PCN0512
Abstract: G600 mold compound SUMITOMO g600 Nitto MP8000 EP1800I SUMITOMO-G600 altera EPM7032S mold compound altera EPM7032B ep600i
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0512 IMPLEMENTING STANDARD SUMITOMO-G600 SERIES MOLD COMPOUND FOR PLCC PACKAGES Change Description: Altera will implement a standard Sumitomo-G600 series mold compound on its Plastic J-Lead Chip Carrier PLCC packages. All devices in PLCC packages assembled at ASE Malaysia
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pcn0512sumitomo-g600mp8000epc1064+11epc1064vepc1213epc1441g600 mold compoundsumitomo g600nitto mp8000ep1800ialtera epm7032smold compoundaltera epm7032bep600i
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