JSTD001D Search Results

mil-prf-39006

Abstract: marking code M35 M35C336 M35C
Contextual Info: M35 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design Pb-free • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available Available RoHS* • Industry standard ratings COMPLIANT • Model M35 wet tantalum electrolytic chip capacitors

Contextual Info: M35 www.vishay.com Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available • Industry standard ratings • Model M35 wet tantalum electrolytic chip

Contextual Info: M35 www.vishay.com Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available • Industry standard ratings • Model M35 wet tantalum electrolytic chip

M34C1

Contextual Info: M34 www.vishay.com Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 F to 470 μF 6 V to 125 V, - 55 °C to + 125 °C

POWER33

Abstract: IPCA610D sac 305 IPC-SM-7525A J-STD-001C IPC-A-610D IPC-4101B FDMC8554 IPC-7525 FDMC2523P
Contextual Info: AN-9040 Assembly Guidelines for Power33 Packaging By Dennis Lang INTRODUCTION BOARD MOUNTING The Fairchild Power33 uses a flat leaded package to achieve SO-8 type performance in a form factor that is 70% smaller. This packaging technology has been increasingly used for power related

93026

Abstract: M34C1
Contextual Info: M34 www.vishay.com Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 F to 470 μF 6 V to 125 V, - 55 °C to + 125 °C

Wet Tantalum Capacitors

Abstract: tag 8739 TAG 8634 arcotronics 1.27.6 MT 8223 tag 8708 TAG 8643 castanet capacitor tag 8807
Contextual Info: v i s h ay i N T e R T e C h N O L O Gy, i N C . INTERACTIVE data book wet tantalum capacitors vishay vse-db0030-11F Notes: 1. To navigate: a Click on the vishay logo on any datasheet to go to the Contents page for that section. Click on the vishay logo on any Contents

Contextual Info: M35 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design Pb-free • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available Available RoHS* • Industry standard ratings COMPLIANT • Model M35 wet tantalum electrolytic chip capacitors

MIL-PRF-39006

Abstract: M35C106 M35C
Contextual Info: M35 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design Pb-free • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available Available RoHS* • Industry standard ratings COMPLIANT • Model M35 wet tantalum electrolytic chip capacitors

J-STD-005

Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently

IPC-SM-7525A

Abstract: ipc 610D IPC-7525 J-STD-001C IPC-4101B entek ht plus JSTD001D 7525A smt j-std-001d IPC610D
Contextual Info: AN-9048 Assembly Guidelines for Fairchild’s 6x6 DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 6x6 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its

Contextual Info: M35 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design Pb-free • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available Available RoHS* • Industry standard ratings COMPLIANT • Model M35 wet tantalum electrolytic chip capacitors

IPC-7525

Abstract: IPC-SM-7525A FDMF8705 QFN 52 8x8 footprint AN-9037 100C IPC610D JESD22-B102D J-STD-001C IPC-4101B
Contextual Info: AN-9037 Assembly Guidelines for 8x8 MLP DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 8x8 DriverMOS package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its

40106

Abstract: 40106 be M34C476 M34C1
Contextual Info: M34 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 µF to 470 µF 6 V to 125 V, - 55 °C to + 125 °C • Very low ESR

JESD22-B102D

Abstract: J-STD-002 ipc 610D ISO 1073-2
Contextual Info: Application Report SCEA038 – November 2007 Factors That Influence Side-Wetting Performance on IC Terminals Donald C. Abbott, Bernhard Lange, Douglas W. Romm, and John Tellkamp . ABSTRACT A designed experiment evaluated the influence of several variables on appearance and

ipc 610D

Abstract: IPC-SM-7525A IPC-7525 IPC610D JSTD001D Intel reflow soldering profile BGA IPC-4101B Lead Free reflow soldering profile BGA J-STD-001C IPC-A-610D
Contextual Info: Application Note AN9047 Assembly Guidelines for MicroFET-6 Packaging By Dennis Lang INTRODUCTION The Fairchild MicroFET-6 is a 2mm x 2mm package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related

ipc 610D

Abstract: IPC-7525 IPC-SM-7525A J-STD-001C 7525a AN9046 Intel reflow soldering profile BGA voids J-STD-001 IPC-4101B
Contextual Info: Application Note AN9046 Assembly Guidelines for Dual Power56 Packaging By Dennis Lang INTRODUCTION The Fairchild Dual Power56 package is based on Molded Leadless Packaging MLP technology. This technology has been increasingly used in packaging for power related products due to its

M34C1

Contextual Info: M34 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 µF to 470 µF 6 V to 125 V, - 55 °C to + 125 °C Pb-free Available

I 40106

Contextual Info: M34 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available Available RoHS* COMPLIANT • Very high capacitance, 10 µF to 470 µF 6 V to 125 V, - 55 °C to + 125 °C

not 40106

Abstract: M34C1
Contextual Info: M34 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 µF to 470 µF 6 V to 125 V, - 55 °C to + 125 °C • Very low ESR

C2556

Contextual Info: M35 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Molded surface mountable design Pb-free • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) available Available RoHS* • Industry standard ratings COMPLIANT • Model M35 wet tantalum electrolytic chip capacitors

J-STD-005

Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Contextual Info: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently

TB488

Contextual Info: Technical Brief 488 Authors: Mark Kwoka and Loyde Carpenter PCB Land Pattern Design and Surface Mount Guidelines for POL Modules Introduction Intersil's POL Module Product family offering a relatively new packaging concept that is currently experiencing rapid growth.

40106

Abstract: M34C106 40106 data sheet not 40106 DSCC93026 I 40106 40106 be m34 series Zss 34 MIL-STD-1276
Contextual Info: M34 Vishay Wet Tantalum Capacitors Surface Mount, Molded Case FEATURES • Terminations: standard tin/lead SnPb , 100 % tin (RoHS compliant) terminations available • Very high capacitance, 10 µF to 470 µF 6 V to 125 V, - 55 °C to + 125 °C • Very low ESR