BGA AND CSP Search Results

Contextual Info: Table of Contents Table of Contents BGA Socketing Systems Designed for use with Ball Grid Array BGA , Land Grid Array (LGA), and Chip Scale Package (CSP) devices in development, test and production applications. Over 900 footprints available online in our searchable BGA Socket Finder database at www.bgasockets.com.

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL

Abstract: "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"
Contextual Info: Package Information file:///D|/nec_intranet/package/index.htm Package Information Package Type Package List by NEC Code Explanation of Package and Packing Semiconductor Device Mounting Technology Manual Chip Size Package (CSP) BGA Family Flip Chip BGA (FCBGA)

U37Y

Contextual Info: 1 Gigabit Stacked DDR2 SDRAM 128Mb x 8 DD51E Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and • • • • • • • •

U37Y

Contextual Info: 1 Gigabit Stacked DDR2 SDRAM DD50E 256Mb x 4 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and • • • • • • • •

DD256M

Abstract: T37Z TSOP 66 Package thermal resistance
Contextual Info: 1 GigaBit Stacked DDR1 SDRAM DD54E, DD54ER 256M x 4 Features • Low Profile 66 Ball Two-High Stacked Die micropede BGA • 77% Space Savings Over Two 66 Pin TSOP Packages • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and

T37Z

Abstract: DD128 TSOP 66 pin Package thermal resistance DD128M82U3BB6 267-Mbps
Contextual Info: 1 GigaBit Stacked DDR1 SDRAM 128M x 8 DD55E, DD55ER Features • Low Profile 66 Ball Two-High Stacked Die micropede BGA • 77% Space Savings Over Two 66 Pin TSOP Packages • 50% Space Savings Over Two 60 Ball BGA Packages • Significant Space Savings and Reduced Parasitics and

IPC-6011

Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications

PitchChecker

Contextual Info: PitchChecker ANTI-STATIC SEE THROUGH TM MODEL PC815 PITCH COMPARATOR BULLETIN PC815B-R1 CHECK PITCH AND BODY SIZE OF INTEGRATED CIRCUITS FEATURES PITCHES FOR MANY POPULAR TYPES INCLUDING SOIC, SOP, SSOP, TSSOP, BGA, QFP, QFN, DFN, DIP, CSP and MORE FLEXIBLE AND COMPACT

Contextual Info: PitchChecker ANTI-STATIC SEE THROUGH TM MODEL PC815 PITCH COMPARATOR BULLETIN PC815B-R1 CHECK PITCH AND BODY SIZE OF INTEGRATED CIRCUITS FEATURES PITCHES FOR MANY POPULAR TYPES INCLUDING SOIC, SOP, SSOP, TSSOP, BGA, QFP, QFN, DFN, DIP, CSP and MORE FLEXIBLE AND COMPACT

Contextual Info: MACHINED HIGH FREQUENCY CENTER PROBE TEST SOCKET FOR BGA, CSP, & MLF PACKAGES FEATURES: • Solderless spring probes pressure mount to the test board and device solderball or pad. • Only .077” 1.95mm signal path. • Very low inductance and capacitance.

BGA 256 PACKAGE power dissipation

Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
Contextual Info: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced

SPARTAN XC2S50

Abstract: XCS10 vq100 FG456 XC2S50 xilinx CS144 CSP144 CS144 xc2s30 pq208 XCS30 PQ208 XC2S15
Contextual Info: High volume package solutions guide partanTM families provide the low-cost, high-volume ASIC packages for applications that need low power, small form factors and high reliability. The Chip Scale Package CSP and the Fine Pitch BGA package (FG) provide higher

K6F1016U4A

Contextual Info: K6F1016U4A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998

Contextual Info: K6F1016S4A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA November 4, 1998

Contextual Info: Preliminary KM616FS1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA Draft Date Remark November 4, 1998

Contextual Info: Preliminary KM616FR1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History 0.0 Initial Draft - Specify CSP type to distinguish between uBGA and FP BGA Draft Date Remark October 29, 1998

2450FB15M0001

Abstract: bc03
Contextual Info: "High Frequency Ceramic Solutions" 2.45 GHz Filter Balun, conjugate match to BC03 & BC04 BGA/CSP and MTK 6611/6612 chipsets P/N 2450FB15M0001 Page 1 of 3 Detail Specification: 05/05/2012 General Specifications Part Number 2450FB15M0001 40 min.@ 880~960MHz

xc9536tm

Abstract: FG456 CS144 CS280 CS48 FG256 FG676 XC9500 XC9536 XCV100
Contextual Info: ADVANCED Chip Scale & BGA Packaging New packaging technology for FPGAs and CPLDs reduces board space and increases I/Os. by Jay Aggarwal, Spartan Product Marketing Manager, Xilinx, jay.aggarwal@xilinx.com X ilinx recently announced new 144-ball and 280-ball, 0.8-millimeter pitch chip

IPC-6012

Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel

Contextual Info: Preliminary KM616FU1010A Family CMOS SRAM Document Title 64K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM Revision H istory R evisio n No. H isto ry 0.0 D raft D ate Initial Draft - Specify CSP type to distinguish between uBG A and FP BGA November 4, 1998

INTEL 28F640

Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
Contextual Info: µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 Document Number: 290661-022 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any

Contextual Info: CSP/Ballnest Hybrid Socket FEATURES: • Any grid size available on 0.50mm pitch or larger. • Socket lid nests device into female socket for a reliable, solderless electrical connection. • Suitable for prototyping, test or burn-in of CSP, BGA, µBGA and LGA devices.

interposer

Contextual Info: HIGH FREQUENCY INTERPOSER SOCKET FEATURES: • Pressure mount plunge to board interposer. • Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP and more. • Very low inductance per contact site. • High cycle life with easy maintenance. • Manual or Automated Handler applications.

sony cmos sensor imx 172

Abstract: sony CMOS sensor imx 135 sony IMX 132 sony IMX 122 sony IMX 135 MLB150 sony cmos sensor imx 174 sony IMX 132 CMOS MIPI dsi transmitter sony cmos sensor imx 179
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLAEC Rev. 1, 11/2012 MCIMX6SxAxxxxxB MCIMX6UxAxxxxxB i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch