MDIO clause 45 specification
Abstract: xaui marvell "reduced xaui" dune Marvell PHY Xilinx virtex rxaui marvell XGXS Marvell design guide marvell ethernet PHY transceivers Marvell PHY register map DS740
Contextual Info: LogiCORE IP RXAUI v2.3 DS740 April 24, 2012 Product Specification Introduction LogiCORE IP Facts Table The LogiCORE IP RXAUI core is a high-performance, low pin count 10 Gb/s interface intended to allow physical separation between the data-link layer and
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ds740mdio clause 45 specificationxaui marvellreduced xaui" dune+6marvell phy xilinx virtexrxaui marvellxgxsmarvell design guidemarvell ethernet phy transceiversmarvell phy register map
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mil-std 883d
Abstract: CAS140B k9 diode Keithley 2400 mil-std-202f Mil-Std-883D 0603LGCT SN60 DS74
Contextual Info: SURFACE MOUNT DEVICE LED Part No. : 0603LGCT REV:A / 01 PACKAGE OUTLINE DIMENSIONS Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm .004" unless otherwise noted. Features Top view, wide view angle, single color Chip LED. Package in 8mm tape on 7" diameter reels.
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0603lgctds-74-03-0008mil-std-202fmil-std-750d+8mil-std-883d10minsmil-std 883dcas140bk9 diodekeithley 2400sn60ds74
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E700G
Contextual Info: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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DS7409HGB
Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
Contextual Info: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of
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ds820cds7409hgbds7409hgfccsp+4ds-7409hghl832 nx-ahl832e700g
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AD 469
Abstract: SN60 AD469 471ad
Contextual Info: SURFACE MOUNT DEVICE LED Part No. : 0603JBCT REV:A / 03 PACKAGE OUTLINE DIMENSIONS Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm .004" unless otherwise noted. Features Top view, wide view angle, single color Chip LED. Package in 8mm tape on 7" diameter reels.
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L-C191LBCT
Abstract: AD 469 high power infrared led AD469 0603LBCT SN60 DS-74-03-0008 LC191
Contextual Info: SURFACE MOUNT DEVICE LED Part No. : 0603LBCT REV:A / 03 PACKAGE OUTLINE DIMENSIONS Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm .004" unless otherwise noted. Features Top view, wide view angle, single color Chip LED. Package in 8mm tape on 7" diameter reels.
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0603lbctds-74-03-0008mil-std-202fmil-std-750d+8mil-std-883d10minsl-c191lbctad 469high power infrared ledad469sn60lc191
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EN4900GC
Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
Contextual Info: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.
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pcn1-110704efm32g890f128j-std-020djesd22-a113+15jesd22-a104c/125jesd22-a103jesd22-a102jesd22-a110en4900gcnc7720cel9220hf10eme-g760leme-g760hl832nxayizbondhitachi en4900gccel9220ds-7409hg
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HL832N
Abstract: ELC4785 E679 DS7409 MO-298 amkor flip Amkor Technology HL832 MO-192 MO-195
Contextual Info: LAMINATE data sheet FlipStack CSP FlipStack® CSP: The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment
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cu pillar
Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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cu pillarflip chip substratehl832ds7409+6fccspamkor flipchiparray amkorhl832ncabga 48 7x7amkor cabga thermal resistance
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HL832N
Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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hl832nfccsphl832amkor csp mold compound+6cu pillaramkor cabga thermal resistancecabga 6x6flip chip bga 0,8 mmbga 64 package thermal resistanceamkor cu pillar
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Keithley 2400
Abstract: SN60
Contextual Info: SURFACE MOUNT DEVICE LED Part No. : 0603KRCT REV:A / 03 PACKAGE OUTLINE DIMENSIONS Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm .004" unless otherwise noted. Features Top view, wide view angle, single color Chip LED. Package in 8mm tape on 7" diameter reels.
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JIS for humidity test for touch screen
Abstract: Keithley 2400 light sensor 3 bin mil-std-202f method 208d 0603LWCT SN60 CAS140B DS-75-04-0012 555 "Application Note" led power
Contextual Info: SURFACE MOUNT DEVICE LED Part No. : 0603LWCT Features Extra thin 0.4mm, Top view, Wide view angle, Bluish White color SMD chip LED . Special for Cellular Phone keypad / LCD backlighting or thin touch button LED backlighting. Packing in 8mm tape on 7" diameter reels.
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0603lwctansi/eia-481-b-2001ds-75-04-0012device00+10mil-std-202fmil-std-750dmil-std-883djis for humidity test for touch screenkeithley 2400light sensor 3 binmil-std-202f method 208dsn60cas140b555 "application note" led power
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