FINISH10 Search Results

Contextual Info: 0.650" 0.100" typ. 0.750" 1 3 0.421" 4 0.207" 0.050" typ. 0.472" 1 3 4 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;

DIP52

Abstract: C1494
Contextual Info: Top View 2.600" 1 2 3 0.900" Side View Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact

PA-QFE160SC-C-N-01

Contextual Info: 2.000" Socket holes 0.5 mm pitch 2.295" 0.100" pitch typ. 1 0.250" 3 0.128" 0.018"±0.002" typ. 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .

c1869

Abstract: sf 1020 ZIF pga 84
Contextual Info: 2.400" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

SOIC-08

Abstract: SOIC08 BOX21151
Contextual Info: RoHS COMPLIANT 0.400" 1 0.400" 0.100" typ. 1 Adapter PCB - Substrate: 2.38mm ±0.18mm [0.094" ±0.007"] per IPC 4101/21, silver surface finish. 2 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;

DIP14

Abstract: DIP-14
Contextual Info: 0.700" 0.200" 0.025" 0.088" 0.400" 0.125" 0.325" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact materialBeCu; finish 10µ" Au over 100µ" Ni (min.)

SF-QFE100SC-L-01

Contextual Info: 3 0.100 typ. 1.400 Top View 1.400 0.321 3 1 0.421" Plugged 2 0.250 1 Side View 0.5mm pitch 0.600 0.550 Bottom View (emulator foot only) 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 2 Pins: shell material- Brass; finish10µ" gold over 50µ" nickel (min.).

PLCC 32 TO DIP32 SOCKET pinout

Abstract: shell
Contextual Info: 0.700" PGA pin 1 RoHS COMPLIANT PLCC pin 1 1.600" 4 0.600" 0.554" 0.679" 1 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. RoHs HASL plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .

CA-QFE44SE-L-Z-T-01

Abstract: SF-QFE44SE-L-01
Contextual Info: 0.100 Typ. 2.000 Top View 2.500 3 1.2" assembled 1 2 See SF-QFE44SE-L-01 1 Side View 2 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact materialBeCu; finish 10µ" Au over 100µ" Ni (min.)

DIP08

Abstract: DIP-08 DIP08-01
Contextual Info: 0.400" 0.125" 0.025" 0.063" 0.400" 0.175" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. RoHS plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard;

DIP-16

Abstract: DIP16
Contextual Info: 0.800" 0.225" 0.025" 0.062" 0.500" 0.275" 0.475" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

CA-SOJ40A-S-P-01

Contextual Info: 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 4 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

PA-QFE128SD-P-S-01

Abstract: QFE128SD
Contextual Info: 1.400" 0.4mm pitch 0.670" 1.400" 0.550" Top View 1 0.250" 3 0.128" 2 0.100" typ. Side View 0.018" dia. typ. Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .

SF-QFE128SA-L-01

Contextual Info: Pin 1 0.8mm pitch 1.190" 1.090" Sqr. Sqr. PAD DETAIL 32x.8mm=25.6mm dia.0.018"±0.001" 0.050" 0.018" 0.050" 2 0.008" rad. 0.250" 3 1 A 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. .

dip16

Abstract: DIP-16
Contextual Info: 0.800" 0.225" 0.025" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

Contextual Info: RoHS COMPLIANT 15.2mm [0.600"] 17.8mm [0.700"] 1 2.54mm typ. Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] per IPC 4101/21, RoHS finish. 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard;

CA-QFE80RB-L-D-T-01

Abstract: 08mm
Contextual Info: Top View 1.800" 2.100" 2 Side View 1 1.100" 0.688" 3 0.8mm Pitch 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 0.870" 2 Pins: shell material- Brass; finish- 10µ" gold over 50µ" nickel min. . 3 Pins: shell material- Brass; shell finish10µ" Gold over 50µ" Nickel (min.). Contact

PLCC-20

Contextual Info: 0.550" 0.550" 3 0.421" 4 0.386" 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Ni min. . Contact material- BeCu; finish 10µ" Au over 100µ" Ni (min.) 4 Leads: material- BeCu Alloy 194; plating- 60/40 SnPb (150-400µ") Description: Package Converter (PC)

Contextual Info: 1.000" 1.600" 1 0.900" 0.297" 0.173" 3 0.018" 0.600" 2 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

Contextual Info: 0.500" 1.200" 1 0.400" 0.297" PC-DIP/DIP24-05 0.173" 2 0.300" PC-DIP/DIP24-05W 0.200" 0.700" 0.4" Female-0.3" Male End Views 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;

DIP28

Contextual Info: 1.400" 0.375" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

DIP32 package

Abstract: DIP32
Contextual Info: 1.600" 0.425" 0.030" typ. 0.400" 0.175" 0.375" 1 Substrate: 0.097"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

DIP40

Abstract: DIP-40 pc 525
Contextual Info: 2.000" 0.525" 0.025" 0.163" 0.700" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;

CA-SO20A-Z-M-T-01

Contextual Info: 1 Top View 0.895" 1.062" 0.295" 1.000" 0.406" 1.604" 5 0.649" 0.412" 3 0.229" 0.200" Side View End View 1 3 5 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil min. . Contact material- BeCu;