AMKOR MOLD COMPOUND Search Results

PCN0504

Abstract: EME-G700 SUMITOMO G700 SUMIKON EME-G700 SUMITOMO EME G700 MPM7128 EME-G700 datasheet G700 SUMItomo EME-G700 Sumikon
Contextual Info: PROCESS CHANGE NOTICE PCN0504 STANDARDIZED EME-G700 SERIES MOLD COMPOUND FOR QFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound in Altera’s quad flat pack QFP packages. All QFP packages assembled at ASE in Malaysia and Amkor in

ABLEBOND

Abstract: M28945-13 HC100 HC100XJAA M28945 Nitto mold compound 28237-12 M28950-13 Amkor mold compound
Contextual Info: August 7, 2009 CN 080709 Customer Notification Mold Compound Change Dear Valued Customer: This notification is for the purpose of informing you of a change to the mold compound material for the parts listed below. Purpose Amkor has notified Mindspeed that their supplier has discontinued the Cookson SMT-B1 and

R7181-38

Abstract: ablebond HC100 HC100XJAA mold compound Compound HC100-XJAA
Contextual Info: August 12, 2009 CN 081209 Customer Notification R7181-38 Mold Compound Change Dear Valued Customer: This notification is for the purpose of informing you of a change to the mold compound material for the R7181-38. Purpose Amkor has notified Mindspeed that their supplier has discontinued the Cookson SMT-B1 and

PCN0702

Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line

PCN0404

Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700
Contextual Info: PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera devices in thin quad flat pack TQFP 144 lead packages assembled by

PCN0414

Abstract: EME-G700 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND FOR TQFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound for the mold compound used in Altera’s Thin Quad Flat Pack TQFP packages. All

PCN0712

Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array

JEDEC Jc-11 free

Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap
Contextual Info: LAMINATE data sheet Package on Package PoP Family Bottom PoP Technologies: Features: After three years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA platform in the 4th quarter of 2004. The next four years saw many new

8361J

Abstract: mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700
Contextual Info: February 24, 2005 CN 022405 Customer Notification Assembly Subcontractor Change for QFP and PLCC Packaged Devices Dear Valued Customer: This notification is for the purpose of informing you of a change by Mindspeed Technologies in the packages used for the following devices:

Contextual Info: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a

Sumitomo G700K

Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Amkor Wafer level mold compound

Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
Contextual Info: LAMINATE data sheet PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. Features • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm standard ball pitch available other ball pitches available upon request, (e.g. 0.8mm

vFBGA* 96 bALL

Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
Contextual Info: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are

ABLEBOND

Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

TSOP 48 thermal resistance

Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Contextual Info: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate

l2aa

Abstract: tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound
Contextual Info: LAMINATE data sheet PBGA Features: • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm ball pitch available other ball pitches available upon request • 13 mm to 40 mm body sizes • Thin Au wire (0.5mil or Cu wire compatible • Large mold cap for quality enhancement

Contextual Info: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)

JEDEC Jc-11 free

Abstract: PSVFBGA Amkor Wafer level mold compound 1415B jedec package standards Amkor CSP mold compound PoP PACKAGE TESTING Die B3
Contextual Info: LAMINATE data sheet Package on Package PoP Family PSvfBGA Package Stackable Very Thin Fine Pitch BGA (PSvfBGA): After 3 years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of 2004. The next two years saw

PCN0512

Abstract: G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I SUMITOMO-G600 altera EPM7032S mold compound altera EPM7032B ep600i
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0512 IMPLEMENTING STANDARD SUMITOMO-G600 SERIES MOLD COMPOUND FOR PLCC PACKAGES Change Description: Altera will implement a standard Sumitomo-G600 series mold compound on its Plastic J-Lead Chip Carrier PLCC packages. All devices in PLCC packages assembled at ASE Malaysia

amkor CABGA 56

Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
Contextual Info: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,

joint filler board

Abstract: thick bga die size Amkor mold compound MS-034 amkor flip with or without underfill
Contextual Info: LAMINATE data sheet FCMBGA Thermal Performance: Flip Chip Molded Ball Grid Array FCMBGA Packages: FCMBGA packages are designed to allow die protrusion over the mold cap. This ensures the thinnest bond line and best thermal impedance between the FC die and the attached heat sink.

SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

Abstract: amkor
Contextual Info: service green packaging Green / Pb Free Technology Solution A combination of governmental legislation and consumer sentiment has driven the Electronics Industry in general and Semiconductor Packaging specifically to adopt more environmentally friendly materials and processes. Amkor is a leader in the

JEDEC MS-026

Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Contextual Info: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers

IPC-9701

Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
Contextual Info: LAMINATE data sheet FCMBGA Features Thermal Performance Flip Chip Molded Ball Grid Array FCMBGA Packages: Amkor’s flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, the