AU SN EUTECTIC Search Results

OPA9438EU

Abstract: 130um
Contextual Info: Infrared LED Chip OPA9438EU GaAs/GaAs 1. Material Substrate GaAs P Type Epitaxial Layer GaAs (N/P Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy (Au/Sn Eutectic Metal) Parameter Symbol Min 3. Electro-Optical Characteristics Forward Voltage VF

Contextual Info: Infrared LED Chip OPA9438EU GaAs/GaAs 1. Material Substrate GaAs P Type Epitaxial Layer GaAs (N/P Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy (Au/Sn Eutectic Metal) Parameter Symbol Min 3. Electro-Optical Characteristics Forward Voltage VF

Contextual Info: Infrared LED Chip OPA9437EU GaAlAs/GaAs 1. Material Substrate GaAs P Type Epitaxial Layer GaAlAs(N/P Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy (Au/Sn Eutectic Metal) Parameter Symbol Min 3. Electro-Optical Characteristics Forward Voltage VF

OPA9437EU

Abstract: Au Sn eutectic
Contextual Info: Infrared LED Chip OPA9437EU GaAlAs/GaAs 1. Material Substrate GaAs P Type Epitaxial Layer GaAlAs(N/P Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy (Au/Sn Eutectic Metal) Parameter Symbol Min 3. Electro-Optical Characteristics Forward Voltage VF

flux-eutectic

Abstract: UP78 silicon carbide LED Alpha Metals
Contextual Info: XBright & XThin® Au/Sn Die Attachment Recommendations XBright and XThin LEDs are the latest generation of solid-state light emitting diodes available from Cree. XBright and XThin chips use a geometrically shaped Epi-down chip design combined with InGaN epitaxy and Cree’s proprietary

CU-106A

Abstract: entek plus cu 106a anova general cross references TI Cross Reference Search HC373 Au Sn eutectic gold embrittlement
Contextual Info: Pb-Free Solder Joint Evaluation Contact Us Buy About TI TI Worldwide my.TI Advanced Search Keyword Part Number >> Semiconductor Home > Products > Digital Logic > Digital Logic Overview > Texas Instruments Palladium Lead Finish Pb-Free Solder Joint Evaluation

Fuse m1 250C

Abstract: SIEMENS b43471 B43991 SIEMENS b43405 B43876 B43875 m1 250c fuse B41684 epcos B43991 B43405
Contextual Info: Microwave Ceramics and Modules RF LTCC Filter for ISM 2.4 GHz Filter B69893K2457C101 Preliminary datasheet Features • Low Profile maximum height 0.9 mm Change History Revision Detail of change P1 First release Date 09.06.06 Author Stadler Contents Page 2

Contextual Info: V ishay I n tertech n o l o g y, I n c . AND TEC I INNOVAT O L OGY Vishay Electro-Films N HN CERAMIC THIN FILM LED PACKAGE O 19 62-2012 Resistors - Custom-Designed Packages LED Submounts Introduction LED die performance is extremely sensitive to temperature. As junction temperature

MF202

Abstract: Si3N4 AuSn eutectic eftec 45 SC-101 silicon carbide MgO Al2O3 Thermal conductivity coefficient properties fe -80 ni
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PROPERTIES OF PACKAGE MATERIALS 7. PROPERTIES OF PACKAGE MATERIALS Principal package material characteristics are shown in the following tables. Table 1 Case Material Characteristics Material Almina Alminum nitride Type Name

Alumina submount

Contextual Info: V i s h ay I n t e r t e c h n o l o g y, I n c . V ishay Ele c tro - Films l e d sub m o u n t s ceramic thin film led package p r o d uc t o v e r v i e w w w w. v i s h a y. c o m ceramic thin film led package Vishay Electro-Films Vishay Electro-Films: Ceramic Thin Film LED Package

Thin Film Resistors SiCr

Abstract: SiCr thin film TI SAC305 hfss 80Au-20Sn 3 to 10 GHz bandpass filter sac305 thermal conductivity 184394 ansoft SAC305 reflow bga
Contextual Info: AT C / / A V X T H I N F I L M TECHNOLOGIES Engineered Thin Film Solutions TA B L E O F C O N T E N T S Introduction to ATC // AVX Thin Film Technologies .1 - 2

C460XB290-0101-A

Abstract: C460XB290-0102-A C460XB290-0103-A C460XB290-0105-A C460XB290-S0100-A C527XB290-S0100-A OS4000
Contextual Info: G•SiC Technology XBright LEDs Cxxx-XB290-S0100-A Features • Applications XBright™ Performance • Outdoor LED Video Displays – 12.0 mW min Blue 460nm and 470nm • Automotive Dashboard Lighting – 7.0 mW min Green (527nm) • White LEDs •

Contextual Info: G•SiC Technology XBright® Plus LEDs CxxxXB290-S0100-A-Plus Features • • • Applications XBright® Plus Performance – 15.0 mW min Blue • Outdoor LED Video Displays • Automotive Dashboard Lighting Single Wire Bond Structure • White LEDs

Contextual Info: G•SiC Technology XBright® Plus LEDs CxxxXB290-S0100-A-Plus Features • Applications XBright® Plus LED Performance – 15.0 mW min Blue • Single Wire Bond Structure • Class II ESD Rating • Outdoor LED Video Displays • Automotive Dashboard Lighting

Contextual Info: G•SiC Technology XBright LEDs CxxxXB290-S0100-A Features • XBright Applications • Outdoor LED Video Displays LED Performance – 12.0 mW min Blue 460nm and 470nm • Automotive Dashboard Lighting – 7.0 mW min Green (527nm) • White LEDs • Single Wire Bond Structure

Contextual Info: RF & MICROWAVE CAPACITORS Single layer ceramic & MOS capacitors - Ceramic SINGLE LAYER CERAMIC & MOS CAPACITORS PRE LIM INA RY CERAMIC CAPACITORS Applications • • • • Microwave integrated components GaAs Integrated circuits RF/Microwave components

Contextual Info: G•SiC Technology XBright® LEDs Cxxx-XB290-S0100-A Features • Applications XBright® Performance – 12.0 mW min Blue • Outdoor LED Video Displays • Automotive Dashboard Lighting • Single Wire Bond Structure • Class II ESD Rating • White LEDs

Cxxx-XB290-S0100-A-Plus

Abstract: C460XB290-0105-A C460XB290-0106-A C460XB290-0107-A C460XB290-0108-A C470XB290-0105-A C470XB290-0106-A C470XB290-0107-A OS4000
Contextual Info: G•SiC Technology XBright® Plus LEDs Cxxx-XB290-S0100-A-Plus Features • Applications XBright® Plus Performance – 15.0 mW min Blue • Outdoor LED Video Displays • Automotive Dashboard Lighting • Single Wire Bond Structure • Class II ESD Rating

OC-106 94V0 C

Abstract: olin 7025 CDA 194 Tamac4 eftec 7025 alloy lead frame sn 8400 Au Sn eutectic thermal conductivity Eftec 64t
Contextual Info: 2 5 Physical Constants of IC Package Materials 1/16/97 3:41 PM CH05WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 5 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS The Table 5-1 through Table 5-5 list typical values for selected properties of materials used in

bond wire gold

Contextual Info: Package Details - SOT-223C Mechanical Drawing Lead Code: Part Marking: Full Part Number. Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R1 (5-November 2007)

olin 7025

Abstract: Tamac4 TAMAC-4 7025 alloy lead frame CDA 194 sn 8400 eftec eftec-64t C10B4 tamac
Contextual Info: CHAPTER 5 SELECTED PROPERTIES OF IC PACKAGE MATERIALS The following tables list typical values for selected properties of materials used in IC packages Table 5-1 Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units

olin 7025

Abstract: eftec MPA 68 Eftec 64t sn 8400 7025 alloy lead frame resistivity table eftec-64t tamac X10-4
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-3 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Alumina

olin 7025

Abstract: 7025 alloy lead frame CDA 194 X10-4 eftec-64t Eftec 64t resistivity table sn 8400 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-3 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units

mg 5473

Contextual Info: Package Details SOT-223C Case Mechanical Drawing Lead Code: Part Marking: Full Part Number Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm R2 (4-March 2010) w w w. c e n t r a l s e m i . c o m Package Details SOT-223C Case