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Catalog Datasheet	Type	Document Tags	PDF
CU1100 Abstract: BGA 15X15 CMBA054949 T725 Contextual Info: Model : CMBA054949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA054949 Series 1.Material : CU1100 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :	Original	CMBA054949 CMBA054949 CU1100 UL94-V0) 15x15 CU1100 BGA 15X15 T725	PDF

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CU1100

Abstract: BGA 15X15 CMBA054949 T725
Contextual Info: Model : CMBA054949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA054949 Series 1.Material : CU1100 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :

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CMBA054949 CMBA054949 CU1100 UL94-V0) 15x15 CU1100 BGA 15X15 T725

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