BGA 15X15 Search Results

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

PCT-GF30

Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
Contextual Info: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount

514-PP-NNNMXX-XXX148

Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
Contextual Info: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm

35x35 bga

Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
Contextual Info: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169

60068-2-14Na

Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance
Contextual Info: PGA / BGA / PLCC GENERAL SPECIFICATIONS WWW.PRECIDIP.COM TEL +41 32 421 04 00 SALES@PRECIDIP.COM The values listed below are general specs applying for Preci-Dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.

Preci-Dip Durtal SA

Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
Contextual Info: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin

g10 fr4 7mm

Abstract: SG-BGA-7039 micron 100 ball BGA
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7044

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7099

Abstract: BGA 15X15
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

Contextual Info: BGA 119 Pin NP276 Series CHARACTERISTICS Insulation Resistance 100MQ or more at 100VDC Withstanding Voltage Contact Resistance 100VAC for one minute 30mQ or less at 10mA, 20m V (initial) 40°C ~ +I50CC Operating Temperature ORDERING PROCEDURE NP276-119 04-*

SG-BGA-6210

Contextual Info: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer

SG-BGA-6002

Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer

xxxxx

Abstract: 540-88-084-17-400 540-88-068-24-000-1 23X23 131105 510pp PPS-GF30-FR
Contextual Info: PGA／BGA／PLCC 插座 PGA／BGA／PLCC插座 快速选择表 PGA／BGA／PLCC插座 网址：WWW.PRECIDIP.COM 电话：＋41 32 421 04 00 电子信箱：SALES@PRECIDIP.COM 间隔 PGA 2.54 mm 填隙式 插座 焊尾 BGA 1.27 mm 1.27 mm PLCC 1 mm 参见页码

BGA 15X15

Contextual Info: 176 PIN FINE PITCH BGA 15x15 A W S B B B 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A C D U T RP NM L K J H G F E D C B A P Index mark Q W S A J I Y1 S H R S K S F L E φM M G S A B NOTES 1. Controlling dimension millimeter. 2. Each ball centerline is located within φ 0.08 mm of

NP352

Abstract: IC280-484-206 NP364 NP378 NP440 NP404 IC409 IC280-960-276 NP367 IC398
Contextual Info: \ - f ^ ' \ 0.4mmPitch P ro d u c t Line-up P K G S iz e m m G r id O p en T o p T y p e 4 5 6 7 8 8,9 10,11 12,13,14 15,16 17,18,19 BGA N P437 series ▼ Si/Features ? □ y ? ? h t.3 S R R T f E « H j R - j u m o y * ? t 'f e g ^ q r t g U -sh a p e c o n ta c t m in im iz e s c o n ta c t m a r k o n so ld e r b a ll.

Turn-Key

Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
Contextual Info:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25

STMicroelectronics smd marking code

Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK
Contextual Info: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MLD-MIC/05/943 Notification Date 02/23/2005 CONVERSION TO PB-FREE PRODUCTION MIC - MICROCONTROLLERS 1/4 PCN MLD-MIC/05/943 - Notification Date 02/23/2005 Table 1. Change Identification Product Identification Product Family/Commercial Product

SAC405

Abstract: IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station
Contextual Info: Introduction to the Plastic Ball Grid Array PBGA Q1, Burnette 2008 Terry Dec. 15, 2005 TM Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc in the US and other countries. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc. 2008. The information provided is typical to the industry and is not intended to represent

X-RAY INSPECTION

Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
Contextual Info: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc. by Thomas Koschmieder and Michael Leoni Introduction The Land Grid Array LGA is an area array matrix package that uses solder paste as

144 QFP body size

Abstract: 35x35 bga BGA and QFP Package vhdl code for usart DesignWare SPI 0.18-um CMOS technology characteristics ARM7 verilog code NEC-V850 PZT driver design vhdl coding for analog to digital converter
Contextual Info: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.0 April 6, 1999 Copyright  Texas Instruments Incorporated, 1999 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the

datasheet of BGA Staggered pins

Abstract: NEC-V850 VHDL CODE FOR HDLC controller vhdl code for 4 channel dma controller clock tree balancing serdes transceiver 1999 verilog code for i2c vhdl code download for memory in cam vhdl code for watchdog timer of ATM vhdl coding for analog to digital converter
Contextual Info: GS30 0.15-µm CMOS Standard Cell/Gate Array High-Value ASIC ❑ 0.15-µm Leff process 0.18-µm drawn with Shallow Trench Isolation (STI) Inline bond pads Minimum height I/Os Minimum width I/O ❑ 4 and 5 levels of metal ❑ 6 million random logic gates plus 6 million

HLQFP 176 Package

Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
Contextual Info: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)