AMKOR ELECTRONICS Search Results

laptop ic list

Abstract: NS6040 contactor Amkor Technology handler
Contextual Info: data sheet TEST CONTACTOR FusionQuad Test Contactor Test Hardware List: Amkor FusionQuad® Test Contactor: Amkor Technology is now offering the FusionQuad® Test Contactor Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective

CDIP

Abstract: glass frit electronics
Contextual Info: data sheet CERAMIC / HERMETIC CDIP / CerDIP Ceramic Dual-Inline Package CDIP / CerDIP Amkor Technology is committed to continuing to service this long established standard industry package. The Amkor Technology CDIP capability provides a wide range of lead counts and body

CERPAK

Abstract: glass frit electronics DS802
Contextual Info: data sheet CERAMIC / HERMETIC CerPak Ceramic Pack CerPak Amkor Technology continues to service this established industry package. The Amkor Technology CerPak capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The

MS-001

Abstract: MO-010 MS-011
Contextual Info: LEADFRAME data sheet PDIP Features: Plastic Dual In-Line PDIP Packages: Amkor is committed to continuing to service this long established standard industry package. The Amkor PDIP comes in a wide range of lead counts: from 8 - 48 leads with a lead pitch of

Contextual Info: data sheet CERAMIC / HERMETIC CQFP Ceramic Quad Flat Pack Package CQFP Amkor Technology is continuing to service this established industry package. The Amkor Technology CQFP capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The

MO-010

Abstract: MS-011 MS-001 MO-026
Contextual Info: LEADFRAME data sheet PDIP/SPDIP Features: Plastic Dual In-Line PDIP Packages: Amkor is committed to continuing to service this long established standard industry package. The Amkor PDIP comes in a wide range of lead counts: from 8 - 48 leads with a lead pitch of

MO-153

Abstract: MO-187 MO-194 PPF leadframe MO153 MO-153 Packages JEDEC MO-187 JEDEC MO-153 38 Amkor mold compound tssop
Contextual Info: LEADFRAME data sheet TSSOP Features: Thin Shrink Small Outline Package TSSOP : With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research

SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

Abstract: amkor
Contextual Info: service green packaging Green / Pb Free Technology Solution A combination of governmental legislation and consumer sentiment has driven the Electronics Industry in general and Semiconductor Packaging specifically to adopt more environmentally friendly materials and processes. Amkor is a leader in the

DS811

Contextual Info: data sheet CERAMIC / HERMETIC PPGA Plastic Pin Grid Array Package PPGA Amkor Technology incorporates the most advanced assembly processes for today and tomorrow's cost/performance applications. This IC package technology allows application and design engineers to optimize innovations while

HL832N

Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

nitto GE

Abstract: GE-100L nitto GE-100L Nitto GE 100 313 pin PBGA te2 219 Ablestik 2300 NITTO GE- 100L CO-029
Contextual Info: LAMINATE data sheet PBGA Features: Plastic Ball Grid Array PBGA : Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application

JEDEC MS-026

Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Contextual Info: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers

BGA 64 PACKAGE thermal resistance

Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect

E700G

Contextual Info: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

CPGA

Abstract: amkor "ceramic frit" CPGA Package design
Contextual Info: data sheet CERAMIC / HERMETIC CPGA Ceramic Pin Grid Array Package CPGA Amkor Technology is committed to continuing to service this long established standard industry package. This thru-hole package consists of a co-fired ceramic base that has a matrix of pins

cu pillar

Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

amkor

Abstract: amkor exposed pad
Contextual Info: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a

lqfp 7x7 tray

Abstract: MS-026 7X748LD amkor
Contextual Info: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers

DS812

Abstract: Side Brazed Ceramic Dual-In-Line Packages lead side brazed hermetic
Contextual Info: data sheet CERAMIC / HERMETIC Side Braze Side Braze SB Amkor Technology is committed to continuing to service this long established standard industry package. The SB package comes in a wide range of lead counts: from 8-48 leads with a lead pitch of 100 mil inches. This thru-hole package consists

amkor exposed pad

Abstract: exposed QFP 128 amkor exposed QFP 144
Contextual Info: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small

lqfp 64 Shipping Trays

Abstract: DS310H
Contextual Info: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging

CCL-HL832NX-A

Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
Contextual Info: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize

Amkor Wafer level mold compound

Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
Contextual Info: LAMINATE data sheet PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. Features • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm standard ball pitch available other ball pitches available upon request, (e.g. 0.8mm

l2aa

Abstract: tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound
Contextual Info: LAMINATE data sheet PBGA Features: • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm ball pitch available other ball pitches available upon request • 13 mm to 40 mm body sizes • Thin Au wire (0.5mil or Cu wire compatible • Large mold cap for quality enhancement