FENI42 Search Results

FeNi42

Abstract: Cu6Sn5 sn-pb-ag solder paste
Contextual Info: Whisker Formation on Tin Plated FeNi42 Results and Conclusion 29 October 2004 Outline • Introduction • Experimental procedure and inspection • Results • Summary and Conclusions Introduction Major mechanism and conditions for whisker formation FeNi42

FeNi42

Abstract: whisker TSOP-II-54 "leadframe material" DIP
Contextual Info: 06-June-03 Back-Up Block 2 Whisker on NiFe Whisker on NiFe 06-June-03 Ambient storage tin plated FeNi42 length of longest whisker in µm 10 TSOPII-54 FeNi42 ambient storage 8 3,7 µm Sn 6,6 µm Sn 9,5 µm Sn 6 11,7 µm Sn 14,7 µm Sn 4 2 time in days 100

SIL03-1A72-71D

Abstract: FeNi42
Contextual Info: Europe: +49 / 7731 8399 0 | Email: info@meder.com Artikel Nr.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3303172171 Artikel: SIL03-1A72-71D Spulendaten bei 20 °C Spulenwiderstand Spulenspannung

SIL03-1A72-71L

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AgCu28

Contextual Info: CHAPTER 7 ENVIRONMENTAL INFORMATION page Introduction 7-2 Explanation of the tables 7-2 General safety remarks 7-5 Substances not used by Philips Semiconductors 7-6 Disposal and recycling 7-7 General warnings 7-7 Chemical content tables: Diodes Transistors

Cu6Sn5

Abstract: FeNi42 Infineon diffusion solder smema smema specifications transistor k81 leadframe materials olin 7025
Contextual Info: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics Abstract Electroplated tin layers as used as lead-free solderable finish on the terminations of semiconductor devices are

3at2

Abstract: MN102 PANASONIC pic writer
Contextual Info: MICROCOMPUTER MN102H MN102H60G/60K/F60G/F60K LSI User’s Manual Pub.No.22360-013E PanaX Series is a trademark of Matsushita Electric Industrial Co., Ltd. The other corporation names, logotype and product names written in this book are trademarks or registered trademarks of their

Infineon diffusion solder

Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
Contextual Info: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com

SIL05-1A7

Contextual Info: Europe: +49 / 7731 8399 0 | Email: info@meder.com Item No.: USA: +1 / 508 295 0771 | Email: salesusa@meder.com Asia: +852 / 2955 1682 | Email: salesasia@meder.com 3305100571 Item: SIL05-1A72-71MHR Conditions Coil Data at 20 °C Coil resistance Coil voltage

ALLOY leadframe C7025

Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Contextual Info: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,

FeNi42

Abstract: C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5
Contextual Info: Whisker Root Cause and Respective Test Conditions Dittes, M*.; Oberndorff, P*.; Crema, P.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com paolo.crema@st.com Abstract Electroplated Tin on leadframe components is the leadfree alternative to SnPb plating of widest use worldwide.

SIL03-1A72-71L

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UWE W22

Abstract: mn102 MN102H60 BF400 X1000 16x16 LED Matrix DM 311 BG 35 EW23 MN102H60K MN10200
Contextual Info: MICROCOMPUTER MN102H00 MN102H60G/60K/F60G/F60K LSI User's Manual Pub.No.22360-011E PanaXSeries is a trademark of Matsushita Electric Industrial Co., Ltd. The other corporation names, logotypes and product names written in this manual are trademarks or registered trademarks

UWE W22

Abstract: EW23 mn102 16x16 LED Matrix mark AT0 rs232c protocol MN10200 MN102H00 MN102HF55G 70an
Contextual Info: MICROCOMPUTER MN102H00 MN102H55D/55G/F55G LSI User's Manual Pub.No.22355-020E PanaXSeries is a trademark of Matsushita Electric Industrial Co., Ltd. The other corporation names, logotypes and product names written in this manual are trademarks or registered trademarks

sil24-1a72-71d

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sil05-1a72-71qhr

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3324190071

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C18070

Abstract: Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn FeNi42
Contextual Info: Whisker Formation on Tin Plated Cu based Leadframes Results and Conclusion 29 October 2004 Content • • • • • Introduction Experience E4 Main cause whisker growth on Cu LF Countermeasures Conclusions Introduction Period of potential whisker growth

On semiconductor date Code sot-143

Abstract: TR13
Contextual Info: Package Details - SOT-143 Mechanical Drawing Lead Code: Part Marking: 2-4 Character Alpha/Numeric Code. Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R2 (5-December 2003)

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TRANSISTOR SMD CODE PACKAGE SOT89 52 10A

Abstract: smd transistor g1-L philips ic06 cmos databook Soldering guidelines and SMD footprint design MSB430 Philips Components, Soft Ferrites Data Handbook M display dc05 humidity sensor philips H1 soft ferrites philips handbook Philips Components, Soft Ferrites Data Handbook
Contextual Info: SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii

SnPb36Ag2

Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100
Contextual Info: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation

CuCrSiTi

Abstract: k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability
Contextual Info: Solderability 06-June-03 Back Up Block 3 Solderability Solderability Source: STMicroelectronics 06-June-03 SO 8 Wetting force mN/mm No forced ageing Ageing : 16H150°C Good solderability of Sn coated components in SnPb Wetting balance test 235°C Zero cross time << 3 seconds

SIL24-1A72-71Q

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