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TURCK Inc RU130U-M18E-2UP8X2-H1151Ult; |Turck RU130U-M18E-2UP8X2-H1151 |
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TURCK Inc RU130U-M30M-2UP8X2-H1151Ult; |Turck RU130U-M30M-2UP8X2-H1151 |
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TURCK Inc RU130U-M30E-2UP8X2T-H1151Ult; |Turck RU130U-M30E-2UP8X2T-H1151 |
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TURCK Inc RU130U-M18E-2UP8X2T-H1151Ult; |Turck RU130U-M18E-2UP8X2T-H1151 |
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TURCK Inc RU130U-M30E-LIU2PN8X2T-H1151Ult; |Turck RU130U-M30E-LIU2PN8X2T-H1151 |
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130UM Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
OPB0604
Abstract: 839 transistor
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opb0604130um000lux2856k+3 | |
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Contextual Info: Silicon Photo Transistor OPB1104 1. Structure 1.1 Chip Size : 0.42mm X 1.17mm 1.2 Chip thickness : 280 20um 1.3 Metallization : Top - Al, Bottom - Au 1.4 Passivation : Silicon Nitride 1.5 Bonding Pad Size - Emitter : 130um - Base : 60um X 60um 1.6 Active Area : 0.31mm X 0.46mm |
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opb1104130um500ua | |
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Contextual Info: Silicon Photo Transistor OPB0604 1. Structure 1.1 Chip Size : 0.60mm X 0.45mm 1.2 Chip thickness : 220 30um 1.3 Metallization : Top - Al, Bottom - Au 1.4 Passivation : Silicon Nitride 1.5 Bonding Pad Size - Emitter : 130um : Emitter Electrode : Base Electrode |
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opb0604130um000lux2856k+1 | |
OPB1104Contextual Info: Silicon Photo Transistor OPB1104 1. Structure 1.1 Chip Size : 0.42mm X 1.17mm 1.2 Chip thickness : 280±20um 1.3 Metallization : Top - Al, Bottom - Au 1.4 Passivation : Silicon Nitride 1.5 Bonding Pad Size - Emitter : 130um - Base : 60um X 60um 1.6 Active Area : 0.31mm X 0.46mm |
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opb1104130um500ua | |
Crystal 32 MHz 12 pFContextual Info: PL610-6x 1.8V to 3.3V XO IC’s for 312.5kHz to 60MHz, with Standby FEATURES DESCRIPTION • Single IC to cover up to 60MHz output frequency. Direct oscillation operation Input Frequency: Fundamental crystal: o 10MHz to 60MHz Output Frequency: LVCMOS |
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pl610-6x60mhz10mhz40mhz+2 | |
marking xt 12
Abstract: MTC1
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25khz60mhz40mhzpl610-6x+2 | |
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Contextual Info: ED-016IRA AlGaAs/GaAs IrED Chips 940 nm Features : Typical Applications : • AlGaAs/GaAs wafer • Good spectral matched to si detector • High power • Low forward voltage • Remote Controller • Pperipheral Device • Photocoupler • Photointerrupter |
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ed-016ira130um370um280um+1 | |
880nmContextual Info: ED-216IR AlGaAs/AlGaAs IrED Chips 880 nm Features : Typical Applications : •N side up • Industrial Infrared Equipment Outline Dimensions : Unit: um 385 370 n-Electrode n-AlGaAs epi layer 385 n-Electrode 130 255 p-AlGaAs epi layer Emission area p-Electrode |
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ed-216ir130um370um255um+2 | |
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Contextual Info: NJU6221 Series PRELIMINARY 1.8V Operating Voltage Fundamental Quartz Crystal Oscillator IC with Input Tolerant Function !GENERAL DESCRIPTION The NJU6221 series is a C-MOS quartz crystal oscillator IC realized excellent frequency stability for fundamental up to |
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nju622160mhzf0/16f0/32+2 | |
OPA8535HNContextual Info: OPA8535HN Infrared LED Chip High Speed / N Side-Up GaAlAs/GaAlAs 1. Material Substrate GaAlAs P Type Removed Epitaxial Layer GaAlAs (N/P Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy 3. Electro-Optical Characteristics Parameter Symbol |
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opa8535hn--------------------130um | |
OPA8732HPContextual Info: OPA8732HP F Infrared LED Chip High Speed GaAlAs/GaAlAs 1. Material Substrate GaAlAs (N Type) Removed Epitaxial Layer GaAlAs (P/N Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy 3. Electro-Optical Characteristics Parameter Symbol Forward Voltage |
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opa8732hp--------------------130um | |
OPA6611Contextual Info: OPA6611 Red LED Chip N Side-Up GaAlAs/GaAs 1. Material Substrate GaAs P Type Epitaxial Layer GaAlAs(N/P Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy 3. Electro-Optical Characteristics Parameter Symbol Min Forward Voltage Typ Unit |
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opa661110mil12mil130um+1 | |
OPA9447Contextual Info: Infrared LED Chip OPA9447 GaAlAs/GaAs 1. Material Substrate Epitaxial Layer GaAs N Type GaAlAs(P/N Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy Parameter Symbol 3. Electro-Optical Characteristics Forward Voltage VF Min Reverse Voltage |
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opa9447100ma130um--------------------------11milx+1 | |
OPA9448
Abstract: 110MIL
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opa9448100ma130um--------------------------11mix+2 | |
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OPA8512HPContextual Info: OPA8512HP Infrared LED Chip High Speed GaAlAs/GaAlAs 1. Material Substrate GaAlAs N Type Removed Epitaxial Layer GaAlAs (P/N Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy 3. Electro-Optical Characteristics Parameter Symbol Forward Voltage |
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opa8512hp--------------------130um | |
OPA9433LTContextual Info: Infrared LED Chip OPA9433LT GaAs/GaAs 1. Material Substrate GaAs N Type Epitaxial Layer GaAs (P/N Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy 3. Electro-Optical Characteristics Parameter Symbol Min VF(1) Forward Voltage VF(2) Reverse Voltage |
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opa9433lt100ma--------------------130um | |
OPA9437EU
Abstract: Au Sn eutectic
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opa9437eu100ma14mil15mil+2 | |
OPA9443Contextual Info: Infrared LED Chip OPA9443 GaAlAs/GaAs 1. Material Substrate Epitaxial Layer GaAs N Type GaAlAs(P/N Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy Parameter Symbol 3. Electro-Optical Characteristics Forward Voltage VF Min Typ Max Unit |
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opa9443100ma130um--------------------------11mil | |
48MLP
Abstract: 48-LQFP-0707 H bridge driver sg FAN8702 FAN8702B FAN8702MP FAN8702MPX mobile phone camera 2 channel h-bridge motor driver "DC Drive" motor control IRIS
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fan8702/fan8702b/fan8702mpfan8702600ma48-lqfp-0707+9 | |
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Contextual Info: Infrared LED Chip OPA9433 GaAs/GaAs 1. Material Substrate GaAs N Type Epitaxial Layer GaAs (P/N Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy Parameter Symbol Min 3. Electro-Optical Characteristics Forward Voltage VF Reverse Voltage |
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opa9433100ma130um--------------------11mil | |
5053Contextual Info: 5053 series Crystal Oscillator Module ICs OVERVIEW The 5053 series are miniature crystal oscillator module ICs supported 80MHz to 170MHz fundamental oscillation mode. The Oscillator circuit stage has voltage regulator drive, significantly reducing current consumption and crystal current, compared with |
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80mhz170mhznd13016-e-015053 | |
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Contextual Info: Infrared LED Chip OPA9425AL GaAs/GaAs 1. Material Substrate GaAs Epitaxial Layer GaAs 2. Electrode N Cathode Side Gold Alloy P(Anode) Side Aluminum Alloy (N Type) (P/N Type) Parameter Symbol Min 3. Electro-Optical Characteristics Forward Voltage VF VR Reverse Voltage |
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opa9425al10mil130um | |
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Contextual Info: Infrared LED Chip OPA9428M GaAlAs/GaAs 1. Material Substrate Epitaxial Layer 2. Electrode N Cathode Side Gold Alloy P(Anode) Side Gold Alloy GaAs (N Type) GaAlAs(P/N Type) Parameter Symbol 3. Electro-Optical Characteristics Forward Voltage VF Min Reverse Voltage |
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opa9428m100ma130um--------------------------11m+1 | |
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Contextual Info: OPA8930HN Infrared LED Chip GaAlAs/GaAlAs High Speed / N Side-Up 1. Material Substrate GaAlAs P Type Removed Epitaxial Layer GaAlAs (N/P Type) 2. Electrode N(Cathode) Side Gold Alloy P(Anode) Side Gold Alloy 3. Electro-Optical Characteristics Parameter Symbol |
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opa8930hn--------------------130um | |