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    682 FET Search Results

    682 FET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    OPA2137EA/250G4
    Texas Instruments Low Cost FET-Input Operational Amplifier 8-VSSOP Visit Texas Instruments Buy
    OPA2137EA/250
    Texas Instruments Low Cost FET-Input Operational Amplifier 8-VSSOP Visit Texas Instruments Buy
    OPA2137EA/2K5
    Texas Instruments Low Cost FET-Input Operational Amplifier 8-VSSOP Visit Texas Instruments Buy
    OPA131UJ
    Texas Instruments General Purpose FET-Input Operational Amplifiers 8-SOIC -55 to 125 Visit Texas Instruments Buy
    OPA137UA
    Texas Instruments Low Cost FET-Input Operational Amplifiers 8-SOIC -40 to 85 Visit Texas Instruments Buy
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    682 FET Price and Stock

    Vishay Intertechnologies

    Vishay Intertechnologies TNPW1206825RFETY

    Thin Film Resistors - SMD 825ohms 1% 25ppm
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics TNPW1206825RFETY
    • 1 $0.65
    • 10 $0.46
    • 100 $0.31
    • 1000 $0.24
    • 10000 $0.22
    Get Quote

    Vishay Intertechnologies TNPW1206825RFETA

    Thin Film Resistors - SMD TNPW-1206 825 1% T-9 RT1
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics TNPW1206825RFETA
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.44
    Get Quote

    Vishay Intertechnologies TNPW120682K0FETA

    Thin Film Resistors - SMD TNPW-1206 82K 1% T-9 RT1
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics TNPW120682K0FETA
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.44
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    682 FET Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    TGA1152-EPU

    Abstract: TGA1152-SCC capacitors coefficient of thermal expansion 39dBm
    Contextual Info: Product Data Sheet March 19, 2001 13.75 - 15 GHz 2 Watt Power Amplifier TGA1152-SCC Key Features • • • • • • 0.5 um pHEMT Technology 34 dB Nominal Gain 33 dBm Nominal Pout @ Pin = 3 dBm OTOI 39dBm Typical Bias 7V @ 682 mA Chip Dimensions 1.390mm x 2.495mm


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    tga1152-scc39dbm390mm495mm+30007-inchtga1152-epucapacitors coefficient of thermal expansion PDF

    2sk682

    Abstract: k682 2SK683
    Contextual Info: blE D 44*ib2[]S DG13121 h31 IHIT4 2SK682,2SK683 SILICON N-CHANNEL MOS FET HIGH SPEED POWER SWITCHING • FEATURES r • Low On-Resistance • • High Speed Switching Low Drive Current • • No Secondary Breakdown Suitable for Switching Regulator, DC-DC Converter


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    dg131212sk6822sk683k682 PDF

    2SK683

    Abstract: 2SK682 2SK68 DIODE 720
    Contextual Info: blE D 44^b20S 00131E1 L3L IHITM 2SK682,2SK683 SILICO N N -C H A N N E L MOS FET HIGH SPEED POWER SWITCHING • FEATURES • • • • • Low On-Resistance High Speed Switching Low Drive Current No Secondary Breakdown Suitable for Switching Regulator, DC-DC Converter


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    00l31e12sk6822sk683gd1312m+22sk68diode 720 PDF

    SMR 40000

    Abstract: SMR 60000 transistor pcr 606 j ic HD6433037F SCR IC CHIP block diagram induction heating h8 family Nippon capacitors PCR 606 J renesas tioca pwm
    Contextual Info: REJ09B0353-0300 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. 16 H8/3039 Group, H8/3039F-ZTAT


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    rej09b0353-0300h8/3039h8/3039f-ztattm16-bit+15h8/300hh8/3037hd6433037fhd64f3039fhd6433037tesmr 40000smr 60000transistor pcr 606 jic hd6433037fscr ic chipblock diagram induction heatingh8 familynippon capacitorspcr 606 jrenesas tioca pwm PDF

    SMR 40000

    Abstract: smr 40000 c ac din hfe nv SCHEMATIC circuit scr oscillator HD6433039F HD6433039TE HD64F3039F HD64F3039TE HD64F3039VF HD64F3039VTE
    Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    h8/3039h8/3039f-ztattmrej09b0353-0300smr 40000+9smr 40000 cac din hfe nvschematic circuit scr oscillatorhd6433039fhd6433039tehd64f3039fhd64f3039tehd64f3039vfhd64f3039vte PDF

    BF 998 marking code mow

    Abstract: HD64F7047 MB26 philips motor mb12 MB418 MB428 bosch 0 281 002 667 hall circuit transistor bosch 0 281 002 667 HD6437049 HD6437148
    Contextual Info: SH7046 Series SH7046 HD64F7046, HD6437148 SH7047 HD64F7047, HD6437049 Hardware Manual ADE-602-237 Rev. 1.0 3/8/2001 Hitachi, Ltd. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in


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    sh7046hd64f7046hd6437148sh7047+10hd64f7047hd6437049ade-602-237bf 998 marking code mowmb26philips motor mb12mb418mb428bosch 0 281 002 667hall circuit transistor bosch 0 281 002 667 PDF

    MB418

    Abstract: 18MB150 Hitachi DSAUTAZ006 TCFG Series mb1517
    Contextual Info: SH7046 Series SH7046 HD64F7046, HD6437148 SH7047 HD64F7047, HD6437049 Hardware Manual ADE-602-237 Rev. 1.0 3/8/2001 Hitachi, Ltd. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in


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    sh7046hd64f7046hd6437148sh7047+8hd64f7047hd6437049ade-602-237mb41818mb150hitachi dsautaz006tcfg seriesmb1517 PDF

    stk 681

    Abstract: stk 453 11-903 3105b 99-922.7
    Contextual Info: Befehls- und Meldegeräte 99 99 Befehls- und Meldegeräte Inhaltsübersicht Baureihe 99 Beschreibung Seite 673 Geräteaufbau Seite 674 Sortiment - Geräte Standard Einbau - Zubehör / Einzelteile 672 03.2000 Seite 675 Seite 680 Technische Daten Seite 684 Massbilder / Lochbilder / Bauteilelayouts


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    stk 681stk 45311-9033105b+199-922.7 PDF

    Contextual Info: FLU17XM L - B an d M edium & High Power GaAs FETs ABSOLUTE MAXIMUM RATINGS Ambient Temperature Ta=25°C Hem Symbol Condition Rating Unit Drain-Source Voltage Vd S 15 V Gate-Source Voltage vgs -5 V 7.5 w °c °c Total Power Dissipation Tc = 25°C PT Storage Temperature


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    fsx51x

    Contextual Info: FSX51X GaAs FET and HEMT Chips ELECTRICAL CHARACTERIST CS Am bient Temperature Ta=25°C Item Symbol Saturated Drain Current IDSS Condition Min. Limit Typ. Max. Unit Vos =3V, VGS =0V 30 60 120 mA Transconductance gm V d S = 3V, Id s =30mA 18 25 - mS Pinch-off Voltage


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    fsx51x PDF

    Contextual Info: FLU17XM L-Band Medium & High Power GaAs FETs FEATURES • High Output Power: P1dB=32.5dBm Typ. • High Gain: G1dB=13.5dB (Typ.) • High PAE: hadd=46% (Typ.) • Hermetic Metal/Ceramic (SMT) Package • Tape and Reel Available DESCRIPTION The FLU17XM is a GaAs FET designed for base station applications in the


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    flu17xmvds19 PDF

    GaAs FET HEMT Chips

    Abstract: 1756 N2 C-Band Power GaAs FET HEMT Chips 1060 fet FLC157XP 682 FET
    Contextual Info: FLC157XP GaAs FET & HEMT Chips FEATURES • • • • High Output Power: P1dB = 31.5dBm Typ. High Gain: G1dB = 6.0dB(Typ.) High PAE: ηadd = 29.5%(Typ.) Proven Reliability Drain DESCRIPTION Drain Gate The FLC157XP chip is a power GaAs FET that is designed for


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    flc157xpgaas fet hemt chips1756 n2c-band power gaas fet hemt chips+21060 fet682 fet PDF

    Contextual Info: FLC157XP GaAs FET & HEMT Chips FEATURES • • • • High Output Power: P1dB = 31.5dBm Typ. High Gain: G1dB = 6.0dB(Typ.) High PAE: ηadd = 29.5%(Typ.) Proven Reliability Drain DESCRIPTION Drain Gate The FLC157XP chip is a power GaAs FET that is designed for


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    flc157xp PDF

    20GHz

    Abstract: FLU17XM
    Contextual Info: FLU17XM L-Band Medium & High Power GaAs FET FEATURES • High Output Power: P1dB=32.5dBm Typ. • High Gain: G1dB=13.5dB (Typ.) • High PAE: ηadd=46% (Typ.) • Hermetic Metal/Ceramic (SMT) Package • Tape and Reel Available DESCRIPTION The FLU17XM is a GaAs FET designed for base station applications in the


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    flu17xm20ghz PDF

    Contextual Info: S M ELECTRONICS Samsung Microwave Semiconductor F - 0 3 1 1 0 G a in O p t Ì lT I Ì Z G C l GaAs FET 2-14 GHz Description Features The SM F-03110-200 is a packaged version of the SMF03100-200. The chip is a 300 |im n-channel MESFET with 0.5 nm gate length, utilizing Samsung Microwave’s gain


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    f-03110-200smf03100-200smf-03100-200g0171sfl PDF

    Contextual Info: - P 3 9-/ÎS Data sheet status Preliminary specification date of issue March 1991 BUK638-1000A/B PowerMOS transistor Fast recovery diode FET PHI L IP S I N T E R N A T I O N A L GENERAL DESCRIPTION N-channel enhancement mode field-effect power transistor in a


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    buk638-1000a/b7110fiebbuk638buk638-10ooa/b PDF

    K638

    Abstract: transistor S52 BUK638 DIODE 1000a fet 1000A
    Contextual Info: Philips Com ponents Data sheet status Prelim inary specification date of issue March 1991 BUK638-1OOOA/B PowerMOS transistor Fast recovery diode FET PHILIPS INTERNATIONAL GENERAL DESCRIPTION N -channel enhancem ent m ode field-effect pow er transistor in a


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    buk638-1000a/b0g44744buk638-1000a+8-1000bk638-1oooa/b711gfi5b04m74lk638transistor s52diode 1000afet 1000a PDF

    Contextual Info: FLU17XM L-Band Medium & High Power GaAs FET FEATURES • High Output Power: P1dB=32.5dBm Typ. • High Gain: G1dB=13.5dB (Typ.) • High PAE: hadd=46% (Typ.) • Hermetic Metal/Ceramic (SMT) Package • Tape and Reel Available DESCRIPTION The FLU17XM is a GaAs FET designed for base station applications in the


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    flu17xmfcsi0598m200 PDF

    Contextual Info: FLC157XP GaAs FET & HEMT Chips FEATURES • • • • High Output Power: P1dB = 31.5dBm Typ. High Gain: G1dB = 6.0dB(Typ.) High PAE: hadd = 29.5%(Typ.) Proven Reliability Drain DESCRIPTION Drain Gate The FLC157XP chip is a power GaAs FET that is designed for


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    flc157xpfcsi0598m200 PDF

    GaAs FET HEMT Chips

    Abstract: 1756 N2 FLC157XP
    Contextual Info: FLC157XP GaAs FET & HEMT Chips FEATURES • • • • High Output Power: P1dB = 31.5dBm Typ. High Gain: G1dB = 6.0dB(Typ.) High PAE: ηadd = 29.5%(Typ.) Proven Reliability Drain DESCRIPTION Drain Gate The FLC157XP chip is a power GaAs FET that is designed for


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    flc157xpfcsi0598m200gaas fet hemt chips1756 n2 PDF

    FLU17XM

    Contextual Info: FLU17XM L-Band Medium & High Power GaAs FET FEATURES • High Output Power: P-|C|g=32.5dBnn Typ. • High Gain: G-|C|g=13.5dB (Typ.) • High PAE: r iadd=46% (Typ.) • Hermetic Metal/Ceramic (SMT) Package • Tape and Reel Available DESCRIPTION The FLU17XM is a GaAs FET designed for base station applications in the


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    flu17xmfcsi0598m200 PDF

    Contextual Info: FLU17XM L-Band Medium & High Power GaAs FET FEATURES • High Output Power: P1dB=32.5dBm Typ. • High Gain: G1dB=13.5dB (Typ.) • High PAE: ηadd=46% (Typ.) • Hermetic Metal/Ceramic (SMT) Package • Tape and Reel Available DESCRIPTION The FLU17XM is a GaAs FET designed for base station applications in the


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    flu17xmfcsi0598m200 PDF

    FLC157XP

    Abstract: C-Band Power GaAs FET HEMT Chips fujitsu hemt fujitsu gaas fet
    Contextual Info: FLC157XP - GaAs FET & HEMT Chips FEATURES • • • • High Output Power: P-|<jB = 31.5dBm Typ. High Gain: G ^ b = 6.0dB(Typ.) High PAE: r i ^ d = 29.5%(Typ.) Proven Reliability DESCRIPTION


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    flc157xpfcsi0598m200c-band power gaas fet hemt chipsfujitsu hemt+1fujitsu gaas fet PDF

    FLU17XM

    Contextual Info: FLU17XM L-Band Medium & High Power GaAs FET FEATURES • High Output Power: P1dB=32.5dBm Typ. • High Gain: G1dB=13.5dB (Typ.) • High PAE: ηadd=46% (Typ.) • Hermetic Metal/Ceramic (SMT) Package • Tape and Reel Available DESCRIPTION The FLU17XM is a GaAs FET designed for base station applications in the


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    flu17xmfcsi0598m200 PDF