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    Advanced Thermal Solutions Inc ATS-16H-150-C2-R0

    PUSH PIN HS ASMBLY,COARSE-PITCH,STRAIGHT - Trays (Alt: ATS-16H-150-C2-R0)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas ATS-16H-150-C2-R0 Tray 8 Weeks 25
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    • 100 $5.81
    • 1000 $5.81
    • 10000 $3.82
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    Sager ATS-16H-150-C2-R0 25
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    • 100 $5.87
    • 1000 $5.54
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    Kyocera AVX Components TPSB475K016H1500

    Surface Mount Tantalum Capacitor, 4.7 uF, 16 V, 1210 [3528-21 Metric], ? 10%, 1.5 Ohm, B Size Code - Tape and Reel (Alt: TPSB475K016H1500)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas TPSB475K016H1500 Tape & Reel 25 Weeks 16,000
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    RS TPSB475K016H1500 Bulk 15 Weeks 2,000
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    • 10000 $0.76
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    Kyocera AVX Components TRJB475K016H1500

    - Tape and Reel (Alt: TRJB475K016H1500)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas TRJB475K016H1500 Tape & Reel 25 Weeks 16,000
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    RS TRJB475K016H1500 Bulk 17 Weeks 2,000
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    • 10000 $0.67
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    Advanced Thermal Solutions Inc ATS-16H-150-C3-R0

    - Trays (Alt: ATS-16H-150-C3-R0)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas ATS-16H-150-C3-R0 Tray 8 Weeks 25
    • 1 -
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    • 100 $5.59
    • 1000 $5.59
    • 10000 $3.67
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    Sager ATS-16H-150-C3-R0 25
    • 1 -
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    • 100 $5.65
    • 1000 $5.33
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    Advanced Thermal Solutions Inc ATS-16H-150-C1-R0

    - Trays (Alt: ATS-16H-150-C1-R0)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas ATS-16H-150-C1-R0 Tray 8 Weeks 25
    • 1 -
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    • 100 $5.01
    • 1000 $5.01
    • 10000 $3.28
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    Sager ATS-16H-150-C1-R0 25
    • 1 -
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    • 100 $5.06
    • 1000 $4.78
    • 10000 $4.78
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    Find more 16H150 price and stock on Findchips.com

    16H150 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    CuCrSiTi

    Abstract: k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability
    Contextual Info: Solderability 06-June-03 Back Up Block 3 Solderability Solderability Source: STMicroelectronics 06-June-03 SO 8 Wetting force mN/mm No forced ageing Ageing : 16H150°C Good solderability of Sn coated components in SnPb Wetting balance test 235°C Zero cross time << 3 seconds


    Original     		06-June-03 16H150 10mN/mm 10seconds 06-Junitial CuCrSiTi k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability PDF

    SnPb36Ag2

    Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100
    Contextual Info: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation


    Original     		2002/95/E SnPb36Ag2 Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100 PDF

    SnPb36Ag2

    Abstract: J-STD-020B Lead Free reflow soldering profile BGA lead-free solder joint reliability thermal cycle Infineon diffusion solder FeNi42-leadframe reflow temperature bga bga thermal cycling reliability JSTD020B FeNi42
    Contextual Info: Lead-free packaging for semiconductor devices E3 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors June 2003 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation Moisture Sensitivity Level MSL statements


    Original     		2002/95/EC SnPb36Ag2 J-STD-020B Lead Free reflow soldering profile BGA lead-free solder joint reliability thermal cycle Infineon diffusion solder FeNi42-leadframe reflow temperature bga bga thermal cycling reliability JSTD020B FeNi42 PDF