CDIP Search Results

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 23-Jun-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-9451301MPA ACTIVE CDIP JG

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9557401QCA ACTIVE CDIP J

JM38510/01405BEA

Abstract: SN54365A
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type 5962-9687802QEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type 5962-9687802QFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type 1 Package Drawing

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty SN54S134J ACTIVE CDIP J 16 SN74S134N OBSOLETE PDIP N 16 1 Lead/Ball Finish MSL Peak Temp (3) TBD Call TI

Contextual Info: SDLS042A - MAY 1983 - REVISED MAY 2005 A PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type 5962-9755301QCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type 5962-9755301QDA ACTIVE CFP W 14 1 TBD Call TI

max303

Contextual Info: SCOPE: PRECISION DUAL HIGH SPEED ANALOG SWITCHES Device Type 01 02 03 Generic Number MAX301M x /883B MAX303M(x)/883B MAX305M(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter JE LP Mil-Std-1835 GDIP1-T16 or CDIP2-T16

SN74LS09DR

Abstract: SN7409N
Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE LCCC FK 20 1 TBD Call TI Call TI 8001901CA ACTIVE CDIP J 14 1

2012 ics class X date sheet

Abstract: HCS32D HCS32DMSR HCS32HMSR HCS32K HCS32KMSR HCS32MS
Contextual Info: HCS32MS Radiation Hardened Quad 2-Input OR Gate September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14 TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg

HCS109MS

Abstract: CDFP4-F16 HCS109DMSR HCS109HMSR HCS109KMSR HCS109
Contextual Info: HCS109MS Radiation Hardened Dual JK Flip Flop September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg

HCS244DMSR

Abstract: HCS244HMSR HCS244KMSR HCS244MS
Contextual Info: HCS244MS Radiation Hardened Octal Buffer/Line Driver, Three-State September 1995 Features Pinouts 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T20 TOP VIEW • 3 Micron Radiation Hardened CMOS SOS • Total Dose 200K RAD (Si)/s

HCS164DMSR

Abstract: HCS164HMSR HCS164KMSR HCS164MS
Contextual Info: HCS164MS Radiation Hardened 8-Bit Serial-In/Parallel-Out Register September 1995 Features Pinouts • 3 Micron Radiation Hardened CMOS SOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)

CDFP4-F16

Abstract: HCS193DMSR HCS193HMSR HCS193KMSR HCS193MS
Contextual Info: HCS193MS Radiation Hardened Synchronous 4-Bit Up/Down Counter September 1995 Features Pinouts • 3 Micron Radiation Hardened CMOS SOS 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)

HCTS86D

Abstract: HCTS86DMSR HCTS86HMSR HCTS86K HCTS86KMSR HCTS86MS
Contextual Info: HCTS86MS TM Radiation Hardened Quad 2-Input Exclusive OR Gate October 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)

vw 9a engines

Abstract: ACTS373DMSR ACTS373HMSR ACTS373KMSR ACTS373MS
Contextual Info: ACTS373MS Radiation Hardened Octal Transparent Latch, Three-State April 1995 Features Pinouts 20 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T20, LEAD FINISH C TOP VIEW • 1.25 Micron Radiation Hardened SOS CMOS • Total Dose 300K RAD Si • Single Event Upset (SEU) Immunity

HCS00HMSR

Abstract: HCS00D HCS00DMSR HCS00K HCS00KMSR HCS00MS
Contextual Info: HCS00MS Radiation Hardened Quad 2-Input NAND Gate August 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14 TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg

HCS273KMSR

Abstract: HCS273 HCS273DMSR HCS273HMSR HCS273MS
Contextual Info: HCS273MS Radiation Hardened Octal D Flip-Flop September 1995 Features Pinouts • 3 Micron Radiation Hardened CMOS SOS 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T20, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg

HCS573DMSR

Abstract: HCS573HMSR HCS573KMSR HCS573MS
Contextual Info: HCS573MS Radiation Hardened Octal Transparent Latch, Three-State September 1995 Features • • • • • • • • • • • • • Pinouts 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T20, LEAD FINISH C TOP VIEW 3 Micron Radiation Hardened SOS CMOS

CDFP4-F16

Abstract: HCTS161ADMSR HCTS161AHMSR HCTS161AKMSR HCTS161AMS
Contextual Info: HCTS161AMS Radiation Hardened Synchronous Counter September 1995 Features Pinouts • 3 Micron Radiation Hardened CMOS SOS 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si) • Minimum LET for SEU Upsets: >100 MEV-cm2/mg

HCTS374DMSR

Abstract: HCTS374HMSR HCTS374KMSR HCTS374MS 107OC
Contextual Info: HCTS374MS Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered August 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T20 TOP VIEW • Total Dose 200K RAD (Si)

y6 smd

Abstract: Y5 smd transistor smd transistor y5 y4 smd transistor Y5 smd Y6 11 y6 smd transistor 5962F9671001VRC 5962F9671001VXC ACS541HMSR
Contextual Info: ACS541MS Radiation Hardened Octal Buffer/ Line Driver Three-State January 1996 Features Pinouts • Devices QML Qualified in Accordance with MIL-PRF-38535 20 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T20, LEAD FINISH C TOP VIEW • Detailed Electrical and Screening Requirements are Contained in

SNJ54121J

Abstract: sn74121 5962-9755301QCA 5962-9755301QDA SN54121J SN74121D SN74121DE4 SN74121DR SN74121DRE4 SN74121N
Contextual Info: SDLS042A - MAY 1983 - REVISED MAY 2005 A PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type 5962-9755301QCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC 5962-9755301QDA ACTIVE CFP W 14 1 TBD Call TI

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 JM38510/00903BCA OBSOLETE CDIP J 14 TBD Call TI Call TI JM38510/30605B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC Package Type Package Drawing Pins Package Eco Plan (2)

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty SN5454J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SN54LS54J ACTIVE CDIP J 14 1 TBD A42 SNPB

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type 5962-9558301QEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type 5962-9558301QFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type 5962-9558301QFA ACTIVE