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    BGA AND CSP Search Results

    BGA AND CSP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ101KA4BE01J
    Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6B3KJ331KB4BE01J
    Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6E3KJ102MN4A
    Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6E3KJ472MA4B
    Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF
    DE6B3KJ331KA4BE01J
    Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive PDF

    BGA AND CSP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Table of Contents Table of Contents BGA Socketing Systems Designed for use with Ball Grid Array BGA , Land Grid Array (LGA), and Chip Scale Package (CSP) devices in development, test and production applications. Over 900 footprints available online in our searchable BGA Socket Finder database at www.bgasockets.com.


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    CAT16-PREVIEW06 PDF

    SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL

    Abstract: "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"
    Contextual Info: Package Information file:///D|/nec_intranet/package/index.htm Package Information Package Type Package List by NEC Code Explanation of Package and Packing Semiconductor Device Mounting Technology Manual Chip Size Package (CSP) BGA Family Flip Chip BGA (FCBGA)


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    U37Y

    Contextual Info: 1 Gigabit Stacked DDR2 SDRAM 128Mb x 8 DD51E Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and • • • • • • • •


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    DD51E 128Mb 2D128M82U3BA DD51E 3887x132 U37Y PDF

    U37Y

    Contextual Info: 1 Gigabit Stacked DDR2 SDRAM DD50E 256Mb x 4 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and • • • • • • • •


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    DD50E 256Mb 2D256M42U3BA DD50E 3887x132 U37Y PDF

    DD256M

    Abstract: T37Z TSOP 66 Package thermal resistance
    Contextual Info: 1 GigaBit Stacked DDR1 SDRAM DD54E, DD54ER 256M x 4 Features • Low Profile 66 Ball Two-High Stacked Die micropede BGA • 77% Space Savings Over Two 66 Pin TSOP Packages • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and


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    DD54E, DD54ER DD54ER) DDR400) DD256M42U3BA DD54E 3887x132 DD54E) DD256M T37Z TSOP 66 Package thermal resistance PDF

    T37Z

    Abstract: DD128 TSOP 66 pin Package thermal resistance DD128M82U3BB6 267-Mbps
    Contextual Info: 1 GigaBit Stacked DDR1 SDRAM 128M x 8 DD55E, DD55ER Features • Low Profile 66 Ball Two-High Stacked Die micropede BGA • 77% Space Savings Over Two 66 Pin TSOP Packages • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and


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    DD55E, DD55ER DD54ER) DDR400) DD128M82U3BA DD55E 3887x132 DD55E) T37Z DD128 TSOP 66 pin Package thermal resistance DD128M82U3BB6 267-Mbps PDF

    IPC-6011

    Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
    Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications


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    1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6011 IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222 PDF

    PitchChecker

    Contextual Info: PitchChecker ANTI-STATIC SEE THROUGH TM MODEL PC815 PITCH COMPARATOR BULLETIN PC815B-R1 CHECK PITCH AND BODY SIZE OF INTEGRATED CIRCUITS FEATURES PITCHES FOR MANY POPULAR TYPES INCLUDING SOIC, SOP, SSOP, TSSOP, BGA, QFP, QFN, DFN, DIP, CSP and MORE FLEXIBLE AND COMPACT


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    PC815 PC815B-R1 PitchChecker PDF

    Contextual Info: PitchChecker ANTI-STATIC SEE THROUGH TM MODEL PC815 PITCH COMPARATOR BULLETIN PC815B-R1 CHECK PITCH AND BODY SIZE OF INTEGRATED CIRCUITS FEATURES PITCHES FOR MANY POPULAR TYPES INCLUDING SOIC, SOP, SSOP, TSSOP, BGA, QFP, QFN, DFN, DIP, CSP and MORE FLEXIBLE AND COMPACT


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    PC815 PC815B-R1 PDF

    Contextual Info: MACHINED HIGH FREQUENCY CENTER PROBE TEST SOCKET FOR BGA, CSP, & MLF PACKAGES FEATURES: • Solderless spring probes pressure mount to the test board and device solderball or pad. • Only .077” 1.95mm signal path. • Very low inductance and capacitance.


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    BGA 256 PACKAGE power dissipation

    Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
    Contextual Info: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced


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    00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432 PDF

    SPARTAN XC2S50

    Abstract: XCS10 vq100 FG456 XC2S50 xilinx CS144 CSP144 CS144 xc2s30 pq208 XCS30 PQ208 XC2S15
    Contextual Info: High volume package solutions guide partanTM families provide the low-cost, high-volume ASIC packages for applications that need low power, small form factors and high reliability. The Chip Scale Package CSP and the Fine Pitch BGA package (FG) provide higher


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    K6F1016U4A

    Contextual Info: K6F1016U4A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998


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    K6F1016U4A 85/Typ. 25/Typ. PDF

    Contextual Info: K6F1016S4A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998


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    K6F1016S4A 85/Typ. 25/Typ. PDF

    Contextual Info: Preliminary KM616FS1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA Draft Date Remark November 4, 1998


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    KM616FS1010A 80/Typ. 25/Typ. PDF

    Contextual Info: Preliminary KM616FR1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA Draft Date Remark October 29, 1998


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    KM616FR1010A 25/Typ. 80/Typ. PDF

    2450FB15M0001

    Abstract: bc03
    Contextual Info: "High Frequency Ceramic Solutions" 2.45 GHz Filter Balun, conjugate match to BC03 & BC04 BGA/CSP and MTK 6611/6612 chipsets P/N 2450FB15M0001 Page 1 of 3 Detail Specification: 05/05/2012 General Specifications Part Number 2450FB15M0001 40 min.@ 880~960MHz


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    2450FB15M0001 2450FB15M0001 960MHz 1990MHz 5000MHz 7500MHz bc03 PDF

    xc9536tm

    Abstract: FG456 CS144 CS280 CS48 FG256 FG676 XC9500 XC9536 XCV100
    Contextual Info: ADVANCED Chip Scale & BGA Packaging New packaging technology for FPGAs and CPLDs reduces board space and increases I/Os. by Jay Aggarwal, Spartan Product Marketing Manager, Xilinx, jay.aggarwal@xilinx.com X ilinx recently announced new 144-ball and 280-ball, 0.8-millimeter pitch chip


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    144-ball 280-ball, XC9500 144ball FG256, FG456, FG676, FG680. FG456 FG676 xc9536tm CS144 CS280 CS48 FG256 XC9536 XCV100 PDF

    IPC-6012

    Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
    Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel


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    1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525 PDF

    Contextual Info: Preliminary KM616FU1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision H istory R evisio n No. H isto ry 0.0 D raft D ate Initial Draft - Specify CSP type to distinguish between uBG A and FP BGA November 4, 1998


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    KM616FU1010A PDF

    INTEL 28F640

    Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
    Contextual Info: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


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    12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3 PDF

    Contextual Info: CSP/Ballnest Hybrid Socket FEATURES: • Any grid size available on 0.50mm pitch or larger. • Socket lid nests device into female socket for a reliable, solderless electrical connection. • Suitable for prototyping, test or burn-in of CSP, BGA, µBGA and LGA devices.


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    MIL-G45204 QQ-N-290. QQ-B-626, PDF

    interposer

    Contextual Info: HIGH FREQUENCY INTERPOSER SOCKET FEATURES: • Pressure mount plunge to board interposer. • Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP and more. • Very low inductance per contact site. • High cycle life with easy maintenance. • Manual or Automated Handler applications.


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    10GHz. 20millohm. interposer PDF

    sony cmos sensor imx 172

    Abstract: sony CMOS sensor imx 135 sony IMX 132 sony IMX 122 sony IMX 135 MLB150 sony cmos sensor imx 174 sony IMX 132 CMOS MIPI dsi transmitter sony cmos sensor imx 179
    Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLAEC Rev. 1, 11/2012 MCIMX6SxAxxxxxB MCIMX6UxAxxxxxB i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch


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