BGA 15X15 Search Results

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

Contextual Info: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and

PCT-GF30

Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
Contextual Info: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount

514-PP-NNNMXX-XXX148

Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
Contextual Info: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm

35x35 bga

Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
Contextual Info: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169

60068-2-14Na

Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance
Contextual Info: PGA / BGA / PLCC GENERAL SPECIFICATIONS WWW.PRECIDIP.COM TEL +41 32 421 04 00 SALES@PRECIDIP.COM The values listed below are general specs applying for Preci-Dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.

Preci-Dip Durtal SA

Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
Contextual Info: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin

SG-BGA-6046

Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Contextual Info: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.

CMBA023737

Abstract: MBH37 MBH37.5002 37.5x37.5
Contextual Info: MBH3750021 Series = CMBA023737 MBH37.50021= 1373263 Model : CMBA023737 Series For 37.5x37.5 Chip set BGA Heat Sink Specification CMBA023737 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm

19X19

Abstract: CMBA021919 Malico BGA 15X15 RCA 014
Contextual Info: CMBA021919Series=MBH19002 Series MBH19002-H12 MBH19002-H25 = 1373254 = 1373255 Model : CMBA021919 Series For 19x19 Chip set BGA Heat Sink CMBA021919 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 19x19mm Height : 12,15,18,21,23,28,33 mm

CMBA023333

Abstract: 33X33 Al6063
Contextual Info: MBH33002 Series=CMBA023333 Series MBH33002 = 1373260 Model : CMBA023333 Series For 33x33 Chip set BGA Heat Sink CMBA023333 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 33x33mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm

CMBA024242

Contextual Info: MBH425002 Series=CMBA024242 Series MBH425002-H12 MBH425002-H25 = 1373265 = 1373266 Model : CMBA024242 Series For 42.5x42.5 Chip set BGA Heat Sink Specification CMBA024242 Series 1.Material : Al 6063 2.Dimension : Foot print : 42.5x42.5mm Height :12,15,18,21,23,28,33 mm

CU1100

Abstract: BGA 15X15 CMBA054949 T725
Contextual Info: Model : CMBA054949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA054949 Series 1.Material : CU1100 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :

g10 fr4 7mm

Abstract: SG-BGA-7039 micron 100 ball BGA
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

SG-BGA-7099

Abstract: BGA 15X15
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid

CMBA022727

Abstract: MBH27002 27X27MM
Contextual Info: MBH27002 Series=CMBA022727 MBH27002-H12 MBH27002-H25 = 1373256 = 1373257 Model : CMBA022727 Series For 27x27 Chip set BGA Heat Sink CMBA022727 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 27x27mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm

BGA 15X15

Abstract: CMBA024949 T725
Contextual Info: Model : CMBA024949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA024949 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :

MBH29002

Abstract: MBH29002-H12 CMBA022929 29x29mm
Contextual Info: MBH29002 Series=CMBA022929 MBH29002-H12 MBH29002-H25 = 1373258 = 1373259 Model : CMBA022929 Series For 29x29 Chip set BGA Heat Sink CMBA022929 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 29x29mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

Contextual Info: BGA 119 Pin NP276 Series CHARACTERISTICS Insulation Resistance 100MQ or more at 100VDC Withstanding Voltage Contact Resistance 100VAC for one minute 30mQ or less at 10mA, 20m V (initial) 40°C ~ +I50CC Operating Temperature ORDERING PROCEDURE NP276-119 04-*

SG-BGA-6210

Contextual Info: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer

PA-PGA181-02W

Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
Contextual Info: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for

CMBA023535

Abstract: BGA 15X15 35x35 bga
Contextual Info: Model : CMBA023535 Series For 35x35 Chip set BGA Heat Sink CMBA023535 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 35x35mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: Black Anodize 4.Chip set package thickness and clip color

SF-PLCC84-J-01

Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
Contextual Info: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.