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    16H150 Search Results

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    Kyocera AVX Components TPSB475K016H1500

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    DigiKey TPSB475K016H1500 Reel 14,000
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    Avnet Americas TPSB475K016H1500 Reel 25 Weeks 16,000
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    RS TPSB475K016H1500 Bulk 15 Weeks 2,000
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    TTI TPSB475K016H1500 Reel 2,000
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    Kyocera AVX Components TPSA685K016H1500

    CAP TANT 6.8UF 10% 16V 1206
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    DigiKey TPSA685K016H1500 Reel 20,000
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    Avnet Americas TPSA685K016H1500 Reel 25 Weeks 20,000
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    RS TPSA685K016H1500 Bulk 13 Weeks 2,000
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    Advanced Thermal Solutions Inc ATS-16H-150-C3-R0

    HEATSINK 35X35X25MM L-TAB T412
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    DigiKey ATS-16H-150-C3-R0 Bulk 25
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    Avnet Americas ATS-16H-150-C3-R0 Tray 8 Weeks 25
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    Mouser Electronics ATS-16H-150-C3-R0
    • 1 $6.65
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    Sager ATS-16H-150-C3-R0 25
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    Advanced Thermal Solutions Inc ATS-16H-150-C1-R0

    HEATSINK 35X35X25MM L-TAB
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    DigiKey ATS-16H-150-C1-R0 Bulk 25
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    Avnet Americas ATS-16H-150-C1-R0 Tray 8 Weeks 25
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    Mouser Electronics ATS-16H-150-C1-R0
    • 1 $5.98
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    Sager ATS-16H-150-C1-R0 25
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    Advanced Thermal Solutions Inc ATS-16H-150-C2-R0

    HEATSINK 35X35X25MM L-TAB T766
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    DigiKey ATS-16H-150-C2-R0 Tray 25
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    Avnet Americas ATS-16H-150-C2-R0 Tray 8 Weeks 25
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    Mouser Electronics ATS-16H-150-C2-R0
    • 1 $6.25
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    Sager ATS-16H-150-C2-R0 25
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    16H150 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    CuCrSiTi

    Abstract: k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability
    Contextual Info: Solderability 06-June-03 Back Up Block 3 Solderability Solderability Source: STMicroelectronics 06-June-03 SO 8 Wetting force mN/mm No forced ageing Ageing : 16H150°C Good solderability of Sn coated components in SnPb Wetting balance test 235°C Zero cross time << 3 seconds


    Original     		06-June-03 16H150 10mN/mm 10seconds 06-Junitial CuCrSiTi k75 leadframe "leadframe material" DIP 20 INFINEON cross reference FeNi42 solderability PDF

    SnPb36Ag2

    Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100
    Contextual Info: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation


    Original     		2002/95/E SnPb36Ag2 Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100 PDF

    SnPb36Ag2

    Abstract: J-STD-020B Lead Free reflow soldering profile BGA lead-free solder joint reliability thermal cycle Infineon diffusion solder FeNi42-leadframe reflow temperature bga bga thermal cycling reliability JSTD020B FeNi42
    Contextual Info: Lead-free packaging for semiconductor devices E3 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors June 2003 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation Moisture Sensitivity Level MSL statements


    Original     		2002/95/EC SnPb36Ag2 J-STD-020B Lead Free reflow soldering profile BGA lead-free solder joint reliability thermal cycle Infineon diffusion solder FeNi42-leadframe reflow temperature bga bga thermal cycling reliability JSTD020B FeNi42 PDF