6X6 MLP Search Results

IPC-SM-7525A

Abstract: ipc 610D IPC-7525 J-STD-001C IPC-4101B entek ht plus JSTD001D 7525A smt j-std-001d IPC610D
Contextual Info: AN-9048 Assembly Guidelines for Fairchild’s 6x6 DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 6x6 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its

vo3120

Abstract: igbt induction stove 40v diode 6260 thermal MSS1P3U SMPS Solar Battery chargers VO3150A military passive component Vishay MKP 1848 VO3150
Contextual Info: Vishay Intertechnology, Inc. Super 12 Featured Products www.vishay.com/landingpage/super12/2010 S12 Super 12 Featured Products 597D and T97 Multi-Anode Tantalum Capacitors Industry’s First 75-V-Rated Tantalum Capacitors DrMOS 6x6 – SiC769 Industry-Best Power Density for Mainstream

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

QFN leadframe

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

AK08D300-CLCC

Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

SiC762CD

Abstract: SiC769 SiC769CD 300khz mosfet driver IC SiC762 SiC769A ISL6336A drMOs intel drMOS 2.0
Contextual Info: V i sh ay I n t e r t e ch n o l o g y, I n c . DrMOS The new Vishay Siliconix SiC769, SiC769A, and SiC762 integrated DrMOS solutions provide high-side and low-side n-channel MOSFETs plus a full-featured MOSFET driver IC, all in a single PowerPAK MLF6x6 package.

TGA2517

Abstract: TGA2540-FL TGA2573 TQM7M5013 TQP6M9002 tga2540 tqp340003 TQM726018 QFN28 6x6 TQM679002A
Contextual Info: May 2010 Product Selection Guide Amplifiers Control Products Filters Integrated Products Optical Components Connecting the Digital World to the Global Network Table of Contents ABOUT TRIQUINT SEMICONDUCTOR .2 GUIDE BY MARKET Automotive . 4

Contextual Info: 36 Pin to 40 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

ferite

Abstract: MLX80103 Melexis LIN Slave ICs LIN protocol J2602 J2602 Melexis LIN Melexis MLX80103
Contextual Info: Automotive ICs MLX80103 LIN Switch Slave Hall ICs This IC is a fully integrated LIN Slave for matrix switch or single switch Applications in automotive environment. It is suitable for bus systems according to LIN 2.0. Intelligent Drivers and Actuators The combination of physical layer LIN transceiver and LIN protocol

Contextual Info: 28 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

ISL6336

Abstract: SiC762CD intel drMOS 2.0 intel drMOS 1.0
Contextual Info: V I S H AY I N T E R T E C H N O L O G Y, I N C . Power ICs - DrMOS Solutions in a Single PowerPAK MLF6x6 Package AND TEC I INNOVAT O L OGY DrMOS N HN POWER ICs O 19 62-2012 SiC769/SiC769A/SiC762 Integrated DrMOS Power Stage The new Vishay Siliconix SiC769, SiC769A, and SiC762 integrated DrMOS solutions provide high-side

Contextual Info: 30 Pin to 32 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

Contextual Info: 30 Pin to 32 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:

ultra fast diode 5a 84v

Abstract: FDMF6730 MO-220 6X6 mlp SPM 1000 plus
Contextual Info: FDMF6730 Driver plus FET Multi-chip Module Features General Description Over 95% efficiency The FDMF6730 is a high efficiency Driver plus MOSFET power stage solution optimized for Ultra Mobile PC UMPC system power voltage supplies. It is fully compliant with the Intel UltraMobile Driver MOS (uDrMOS) Specification. The MOSFETs and

sky77528

Abstract: sky77534 SKY77526 SKY77705 SKY77548 SKY77542 SKY65404-21 SKY77544 SKY77701 AX508
Contextual Info: Product Selection Guide Fall 2010 Skyworks Solutions Skyworks Solutions, Inc. is an innovator of high reliability analog and mixed signal semiconductors. Leveraging core technologies, Skyworks offers diverse standard and custom linear products supporting automotive, broadband, cellular infrastructure, energy management,

sky77528

Abstract: SKY77344 SKY77531 sky77534 srf 3417 SKY77526 SKY73009-11 SKY77518 sky77524 SKY77519
Contextual Info: Product Selection Guide Fall 2009 Skyworks Solutions Skyworks Solutions, Inc. is an innovator of high reliability analog and mixed signal semiconductors. Leveraging core technologies, Skyworks offers diverse standard and custom linear products supporting automotive, broadband, cellular infrastructure, energy management,

AS3693B

Abstract: AS3693B1 as3992 AS3430 AS3693A AS3501 as3665 AS3900 AS3693 AS3931
Contextual Info: High Performance Analog IC Portfolio Overview June 2010 Product Portfolio austriamicrosystems is a global leader in the design and manufacture of high performance analog ICs, combining over 27 years of analog design capabilities and system know-how with its own state-of-the-art manufacturing

Contextual Info: FDMF6704 - XSTM DrMOS tm The Xtra Small, High Performance, High Frequency DrMOS Module Benefits General Description 1 Ultra compact size - 6 mm x 6 mm MLP, 44 % space saving compared to conventional MLP 8 mm x 8 mm DrMOS packages. The XSTM DrMOS family is Fairchild’s next-generation fullyoptimized, ultra-compact, integrated MOSFET plus driver power

Contextual Info: FDMF6704A - XSTM DrMOS The Xtra Small, High Performance, High Frequency DrMOS Module tm Benefits General Description 1 Ultra compact size - 6 mm x 6 mm MLP, 44 % space saving compared to conventional MLP 8 mm x 8 mm DrMOS packages. 1 Skip mode SMOD [low side gate turn off] input.

LIN bus can gateway

Abstract: TH8100 diode matrix rom KL15 diode matrix rom 4 x 4 20 KV capacitor bank wiring
Contextual Info: TH8100 LIN Slave Controller for Switches Features o LIN-Protocol Controller based upon the LIN protocol specification 1.3 - o MLX4 Dual Task MCU LIN-Transceiver based on the LIN protocol specification 1.3 - Slew rate control - Transmission speed up to 20kb/s

s2083

Abstract: PQFN IPC-SM-782 MO-220
Contextual Info: Surface Mount Instructions for PQFN Packages S2083 V6 Introduction The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder stencil

IPC-7527

Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Contextual Info: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2

Contextual Info: FDMF6730 Driver plus FET Multi-chip Module Features General Description 1 Over 95% efficiency The FDMF6730 is a high efficiency Driver plus MOSFET power stage solution optimized for Ultra Mobile PC UMPC system power voltage supplies. It is fully compliant with the Intel UltraMobile Driver MOS (uDrMOS) Specification. The MOSFETs and