BGA35 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA352 package SOT581-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: E-BGA352-3535-1.27D4 Uniti nn - - H - - 1 April 2004

Contextual Info: BGA352-T-3535-1.27C4 Unit: nn X X c o in +i in c OJ uuuuuuuuuui rgg U U U U U U U U U U L T O = e ^ *-Q 0, 15 S ni . n 1. 27 0, 635 1, 625 i r i 1 A B C D E F G H J K L M N P R T U V V Y AAABACADAEAF 1 oooooiioooooi ooooooooooooí1 2 oooooooooooooooooooooooooo

Contextual Info: E-BGA352-3535-1.27D4

BGA352

Abstract: sot581
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A AF AE AC AA W U R N L J G E

SF-BGA352A-B-11

Contextual Info: D Package Code: BGA352A C 31.75mm [1.250"] 0.64mm [0.025"] typ. See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] typ. 31.75mm [1.250"] X 1.27mm [0.050"] Top View reference only 2 Ø 0.40mm [Ø 0.0156"] tooling hole X2 (optional)

SF-BGA357A-B-11

Contextual Info: D BGA357A C 22.86mm [0.900"] Ø 0.0156" tooling hole X2 See BGA pattern code to the right for actual pattern layout Y 22.86mm [0.900"] 1.27mm [0.050"] X Top View reference only 0.36mm [0.014"] dia. 2 0.66mm [0.026"] 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm [Ø 0.025"]

PAL 007 E

Abstract: PAL 007 c PAL 007 B PAL 007 A PAL 007 BGA356 LS-BGA356A-11 BGA-356
Contextual Info: BGA356A Tooling hole X2 Y See BGA pattern code to the right for actual pattern layout Ø 0.508mm pad 1.27mm 31.75mm Top View (reference only) X Variable 1 5.33mm [0.210"] 3.75mm [0.147"] 31.75mm 0.36mm±0.03mm 2 Top View of Land Pattern Scale: 2:1 Side View

353512

Contextual Info: P-BGA352-3535-1.27 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 3.90 TYP. 2/Oct. 28, 1996

Contextual Info: BGA352-T-3535-1.27D4 Unit: nn X X c o in +i in c OJ uuuuuuuuuui rgg U U U U U U U U U U L T O = e ^ *-Q 0, 15 S ni . n 1. 27 0, 635 1, 625 i r i 1 A B C D E F G H J K L M N P R T U V V Y AAABACADAEAF 1 oooooiioooooi ooooooooooooí1 2 oooooooooooooooooooooooooo

PBGA352

Abstract: BGA352 P-BGA-352 PBGA3523535
Contextual Info: P-BGA352-3535-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

tray datasheet bga

Abstract: JEDEC TRAY DIMENSIONS BGA-35
Contextual Info: TRAY CONTAINER UNIT : mm 3x8=24 135°C MAX A' 35.35 76.0 38.00 BGA35×35B 29.95 135.9 PPE A 35.35 38.00 24.50 266.0 315.0 322.6 SECTION A-A' (5.57) 7.62 (6.35) 35.35 35.00 Applied Package Quantity (pcs) 629-pin Plastic BGA (35×35) (FLIP CHIP TYPE) 24 MAX.

SF-BGA352B-B-11

Contextual Info: C Package Code: BGA352B D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"] dia pads

BGA356

Abstract: BGA-356 SF-BGA356A-B-11
Contextual Info: D Package Code: BGA356A C 31.75mm [1.250"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] X 31.75mm [1.250"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]

BGA352

Abstract: MS-034 ED-7311-9A
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA352: plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C AF AE AD AC AB AA Y W

LS-BGA352B-11

Contextual Info: Tooling hole X2 BGA352B Ø 0.0156" (2x) (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 25.00mm [0.984"] Top View (reference only) 1.00mm [0.039"] pitch typ. X Variable 0.508 mm [0.020"] dia pads 0.50mm [0.020"] 1 5.33mm [0.210"]

PRBG0352DA-A

Contextual Info: JEITA Package Code P-BGA352-35x35-1.27 RENESAS Code PRBG0352DA-A D MASS[Typ.] 3.6g A A D1 ZD A1 b S AB e ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 352F7X-A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

PBGA352

Contextual Info: P-BGA352-3535-1.27 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 3.90 TYP. 2/Aug. 12, 1996

Contextual Info: P-BGA352-P-3535-1.27 5 パッケージ材質 ボール材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Sn/Pb 3.90 TYP. 2 版/96.8.12

19X19

Contextual Info: Relative orientations for adapter assembly PGA A1 2.100" BGA A1 Motorola is a registered trademark of Motorola Inc. A1 0.100" typ. Top View 2.100" 1 0.466" 4 2 0.050" 3 0.145" (assembled) 0.270" Surface mount BGA emulator foot (included) (see SF-BGA357A-B-01 drawing for greater detail)

Lead Free reflow soldering profile BGA

Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
Contextual Info: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109

SAMSUNG MCP

Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Contextual Info: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)

Contextual Info: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised

IEC968

Abstract: Equator BSP-15 sad transistor A11b BSP-15-400 DRGB 001 A ac3 decoder toslink PAL to ITU-R BT.601/656 Decoder BSP15 BSP-15 IEC958
Contextual Info: Datasheet BSP-15 Processor Datasheet Equator Technologies, Inc. Revision H September 6, 2002 Document Number: HWR.BSP15.DS.REV.H Datasheet BSP-15 Processor Datasheet Revision H September 6, 2002 Copyright 2002 Equator Technologies, Inc. All rights reserved.