacked DDR2 SDRAM 128Mb x 8 DD51E Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and • • • • • • • • |
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DD51E 128Mb 2D128M82U3BA DD51E 3887x132 U37Y | |
U37YContextual Info: 1 Gigabit Stacked DDR2 SDRAM DD50E 256Mb x 4 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and • • • • • • • • |
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DD50E 256Mb 2D256M42U3BA DD50E 3887x132 U37Y | |
DD256M
Abstract: T37Z TSOP 66 Package thermal resistance
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DD54E, DD54ER DD54ER) DDR400) DD256M42U3BA DD54E 3887x132 DD54E) DD256M T37Z TSOP 66 Package thermal resistance | |
T37Z
Abstract: DD128 TSOP 66 pin Package thermal resistance DD128M82U3BB6 267-Mbps
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DD55E, DD55ER DD54ER) DDR400) DD128M82U3BA DD55E 3887x132 DD55E) T37Z DD128 TSOP 66 pin Package thermal resistance DD128M82U3BB6 267-Mbps | |
IPC-6011
Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
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1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6011 IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222 | |
PitchCheckerContextual Info: PitchChecker ANTI-STATIC SEE THROUGH TM MODEL PC815 PITCH COMPARATOR BULLETIN PC815B-R1 CHECK PITCH AND BODY SIZE OF INTEGRATED CIRCUITS FEATURES PITCHES FOR MANY POPULAR TYPES INCLUDING SOIC, SOP, SSOP, TSSOP, BGA, QFP, QFN, DFN, DIP, CSP and MORE FLEXIBLE AND COMPACT |
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PC815 PC815B-R1 PitchChecker | |
Contextual Info: PitchChecker ANTI-STATIC SEE THROUGH TM MODEL PC815 PITCH COMPARATOR BULLETIN PC815B-R1 CHECK PITCH AND BODY SIZE OF INTEGRATED CIRCUITS FEATURES PITCHES FOR MANY POPULAR TYPES INCLUDING SOIC, SOP, SSOP, TSSOP, BGA, QFP, QFN, DFN, DIP, CSP and MORE FLEXIBLE AND COMPACT |
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PC815 PC815B-R1 | |
Contextual Info: MACHINED HIGH FREQUENCY CENTER PROBE TEST SOCKET FOR BGA, CSP, & MLF PACKAGES FEATURES: • Solderless spring probes pressure mount to the test board and device solderball or pad. • Only .077” 1.95mm signal path. • Very low inductance and capacitance. |
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BGA 256 PACKAGE power dissipation
Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
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00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432 | |
SPARTAN XC2S50
Abstract: XCS10 vq100 FG456 XC2S50 xilinx CS144 CSP144 CS144 xc2s30 pq208 XCS30 PQ208 XC2S15
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K6F1016U4AContextual Info: K6F1016U4A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998 |
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K6F1016U4A 85/Typ. 25/Typ. | |
Contextual Info: K6F1016S4A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998 |
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K6F1016S4A 85/Typ. 25/Typ. | |
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Contextual Info: Preliminary KM616FS1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA Draft Date Remark November 4, 1998 |
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KM616FS1010A 80/Typ. 25/Typ. | |
Contextual Info: Preliminary KM616FR1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA Draft Date Remark October 29, 1998 |
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KM616FR1010A 25/Typ. 80/Typ. | |
2450FB15M0001
Abstract: bc03
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2450FB15M0001 2450FB15M0001 960MHz 1990MHz 5000MHz 7500MHz bc03 | |
xc9536tm
Abstract: FG456 CS144 CS280 CS48 FG256 FG676 XC9500 XC9536 XCV100
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144-ball 280-ball, XC9500 144ball FG256, FG456, FG676, FG680. FG456 FG676 xc9536tm CS144 CS280 CS48 FG256 XC9536 XCV100 | |
IPC-6012
Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
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1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525 | |
Contextual Info: Preliminary KM616FU1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision H istory R evisio n No. H isto ry 0.0 D raft D ate Initial Draft - Specify CSP type to distinguish between uBG A and FP BGA November 4, 1998 |
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KM616FU1010A | |
INTEL 28F640
Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
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12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3 | |
Contextual Info: CSP/Ballnest Hybrid Socket FEATURES: • Any grid size available on 0.50mm pitch or larger. • Socket lid nests device into female socket for a reliable, solderless electrical connection. • Suitable for prototyping, test or burn-in of CSP, BGA, µBGA and LGA devices. |
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MIL-G45204 QQ-N-290. QQ-B-626, | |
interposerContextual Info: HIGH FREQUENCY INTERPOSER SOCKET FEATURES: • Pressure mount plunge to board interposer. • Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP and more. • Very low inductance per contact site. • High cycle life with easy maintenance. • Manual or Automated Handler applications. |
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10GHz. 20millohm. interposer | |
sony cmos sensor imx 172
Abstract: sony CMOS sensor imx 135 sony IMX 132 sony IMX 122 sony IMX 135 MLB150 sony cmos sensor imx 174 sony IMX 132 CMOS MIPI dsi transmitter sony cmos sensor imx 179
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