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SG-BGA-7099
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Ironwood Electronics
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High Density GHz BGA Sockets; Max Pincount: 225; Top Pitch (mm): 0.5; IC Array X: 15; IC Array Y: 15; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1; IC Size X (mm): 8; IC Size Y (mm): 8; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.18; IC Ball Height Max (mm): 0.28; IC Ball Diameter Max (mm): 0.35; Max Package Code: BGA225; Part Description: GHz BGA Socket (ZIF)-HD |
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