C2727 Search Results

srf 1397

Contextual Info: C2727 REV A Product Description Common Mode Choke 4mH per winding A Customer Terminal #1 Indicator [12.70 MAX] 0.500 MAX EIA date code and lot code Component must insert fully to surface A. COEV C2727 XXXXX [13.97 MAX] 0.550 MAX [2.54 - 3.30] 0.100" - 0.130"

IT8511TE

Abstract: asus C5915 IT8511 C3923 J6801 c7319 R5707 T8-232 T2448
Contextual Info: 5 01 D C B A 4 Block Diagram 61 02 System Setting 62 USB CONN 03 * 63 * 04 04_CPU-Merom HOST 64 ISA ROM 05 05_CPU-Merom(PWR) 65 SPI ROM 06 * 66 LED 07 07_CRESTLINE(HOST) 67 * 08 08_CRESTLINE(DMI & CFG) 68 DC & BAT IN 09 09_CRESTLINE(GRAPHIC) 69 * 10 10_CRESTLINE(DDR2)

realtek alc660

Abstract: ALC660 F3J INVERTER CABLE asus RM04F M64-M ATI M64-M pt5737 QG82945PM MAC522
Contextual Info: 5 A * 02 System Setting 62 USB CONN 03 * 63 * 04 CPU-YONAH HOST 64 ISA ROM 05 CPU-YONAH(PWR) 65 * 06 * 66 LED 07 NB-945PM(HOST) 67 * 08 NB-945PM(DMI & CFG) 68 DC & BAT IN 09 NB-945PM(GRAPHIC) 69 * 10 NB-945PM(DDR2) 70 Debug CONN. 11 NB-945PM(PWR) 71 * 12

ISL9504

Abstract: b6886 PP3V42G3H NVIDIA G84m ISL9504BCRZ C8050 12v p66 apple k50 apple M75 MLB 820-2101 PP3V42
Contextual Info: 8 6 7 2 3 4 5 CK APPD OROYA 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. 1 REV ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE ? ? ? ? DATE ? 03/20/2007 - DVT

IT8511TE

Abstract: asus 6C720 AC_IN_OC 498C0 IT8511 R5538 ALC660 U5403 ICS9LPR363AGLFT
Contextual Info: 5 01 D B A 61 02 System Setting 62 USB CONN * 63 * 04 04_CPU-Merom HOST 64 ISA ROM 05 05_CPU-Merom(PWR) 65 SPI ROM 06 * 66 LED 07 07_CRESTLINE(HOST) 67 * 08 08_CRESTLINE(DMI & CFG) 68 DC & BAT IN 09 09_CRESTLINE(GRAPHIC) 69 * 10 10_CRESTLINE(DDR2) 70 Debug CONN.

LAD66A4

Abstract: PGA zif socket 478 electroless nickel MIL-STD-810 TX0547 TX0522ND 8815 k cts ocxo CTS ocxo 125 ocxo cts 03 transistor c4040
Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE ADHESIVE PEEL AND STICK HEAT SINKS 3 FORGED HEAT SINKS WITH PLATE FINS 4 FORGED HEAT SINKS WITH PIN FINS 6 CLIP AND TAPE STYLES 7 ZIF STANDARD CIRCUIT BOARD RETAINERS

Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS www.ctscorp.com CTS ® TABLE OF CONTENTS PAGE FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES

bga 7x7

Abstract: BDN21-3CB C2121M cts T412 0.3mm qfp
Contextual Info: CTS Series BDN Extruded Heat Sinks ADHESIVE PEEL AND STICK HEAT SINKS Technical Data ELECTRONIC COMPONENTS Adhesive Peel and Stick Aluminum Heat Sinks • Pre-applied adhesive − just peel off the release liner and press onto the component • With pre-applied adhesive, just peel

ITE IT8502E

Abstract: IT8502E R5U230 RT8206A SC8825 IT8301E 9LRS3197 D4802 ICS9LRS3197 MAX17028
Contextual Info: 5 4 SYSTEM PAGE REF. Content PAGE D C B 1 2 3 4 5 6 7 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 36 37 40 43 44 45 46 47 48 50 51 52 53 56 57 58 60 61 64 65 66 67 70 Block Diagram System Setting CPU 1 _DMI,PEG,FDI,CLK,MISC CPU(2)_DDR3 CPU(3)_CFG,RSVD,GND

LCD Inverter board A6J

Abstract: R2521 345 ce304 ASUS hy5ps561621afp-25 t5810 cpu Yonah-2M isl6227caz ISL6262CRZ A6J inverter board
Contextual Info: 5 4 3 2 1 A6J Block Diagram Power On Sequence PAGE 34,35 CPU VCORE SYSTEM PWR D FAN + SENSOR CPU YONAH-2M PAGE ? PAGE ? D PAGE 4 PAGE 2,3 BAT & CHARGER PAGE ? FSB 667MHz VGACore PAGE ? MCH-M Calistoga 945PM LVDS & INV PAGE 18 ATI M56P CLOCK GEN PAGE5 PCI-E 16X

zif rod

Contextual Info: – THERMAL MANAGEMENT PRODUCTS CATALOG www.ctscorp.com CTS TABLE OF CONTENTS PAGE HI-TEMP FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES 10 ZIF STANDARD CIRCUIT BOARD RETAINERS

0.3mm pitch BGA

Abstract: vme 3u board standards 4-40 Kapton Washer led matrix 16X16 c2929 rod 456 LAT03B5U PGA zif socket 478 t410 TRANSISTOR up3-to3-b
Contextual Info: THERMAL MANAGEMENT PRODUCTS CATALOG CTS ELECTRONIC COMPONENTS CTS Electronic Components - California CTS ® TABLE OF CONTENTS PAGE CORPORATE PROFILE 2 ADHESIVE PEEL AND STICK HEAT SINKS 3 FORGED HEAT SINKS WITH PLATE FINS 4 FORGED HEAT SINKS WITH PIN FINS

d7810

Abstract: L9141 MXM pinout U4900 J9002 K40 fet MARK G4 SOT363 Apple j9002 k50 apple ISL6269
Contextual Info: 8 6 7 2 3 4 5 1 CK APPD 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. M78-DVT REV ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE 33 503047 ENGINEERING RELEASED

panasonic C5622

Abstract: SR35-15 it8511te DT2801 panasonic c5904 it8511 F3Sc F3Sv asus c2874 f3sc
Contextual Info: 5 D Block Diagram 61 02 System Setting 62 03 * 63 * 04_CPU-Merom HOST 64 ISA ROM 05 05_CPU-Merom(PWR) 65 * 06 * 66 LED B 07_CRESTLINE(HOST) 08 08_CRESTLINE(DMI & CFG) 68 DC & BAT IN 09_CRESTLINE(GRAPHIC) 69 * 70 Debug CONN. 11 11_CRESTLINE(PWR) 71 * 12 12_CRESTLINE(PWR2)

345 ce304

Abstract: LCD Inverter board A6J R4104 A6Jc asus AC Dc mobile charger Inverter A6J C1541 C2625 T3916
Contextual Info: 5 4 3 2 1 A6J Block Diagram Power On Sequence PAGE 34,35 CPU VCORE SYSTEM PWR D FAN + SENSOR CPU YONAH-2M PAGE ? PAGE ? D PAGE 4 PAGE 2,3 BAT & CHARGER PAGE ? FSB 667MHz VGACore PAGE ? MCH-M Calistoga 945PM LVDS & INV PAGE 18 ATI M56P CLOCK GEN PAGE5 PCI-E 16X

F3J inverter board

Abstract: D9302 it8511te F3J inverter IT8511 a2051 asus c5121 00 F3J INVERTER CABLE Intel t9300
Contextual Info: 5 Block Diagram 61 02 System Setting 62 C * 63 * 04_CPU-Merom HOST 64 ISA ROM 05 05_CPU-Merom(PWR) 65 SPI ROM * 66 B A GDDR2 32Mx16 x4 07_CRESTLINE(HOST) 67 * 08 08_CRESTLINE(DMI & CFG) 68 DC & BAT IN 09 09_CRESTLINE(GRAPHIC) 69 * 10 10_CRESTLINE(DDR2) 70

IT8712F-A

Abstract: C4161 asus t6322 CE501 ITE8712 C2625 T6311 cm8562gi VP1010
Contextual Info: 5 4 3 2 A7T/M BLOCK DIAGRAM CPU CORE PWR D Dual Channel DDR2 DDR2 REV.F PAGE 61 1 01_BLOCK DIAGRAM 41_G73M_PCIEX16_1 02_AMD S1 CPU 1 42_G73M_PCIEX16_2 03_AMD S1 CPU(2) 43_G73M_DISPLAY 04_AMD S1 CPU(3) 44_G73M_BIOS&CRY 05_DDR2_SO_DIMM-1 45_G73M_GPIO 06_DDR2_SO_DIMM-2

IT8500E-L

Abstract: it8500e UP7711U8 JRST2001 EMB20N03V UP7714BMA5-00 IT8500 JMC251 parade ps8101 PCH Ibex Peak-M
Contextual Info: 5 4 3 2 1 K42F SCHEMATIC For BOM Rev1.0 Power VCORE Page 80 System D Page 81 BLOCK DIAGRAM D 1.5VS & 1.05VS Page 82 DDR & VTT Page 83 HDMI HDMI AMD PARK-XT-S3 DDR3 800/1066MHz CPU PCIE x16 ARRANDALE +2.5VS DDR3 SO-DIMM Page 84 Page 16~18 CRT CRT LVDS Page 70

ISL9504

Abstract: j4310 BD9828 ISL9504B NVIDIA G84m RN5VD30A-F SLG2AP101 Q7080 88E8058 PP3V42G3H
Contextual Info: 8 6 7 04/02/2007 Contents D Page TABLE_TABLEOFCONTENTS_HEAD TABLE_TABLEOFCONTENTS_ITEM TABLE_TABLEOFCONTENTS_ITEM TABLE_TABLEOFCONTENTS_ITEM TABLE_TABLEOFCONTENTS_ITEM TABLE_TABLEOFCONTENTS_ITEM TABLE_TABLEOFCONTENTS_ITEM TABLE_TABLEOFCONTENTS_ITEM TABLE_TABLEOFCONTENTS_ITEM

NPCE781BA0DX

Abstract: nuvoton NPCE781BA0DX 92HD79B1a5 92HD79B1 NPCE781 TPS51611 NPCE781B UP7534BRA8 npce781ba G7922R61U
Contextual Info: 5 4 3 2 1 D D Berry DG15 Discrete/UMA Schematics Document Arrandale Intel PCH C C 2010-02-03 REV : A00 DY :None Installed UMA:UMA platform installed PARK:DIS PARK platform installed M96:DIS M96 platform installed VRAM_1G:VRAM 128M*16 installed Colay :Manual modify BOM

ISL9504

Abstract: ISL9504B M75 MLB 820-2101 PP3V42G3H C8550 c7381 N8242 c5855 ISL9504 U7500 c3334 schematic diagram
Contextual Info: 8 6 7 2 3 4 5 CK APPD OROYA 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. 1 REV ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE ? ? ? ? DATE ? 03/20/2007 - DVT

AER19-19-12CB

Abstract: AER19-19-15CB APF19-19-06CB APF19-19-10CB APF19-19-13CB APF30-30-06CB
Contextual Info: Series AER Forged Heat Sinks CTS FORGED HEAT SINKS WITH PLATE FINS ELECTRONIC COMPONENTS Technical Data DESIGN FEATURES • Precision forging technology for high power applications • Designed A forluminum BGA and other surface mount with packages Forged

C2121M cts

Abstract: bdn10-3cba01 BDN21-3CB
Contextual Info: CTS Series BND Extruded Heat Sinks ADHESIVE PEEL AND STICK HEAT SINKS Technical Data ELECTRONIC COMPONENTS Adhesive Peel and Stick Aluminum Heat Sinks • Pre-applied adhesive − just peel off the release liner and press onto the component • With pre-applied adhesive, just peel

ISL6258

Abstract: Diode C1280 c1295 battery C2240 3A967 820-2179 U4900 u3150 OZ9956 g5551
Contextual Info: 8 6 7 2 3 4 5 1 CK APPD 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. REV ZONE ECN SCHEM,MLB,M82 PVT 11/14/2007 ENG APPD DESCRIPTION OF CHANGE DATE DATE