416c256
Abstract: j5021
Contextual Info: 1 2 3 4 5 6 7 8 BANK 0 2 MB 9 AA[0.8] AA[0.8] 9 VMD[0.63] VMD[0.63] +5V 2 1 (-CASAH) (-CASAL) GND 16 17 18 19 22 23 24 25 26 15 11 12 30 13 14 27 28 29 21 35 40 GND DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 2 3 4 5 7 8
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416c256soj40a10p/na0603b+6vmd10vmd11vmd12vmd13vmd14j5021
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MITAC schematic
Abstract: mitac 5033 Trident Cyber9385 CCS C TOUCHPAD CIRCUIT CLPD6701 MITAC SO-DIMM 144-pin trident schematic keyboard and touchpad schematic ha7 msd
Contextual Info: 5033 Circuit Diagram Index Table Sheet# 01 02 03 04 05 06 07 08 09 10 11 12 13 Description Jumper Settings CPU MTXC Cache Memory Clock Synthesizer and Driver PIIX4 Primary IDE and G.Pad Connector Trident 9385 Video Memory Bank 0 LCD Connector PCMCIA Controller
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ess1869sw501-1vmd43vmd44+16vmd45vmd46vmd47vmd48vmd49------------------------------------vmd50mitac schematicmitac 5033trident cyber9385ccs c touchpad circuitclpd6701mitacso-dimm 144-pintrident schematickeyboard and touchpad schematicha7 msd
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CA-SOJ40A-S-P-01
Contextual Info: 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. . 3 4 Pins: shell material- Brass Alloy 360 1/2 hard; finish10µ" Au over 50µ" Nil (min.). Contact material- BeCu;
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fr4/g10finish10soj40aca-soj40a-s-p-01 |
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PA-PGA181-02W
Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
Contextual Info: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for
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12x12mmfr4/g10pa-pga181-02wpa-so42-s-01+8actel 14100bga169cpa-pga68-01ax 6001 mp3pa-qip90-01pa-plcc84-02intel 82310pa-pga301-01
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SO14E
Abstract: so8b so6a SO24C so8e so48 SO34A SO16E Package SO8C SO36B
Contextual Info: Ironwood Electronics Appendix D AP-D.1 APPENDIX D SOIC Chip Package Specifications: • SOIC with Gull Wing Leads . . . . . . . . . . . . . .page AP-D.2 thru AP-D.5 • SOIC with J-Leads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .page AP-D.6
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so10asoj28csoj28dsoj30a+16soj32asoj32bsoj32csoj36asoj36bsoj40aso14eso8bso6aso24cso8eso48so34aso16e packageso8cso36b
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KD-59
Abstract: KTG1 bu 5027 KD41 trident vga D29170 kd2s hsmc connector
Contextual Info: î g p f* T i g 6H - o F f c t t J u J A P - ECÓ a ppr q t JX T R E S E R V E EXTRA FDD CONN. M O D I F Y POWER PLANE F O R POS REMOVE ON-BOARD DIKH SOCKET CH AN GÉ POWER OF RESÜME WEL L C O R R E C T DRAWING E X P A N D V R A M T O 4M O N - B O A R D
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OCR Scan
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t3384ea\/70tc144w0603b+10pwa-5027/msd411664900001kd-59ktg1bu 5027kd41trident vgad29170kd2shsmc connector
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CA-SOJ40A-S-J-01
Contextual Info: 25.91mm [1.020"] 12.07mm [0.475"] Top View 1 7.62mm [0.300"] 3 13.30mm[0.524"] assembled 2 4 9.28mm [0.366"] 0.43mm typ. [0.017"] 1.27mm typ. [0.050"] Side View End View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2
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