600MILWIDE Search Results
600MILWIDE Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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C2665
Abstract: C2668 7c26 C2662 C266 27C64 CY7C266 R1250 C2666
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cy7c266600-mil-widec2665c2668+6 | |
Signetics 27c64
Abstract: 27C64A 27C64A-12 27C64A-15 27C64A-20 27C64AI15 27C64AI20
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27c64a64k-bit536-bitsignetics 27c64+5 | |
CY7C263-35PC
Abstract: 7C261 CY7C263 CY7C26345DMB cerdip z PACKAGE 7C264 C261 CY7C261 CY7C264 f1b0
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cy7c261c263/cy7c2647c261300-mil+11 | |
CY7C185A-20LMB
Abstract: 7c186a CY7C186A-20DMB C105a CY7C185A CY7C186A-45DMB Y7C185 ZF78 CY7C185A-45LMB
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vi-23-cy7c185acy7c186at-46-23-12+8 | |
7c251
Abstract: a1s smd smd code A1s smd diode code A1s CY7C251 CY7C254 65WMB
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cy7c251cy7c2547c251300-mil+7 | |
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Contextual Info: CY7C251 CY7C254 CYPRESS SEMICONDUCTOR Features • CMOS for optimum speed/power • Windowed for reprogrammability • High speed — 45 ns 16,384 x 8 PROM Power Switched and Reprogrammable • TTL-compatible I/O • D irect replacement for bipolar PROMs • Capable o f w ithstanding > 2001V stat |
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cy7c251cy7c2547c251300-m+3 | |
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Contextual Info: ^ SS WS CYPRESS PRELIMINARY , .^= 131,072 x 8 Static R/W RAM SEMICONDUCTOR Features Functional Description • H ighspeed — tAA = 25 ns T h e CY 7C108 an d CY 7C109 are high-perform anceC M O S static R A M s organized as 131,072 w ords by 8 bits. Easy m em ory ex |
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7c1087c109cy7c109 | |
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Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS EEPROM DPE512S8N DESCRIPTION: The DPE512S8N is a 512K X 8 high-density, low-power EEPROM module comprised of four ceramic 128K X 8 monolithic EEPROM's, an advanced high-speed CMOS decoder and decoupling capacitors surface mounted on a co-fired ceramic substrate |
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dpe512s8n600-mil-wide32-pin300ns+1 | |
64150JContextual Info: CY27C64 ïj CYPRESS 8K x 8 EPROM Features • TTL-corapatible I/O • CMOS for optimum speed/power Functional Description • Windowed for reprogrammability • High speed — 70 ns commercial • Low power — 440 mW (commercial) — 530 mW (military) • Super low standby power |
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cy27c64600-mil-wide28-lead600-mil+2 | |
QP7C261-25LI
Abstract: GDFP2-F24 5962-9080307MJA QP7C261 CQCC1-N28 QP7C261-35QMB 5962-9080306MLA QP7C263-25JC QP7C264 QP7C261-25WMB
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qp7c261qp7c263qp7c264300-mil+10 | |
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Contextual Info: 86 CY7C186 8Kx8 Static RAM Features provided by an active LOW chip enable CE1 , an active HIGH chip enable (CE2), and active LOW output enable (OE) and three-state drivers. The device has an automatic power-down feature (CE1), reducing the power consumption by over 80% |
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cy7c186600-mil-wide32-pin | |
signetics 82s100
Abstract: 82S100 82S101 82S100/BXA Fuse-Programmable controllers Programmable Logic Array PBPT 40DIP6
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82s100/82s10116x48x882s10082s101+12 | |
7c186
Abstract: CY7C185-15VC die 7C185
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cy7c185cy7c186ad8192cy7c185--+3 | |
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Contextual Info: PA C 8 Megabit High Speed CM OS SRAM M i € R Ù S Y 'S-1 E M S DPS1MX8MKN3 DESCRIPTION: The DPS1.MX8MKN3 High Speed SRAM "STACK" devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ mounted on a co-fired |
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600-mil-wide32-pin | |
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SCN2681AC1A44
Abstract: SCN2681A pin configuration 74LS04 SCN2681 SCN2681AC1N24 SCN2681AC1N28 SCN2681AC1N40 SCN2681AE1A44 SCN2681AE1N24 SCN2681AE1N28
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scn268116-bitscn2681ac1a44scn2681a+7 | |
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Contextual Info: FTE512S8N 4 Megabit CMOS EEPROM DESCRIPTION: The FTE512S8N is a 512K X 8 high-density, low-power EEPROM module comprised of four ceramic 128K X 8 monolithic EEPROM’s, an advanced high-speed CMOS decoder and decoupling capacitors surface mounted on a co-fired ceramic substrate |
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fte512s8n600-mil-wide32-pin250ns | |
27c256-15
Abstract: 27C256-20
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27c256256k-bit27c256-1527c256-20 | |
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Contextual Info: D PS5 1 2 S8 P 512KX8 CMOS SRAM MODULE DESCRIPTION: T h e D P S 512 S 8P is a 5 1 2K X 8 high-density, low-power static RAM module comprised of four 12 8 K X 8 m o no lithic S R A M 's, an advanced high-speed C M O S d e co d er and deco up ling capacitors surface mounted on a co-fired ceramic |
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512kx8dps512s8p600-mil-wide32-pin+4 | |
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Contextual Info: DPS256S8AN Dense-Pac Microsystems, Inc. O HIGH SPEED MILITARY 256K X 8 CMOS SRAM MODULE ADVANCED INFORMATION DESCRIPTION: The DPS256S8AN is a high speed military 256K X 8 high-density, low-power static RAM module comprised of two high speed ceramic 128K X 8 monolithic |
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dps256s8an600-mil-wide32-pin30a036-31 | |
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Contextual Info: D EN SE-PA C 8 Megabit CMOS SRAM M I C R O S Y S T E M S DPS1MS8MP DESCRIPTION: The D PS1M S8M P is a IM eg x 8 high-density, low-power static RAM module comprised of two 512K x 8 monolithicSRAM's,an advanced high-speed CMOS decoder and decouplingcapacitors surface mounted on |
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600-mil-wide32-pin30a143-00 | |
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Contextual Info: □PM DPS256S8P Dense-Pac Microsystems, Inc. 256K X 8 CMOS SRAM MODULE O DESCRIPTION: The D P S256 S8P is a 256K X 8 high-density, low-power static RAM module comprised of two 1 2 8 K X 8 m o no lithic SR A M 's, an advanced high-speed C M O S d e co d er and deco upling |
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dps256s8p600-mil-wide32-pins256s8p+2 | |
LC 7258
Abstract: 7C266 203CE
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cy7c26632-pin28-lead600-mil+3 | |
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Contextual Info: PLUS405 Signetics Field-Programmable Logic Sequencer 16 x 64 x 8 Military Application Specific Products Signetics Programmable Logic Product Specification • Series 28 PIN CONFIGURATION DESCRIPTION FEATURES The PLUS405 device is a bipolar programmable state machine ol the Mealy |
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plus40528-pin600mil-wideplus405/bxa+2 | |
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Contextual Info: Product specification Philips Semiconductors Programmable Logic Devices Programmable logic sequencer 16x48x8 PLUS105-45 DESCRIPTION FEATURES The PLUS105-45 is a bipolar programmable state machine of the Mealy type. Both the AND and the OR array are userprogrammable. All 48 AND gates are |
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16x48x8plus105-45i0-11545mhz | |